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Specifications
Mfr. Part #:
MKP564J2EC51GCB2000R
Package:
Through Hole,P=10mm
Key Attributes
Model Number:
MKP564J2EC51GCB2000R
Product Description
Product Overview
The CBB21B(R)/MKPH series are box-type metallized polypropylene film capacitors designed for coupling, decoupling, and filtering in electronic equipment, particularly for high-frequency DC pulse applications and Power Factor Correction (PFC) circuits. These capacitors feature a non-inductive winding structure, small size, and are encapsulated in a flame-retardant plastic case and epoxy resin, ensuring good dimensional consistency. They offer low loss and minimal internal temperature rise, making them suitable for switch power supplies in applications requiring DC blocking, filtering, coupling, and bypassing.
Product Attributes
- Brand: DGCX
- Product Series: MKPH
- Capacitor Type: Box-type Metallized Polypropylene Film Capacitor
- Construction: Non-inductive winding structure
- Encapsulation: Flame-retardant plastic case (PBT) and flame-retardant epoxy resin
- Leads: Tin-plated copper wire
- Internal Material: Metallized Polypropylene Film (MPPA)
- Plating Layer: Zinc-tin alloy wire
- Certifications: RoHS compliant, REACH compliant, Halogen-free (if required)
- Origin: Guangdong, China
Technical Specifications
| Product Code | Capacitance (uF) | Tolerance (%) | Rated Voltage (Vdc) | Dissipation Factor (DF) (1KHz) (%) | Dimensions (mm) (L x W x T) | Pitch (P) (mm) | Lead Diameter (d) (mm) | Case Color |
|---|---|---|---|---|---|---|---|---|
| MKP564J2EC51GCB2000R | 0.56 | 5% | 250V.dc | 0.1 | (W12 H16 T6) | 10 | 0.6 0.05 | Gray |
| Specification | Technical Specification | Standard |
|---|---|---|
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40 to +105 | |
| Rated Temperature | +85 | |
| Capacitance Range | 0.001F to 15F | |
| Capacitance Tolerance | 5% (J); 10% (K) | |
| Rated Voltage | 160Vdc/90Vac, 250Vdc/160Vac, 400Vdc/220Vac, 630Vdc/250Vac | |
| Dissipation Factor (tan ) | 0.1% (1KHz at 20~25) | |
| Insulation Resistance | 50000M for C0.33uF (100VDC, 60s) 15000M*uF for C>0.33uF (100VDC, 60s) | |
| Withstand Voltage | 1.6UR for 5 seconds | |
| Maximum Pulse Rise Rate (dV/dt) | See detailed table in source document for different UR values and pitches. |
| Test Item | Characteristic | Test Method |
|---|---|---|
| Terminal Strength | Tensile Strength | No visible mechanical damage. Load: 10N, Time: 10 seconds (for wire diameter 0.6 & 0.8mm) |
| Bending Strength | 5N, 90 x 2 times (for wire diameter 0.6 & 0.8mm) | |
| Appearance | No visible mechanical damage | |
| Solderability | Tinning Rate | 95% |
| Soldering Temperature | 2455 | |
| Immersion Time | 2.50.5 seconds | |
| Solder Heat Resistance | Appearance | No visible damage |
| Soldering Temperature | 2605 | |
| Immersion Time | 101 seconds. Recovery time 1-2 hours. | |
| Dissipation Factor Increase | 0.004 (C1.0F, 10kHz) 0.004 (C>1.0F, 1KHz) | |
| Capacitance Change | C/C3% | Initial Measurement |
| C/C5% | Final Measurement after tests | |
| Dissipation Factor Increase | 0.004 | Final Measurement after tests |
| Insulation Resistance | IR/IR50% | Final Measurement after tests |
| Temperature Cycling | Appearance | No visible damage |
| (A=-40, B=+105, 5 cycles, t=30min) | ||
| Vibration | Appearance | No visible damage |
| (Amplitude 0.75mm or acceleration 98m/s, frequency 10-500Hz, 3 directions, 2h each, total 6h) | ||
| Shock | Appearance | No visible damage |
| (4000 times, acceleration 390m/s, pulse duration 6ms) | ||
| Damp Heat Cyclic | Appearance | No visible damage |
| Capacitance Change | C/C5% | |
| Dissipation Factor Increase | 0.005 | |
| Steady State Damp Heat | Appearance | No visible damage |
| Capacitance Change | C/C5% | |
| Dissipation Factor Increase | 0.002 | |
| Endurance | Appearance | No visible damage |
| Capacitance Change | C/C8% | |
| Dissipation Factor Increase | 0.004 | |
| Characteristics Dependent on Temperature | Capacitance at lower category temperature (-40) | 0(Cb-Cd)/Cd+3% |
| Capacitance at upper category temperature (105) | -4.0%(Cf-Cd)/Cd0 | |
| Charge and Discharge | Capacitance Change | C/C5% |
| Dissipation Factor Increase | 0.005 (10KHz, CR1.0uF); 0.005 (1KHz, CR>1.0uF) | |
| Insulation Resistance | IR/IR50% |
Usage Guidelines
- Do not exceed the upper category temperature.
- Avoid overload operation.
- Do not exceed the maximum pulse current.
- Avoid repeated squeezing at the lead root.
- Be cautious of lead tip sharpness.
- Soldering: When soldering, heat transfer through leads can affect the capacitor core. Observe temperature and time limits to prevent degradation or damage.
- Wave Soldering: TP110 for 120 seconds; Ts120 for 45 seconds. For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
- Lead-type film capacitors are not suitable for reflow soldering.
- Ts: Maximum temperature the capacitor body can withstand during wave soldering.
- Tp: Maximum temperature the capacitor body can withstand during the preheating stage.
Packaging
- Inner Carton Dimensions: 34.5 x 23.5 x 24.5 cm (L x W x H)
- Outer Carton Dimensions: 49 x 36 x 27 cm (L x W x H)
- Packaging includes: Manufacturer part number, number of packages and quantity per package, Lot No.
- Capacitors are packed in transparent PVC bags for moisture and dust protection.
- Includes RoHS environmental mark.
- Other customer marking requirements can be accommodated.
Storage Conditions
- Prolonged exposure to air may degrade lead solderability.
- Avoid high temperature and high humidity environments.
- Store under the following conditions (in original packaging): Temperature: Max 35, Relative Humidity: Max 80%.
- Storage Time: Maximum 12 months from the production date marked on the packaging bag.
2512251530_DGCX-MKP564J2EC51GCB2000R_C53133412.pdf
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