Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and tinned copper wire or tinned copper-clad steel wire leads. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, low internal temperature rise, and flame-retardant epoxy resin powder coating.
Product Attributes
- Brand: DGCX
- Product Type: CBB21/MPP Metallized Polypropylene Film Capacitor (Impregnated Type)
- Origin: Dongguan, Guangdong, China
- Encapsulation: Epoxy
- Construction: Non-inductive winding
- Lead Material: Tinned copper wire or tinned copper-clad steel wire
- Coating Material: Flame-retardant epoxy resin powder
- Environmental Compliance: RoHS, REACH, Halogen-free (if specified)
Technical Specifications
| Model | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) (1KHz) | Dimensions (mm) (L x W x H) | Pitch (P) (mm) | Lead Diameter (d) (mm) |
|---|---|---|---|---|---|---|---|
| MPP155J2GD090B2000R | 1.5 | 5% | 400 | 0.1% | 17.0 x 12.0 x 8.5 | 15.0 | 0.8 |
| CBB21/MPP | 0.001 to 6.8 | 5% (K), 10% (K) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | 0.0010 (1kHz, 20) | Refer to specific model dimensions | ||
| Specification | Technical Data |
|---|---|
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40 to +105 (with derating above 85) |
| Rated Temperature | 85 |
| Insulation Resistance | 30,000 M (C0.33uF) / 10,000 M*uF (C>0.33uF) (100VDC, 60s) |
| Withstand Voltage | 1.6 x UR(VDC), 5 seconds |
| Max Pulse Rise Rate (dV/dt) | Refer to chart in document (dependent on UR and lead pitch) |
| Lead Strength (Tensile) | 10N, 10 seconds (no visible damage) |
| Lead Strength (Bending) | 5N, 90 x 2 times (0.6 & 0.8mm wire) |
| Solderability | 95% tinning rate (2455, 2.50.5s) |
| Soldering Heat Resistance | No visible damage (2605, 101s) |
| Storage Temperature | Max 35 |
| Storage Humidity | Max 80% RH |
| Max Storage Time | 12 months (from production date) |
2504101957_DGCX-MPP155J2GD090B2000R_C42460061.pdf
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