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quality Epoxy encapsulated capacitor DGCX MPP104J2JC050C3T0ZR for coupling decoupling and bypassing circuits factory
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quality Epoxy encapsulated capacitor DGCX MPP104J2JC050C3T0ZR for coupling decoupling and bypassing circuits factory
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Specifications
Mfr. Part #:
MPP104J2JC050C3T0ZR
Package:
Through Hole,P=10mm
Key Attributes
Model Number: MPP104J2JC050C3T0ZR
Product Description

Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications, featuring an epoxy-encapsulated, non-inductive winding structure. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They offer excellent self-healing properties, low loss, and low internal temperature rise, with a flame-retardant epoxy resin powder coating.

Product Attributes

  • Brand: Chengxi Electronics ()
  • Model Series: CBB21/MPP
  • Construction: Non-inductive winding, metallized polypropylene film, epoxy encapsulated
  • Lead Material: Tinned copper wire or tinned copper-clad steel wire
  • Encapsulation: Flame-retardant epoxy resin powder coating (UL94V-0)
  • Environmental Compliance: RoHS, REACH, Halogen-free (optional)

Technical Specifications

Part Number Capacitance (uF) Tolerance (%) Rated Voltage (VDC) Dissipation Factor (DF) @ 1kHz, 20C (%) Dimensions (mm) L x W x T (1.0) Pitch (P 1.0) Lead Diameter (d 0.05)
MPP104J2JC050C3T0ZR 0.1 5% 630 0.1 11.7 x 9.4 x 5.1 10.0 3.2 0.6

General Electrical Characteristics

Parameter Specification Test Conditions
Climate Category 40/105/21 -
Operating Temperature Range -40C to +105C (Voltage derating factor 1.25%/C for +85C to +105C)
Rated Temperature 85C -
Capacitance Range 0.001F to 6.8F -
Capacitance Tolerance 5% (J), 10% (K) -
Rated Voltage (VDC) 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 -
Dissipation Factor (DF) 0.0010 1kHz, 20C
Insulation Resistance 30,000 M for C 0.33F
10000 M*F for C > 0.33F
100VDC, 60 seconds
Withstand Voltage 1.6 UR(VDC) 5 seconds

Maximum Pulse Rise Rate (dV/dt)

If actual working voltage (U) is lower than rated voltage (UR), the capacitor can operate at a higher dV/dt. The allowed dV/dt value should be multiplied by UR/U.

dV/dt (V/s) UR (VDC) P=7.5mm P=10.0mm P=15.0mm P=22.5mm P=27.5mm
100/160 130 110 100 70 50
250 240 220 200 120 100
400 450 350 300 180 150
630 550 420 400 250 180
1000/1250 2300 1950 975 600 300
1600 / 6000 4500 2400 /
2000 / / 8000 4500 /

Product Structure and Main Materials

No. Main Material Description Remarks
1 Metallized Polypropylene Film MPPZAH -/-
2 Sprayed Tin Layer Zinc-tin alloy wire -/-
3 Leads Tinned copper-clad steel wire -/-
4 Outer Encapsulation Material Epoxy resin powder Flame retardant UL94V-0
5 Inner Protective Coating Material Epoxy resin -

Note: All raw materials and finished products comply with RoHS environmental requirements.

Packaging Specifications

Item Dimensions (L*W*H)
Inner Box 34.5*23.5*24.5 cm
Outer Box 49*36*27 cm

Packaging Details:

  • Carton packaging includes: Manufacturer Part Number, number of packages and quantity per package, Lot No.
  • Capacitors are packed in transparent PVC bags for moisture and dust protection.
  • RoHS environmental mark.
  • Other customer marking requirements.

Storage Conditions

  • Prolonged exposure to air may degrade lead solderability.
  • Avoid high temperature and high humidity environments.
  • Storage Conditions: Temperature: Max 35C, Relative Humidity: Max 80% (in original packaging).
  • Storage Time: Maximum 12 months (based on production date marked on the packaging bag).

