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Specifications
Mfr. Part #:
MPP105J2GC090B200ZR
Package:
Through Hole,P=10mm
Key Attributes
Model Number:
MPP105J2GC090B200ZR
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitors (impregnated type) are designed for electronic equipment with epoxy encapsulation. These non-inductive capacitors feature a metallized polypropylene film construction with excellent self-healing properties, low loss, and minimal internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The capacitors are encapsulated with flame-retardant epoxy resin powder, ensuring durability and safety.
Product Attributes
- Brand: Chengxi Electronics ()
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Series: CBB21/MPP
- Construction: Non-inductive, metallized polypropylene film, wound
- Encapsulation: Flame-retardant epoxy resin powder
- Leads: Tinned copper wire or tinned copper-clad steel wire
- Internal Coating: Epoxy resin
- Certifications: RoHS compliant, REACH compliant, Halogen-free (if required)
Technical Specifications
| Specification | Details |
|---|---|
| Product Code | MPP105J2GC090B200ZR |
| Model Name | CBB21/MPP |
| Capacitance | 1F 5% |
| Rated Voltage | 400V.dc |
| Pitch (P) | 10 mm |
| Dimensions (W x H x T) | 9.2mm x 8.5mm x 4.5mm |
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40C to +105C (Voltage derating of 1.25%/C for +85C to +105C) |
| Rated Temperature | 85C |
| Capacitance Range | 0.001F to 6.8F |
| Capacitance Tolerance | 5% (J), 10% (K) |
| Rated Voltage (Available) | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc |
| Dissipation Factor (DF) (1kHz, 20C) | 0.0010 |
| Insulation Resistance | 30,000M for C0.33F (100VDC, 60s) 10,000M*F for C>0.33F (100VDC, 60s) |
| Dielectric Strength | 1.6 UR(VDC), 5 seconds |
| Maximum Pulse Rise Rate (dV/dt) | Refer to chart in source document for specific UR and P values. |
| Lead Diameter (for testing) | 0.6mm & 0.8mm |
| Internal Tinning Layer | Zinc-tin alloy wire |
| Lead Material | Tinned copper-clad steel wire |
| Outer Encapsulation Material | Flame-retardant UL94V-0 epoxy resin powder |
| Inner Box Dimensions (L*W*H) | 34.5cm * 23.5cm * 24.5cm |
| Outer Box Dimensions (L*W*H) | 49cm * 36cm * 27cm |
| Storage Temperature | Max 35C |
| Storage Humidity | Max 80% RH |
| Maximum Storage Time | 12 months (from production date) |
| Soldering Temperature (Wave Soldering) | TP 110C (120s), Ts 120C (45s) For P7.5mm, T4mm: < 4 seconds |
| Soldering Temperature (Soldering Iron) | Tip temperature 350C, time 3 seconds |
2512171500_DGCX-MPP105J2GC090B200ZR_C53190260.pdf
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