Product Overview
The MMKP82 series is a box-type, double-sided metallized polypropylene film capacitor designed for high-frequency DC and pulse applications in electronic equipment. It features a non-inductive winding structure with metallized polyester and polypropylene films, tin-plated copper leads, and is encapsulated in flame-retardant plastic housing and epoxy resin. These capacitors are ideal for demanding applications such as switching power supplies, electronic ballasts, motor control, and TV vertical deflection circuits, offering low loss and minimal internal temperature rise.
Product Attributes
- Brand: DGCX
- Product Series: MMKP82
- Type: Double-sided metallized polypropylene film capacitor (Box type)
- Origin: Dongguan City Chengxi Electronics Co., Ltd.
- Encapsulation: Flame-retardant plastic shell (PBT, Grey) and flame-retardant epoxy resin (UL94V-0)
- Leads: Tin-plated copper wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Technical Specifications
Model: MMKP82
Product Code Example: B82223J3AC30GB2000R
Specific Model Example: MMKP82 0.022uF 5% 1000V.dc P=10 (W13xH12xT6)
General Electrical Characteristics
| Parameter | Specification | Notes |
|---|---|---|
| Operating Temperature Range | -40C to +105C | UR (dc): +85C to +105C: Derating factor 1.25%/C; UR (ac): +75C to +105C: Derating factor 1.35%/C |
| Climatic Category | 40/105/56 | |
| Rated Temperature | +85C | |
| Capacitance Range | 0.001F to 2.2F | |
| Capacitance Tolerance | G=2%; H=3%; J=5%; K=10% | |
| Rated Voltage (Vdc) | 250V, 400V, 630V, 1000V, 1600V, 2000V | |
| Dissipation Factor (DF) | 0.1% | at 1KHz, 20-25C |
| Insulation Resistance | 50000M for C0.33F; 10000M*uF for C>0.33F | at 100VDC, 60 seconds |
| Dielectric Strength | 1.6UR | 5 seconds |
| Max. Pulse Rise Time (dV/dt) | Refer to chart | Depends on rated voltage and pitch (P) |
Dimensions for Specific Model (Example: B82223J3AC30GB2000R)
| P/N | Cap (F) | Tol. % | R.V. VDC | DF (1KHz) % | W (0.5) mm | H (0.5) mm | T (0.5) mm | P (0.5) mm | L (2.0) mm | d 0.05 mm |
|---|---|---|---|---|---|---|---|---|---|---|
| B82223J3AC30GB2000R | 0.022 | 5 | 1000 | 0.1 | 13.0 | 12.0 | 6.0 | 10.0 | 20.0 | 0.6 |
Product Structure and Main Materials
| No. | Main Material | Description | Remark |
|---|---|---|---|
| 1 | Metallized Polypropylene Film / Metallized Polyester Film / Polypropylene Film | MPAT/MMPEA/PP | - |
| 2 | Sprayed Tin Layer | Zinc-tin alloy wire | - |
| 3 | Lead Wire | Tin-plated copper wire | - |
| 4 | Potting Material | Epoxy resin | Flame-retardant UL94V-0 |
| 5 | Outer Protective Material | PBT Plastic Shell (Grey) | Flame-retardant UL94V-0 |
Packaging Information
- Inner Box Dimensions: L*W*H = 34.5*23.5*24.5 cm
- Outer Box Dimensions: L*W*H = 49*36*27 cm
- Packaging includes: Manufacturer part number, number of packages and quantity per package, Lot No.
- Capacitors are packaged in transparent PVC bags for moisture and dust protection.
- RoHS environmental mark.
Storage Conditions
- Temperature: Max 35C
- Relative Humidity: Max 80%
- Storage Time: Maximum 12 months from the production date marked on the packaging bag.
- Avoid prolonged exposure to air, which can degrade lead solderability.
- Do not store in high temperature or high humidity environments.
Environmental Characteristics
- Compliant with RoHS requirements.
- Compliant with REACH requirements.
- Compliant with Halogen-free requirements (if specified).
Product Electrical Characteristics and Test Conditions
General Test Conditions: Ambient temperature: 15C35C, Relative humidity: 25%75%. For disputed results: Ambient temperature: 202C, Relative humidity: 60%70%.
| No. | Item | Characteristic | Test Method |
|---|---|---|---|
| 1 | Terminal Strength | Tensile Strength, Bending Strength | Tensile: 10N, 10s; Bending: 5N, 90x2 (for 0.6 & 0.8mm leads) |
| 2 | Solderability | Solder coverage rate | 95% on lead wire; Solder temp: 2455C, Immersion time: 2.50.5s |
| 3 | Soldering Heat Resistance | Appearance, DF increase, Capacitance change | Appearance: No visible damage; DF increase: 0.002; C/C: 3%; Solder temp: 2605C, Immersion time: 101s |
| 4 | Thermal Shock | Appearance | -40C to +105C, 5 cycles, 30 min each |
| 5 | Vibration | Appearance | 0.75mm amplitude or 98m/s, 10-500Hz, 3 axes, 2h each |
| 6 | Shock | Appearance | 4000 shocks, 390m/s, 6ms pulse duration |
| 7 | Climate Sequence | Appearance, Capacitance change, DF increase, Insulation Resistance | Dry Heat (+105C, 16h), Cyclic Damp Heat (Test Db), Cold (-40C, 2h), Low Pressure (8.5kPa, 1h); C/C: 3%, DF increase: 0.003, IR/IR: 50% |
| 8 | Damp Heat (Steady State) | Appearance, Capacitance change, DF increase, Insulation Resistance | 90-95% RH, 402C, 56 days; C/C: 5%, DF increase: 0.002, IR/IR: 50% |
| 9 | Endurance | Appearance, Capacitance change, DF increase, Insulation Resistance | 85C, 1000h, 1.25UR applied; C/C: 5%, DF increase: 0.004, IR/IR: 50% |
| 10 | Characteristics Dependent on Temperature | Capacitance change vs. temperature | (Cb-Cd)/Cd: 0 to +3% at -40C; (Cf-Cd)/Cd: -4.0% to 0 at +105C |
| 11 | Charge/Discharge | Capacitance change, DF increase, Insulation Resistance | 10,000 cycles; C/C: 5%, DF increase: 0.005, IR/IR: 50% |
Usage Rules
- Operating Range: Do not exceed upper category temperature limit or maximum pulse current. Avoid overload.
- Handling: Avoid repeated squeezing at the lead root. Be cautious of lead tip sharpness.
- Soldering:
- Wave Soldering: TP110C (120s), Ts120C (45s). For P7.5mm, T4mm: < 4 seconds.
- Soldering Iron: Tip temperature 350C, time 3 seconds.
- Not suitable for reflow soldering.
- Ts: Maximum temperature of the component body during wave soldering.
- Tp: Maximum temperature the component body can withstand during the preheating stage.
Curves
- Effective Voltage vs. Frequency Characteristic Curve (Typical values at sinusoidal voltage, 85C ambient, T=10C internal temperature rise).
- Effective Current vs. Frequency Characteristic Curve (Typical values at sinusoidal voltage, 85C ambient, T=10C internal temperature rise).
2501151750_DGCX-B82223J3AC30GB2000R_C42444184.pdf
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