Environmental Characteristics

  • Compliant with RoHS requirements.
  • Compliant with REACH requirements.
  • Compliant with Halogen-free requirements (if specified).

Product Electrical Characteristics and Test Conditions

General Test Conditions: Ambient temperature: 15C35C, Relative humidity: 25%75%. For dispute resolution: Ambient temperature: 202C, Relative humidity: 60%70%.

No. Item Characteristic Test Method
1 Terminal Strength Tensile Strength No visible mechanical damage. Lead diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds.
Bending Strength Lead diameter: 0.6 & 0.8mm. Force: 5N, 90 x 2 times.
2 Solderability Tinning rate of leads 95% Flux temperature: 2455C. Immersion time: 2.50.5 seconds.
3 Soldering Heat Resistance Appearance No visible damage. Soldering temperature: 2605C. Immersion time: 101 seconds. Recovery time: 1-2 hours.
Increase in DF 0.004 (C 1.0F, 10kHz) or 0.004 (C > 1.0F, 1kHz)
Capacitance Change C/C 3%
4 Temperature Rapid Change Appearance No visible damage. Cycles: 5 times between -40C and +105C, 30 min each.
Vibration Appearance Amplitude 0.75mm or acceleration 98m/s (whichever is smaller), frequency 10-500Hz, 3 directions for 2h each (total 6h).
Impact Appearance 4000 times, acceleration 390m/s, pulse duration 6ms.
Final Measurement Appearance No visible damage.
Capacitance Change C/C 5%
Increase in DF 0.004
Insulation Resistance IR/IR 50% -
5 Climatic Sequence Appearance No visible damage. Includes: Dry Heat (+105C, 16h), Cyclic Damp Heat (Test Db, 1st cycle), Cold (-40C, 2h), Low Pressure (8.5kPa, 1h), Cyclic Damp Heat (Test Db, remaining cycles).
Final Measurement Appearance No visible damage.
Capacitance Change C/C 5%
Increase in DF 0.005
Insulation Resistance IR/IR 50% -
6 Damp Heat (Steady State) Appearance No visible damage. Relative Humidity: 90-95%RH, Temperature: 402C, Duration: 21 days. Recovery time: 1-2 hours.
Capacitance Change C/C 5%
Increase in DF 0.002 (C 1.0F, 10kHz) or 0.004 (C > 1.0F, 1kHz)
Insulation Resistance IR/IR 50% -
7 Endurance Appearance No visible damage. Test: 1000 hours at 85C with 1.25UR applied voltage.
Capacitance Change C/C 8%
Increase in DF 0.004
Insulation Resistance IR/IR 50% -
8 Charge/Discharge Capacitance Change C/C 5%. Cycles: 10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is larger). CR: Rated capacitance (uF).
Increase in DF 0.005 (10KHz, CR 1.0uF) or 0.005 (1KHz, CR > 1.0uF)
Insulation Resistance IR/IR 50% -

Usage Rules

  • Operating Range: Do not exceed the upper limit category temperature. Avoid overload. Do not exceed maximum pulse current.
  • Handling Precautions: Avoid repeatedly squeezing the base of the leads. Be cautious of the lead tips.
  • Soldering: Solder heat transmitted through leads can affect the capacitor core. Avoid high temperatures and prolonged soldering times.
  • Soldering Temperature Guidelines:
    • Wave Soldering (MPP Polypropylene Film Capacitors): TP 110C for 120 seconds; Ts 120C for 45 seconds. For P 7.5mm, T 4mm: Wave soldering time < 4 seconds.
    • Soldering Iron: Tip temperature not exceeding 350C, time not exceeding 3 seconds.
    • Lead-type film capacitors are not suitable for reflow soldering.
  • Definitions: Ts: Maximum temperature the capacitor body can withstand during preheating. Tp: Maximum temperature the capacitor body can withstand during the preheating stage.

Maximum Effective Voltage vs. Frequency Curve

Note: Curve values are typical, tested under sinusoidal voltage, ambient temperature 85C, and internal temperature rise T = 10C.

Product Electrical Characteristic Diagrams

(Diagrams not provided in the text.)


2512031620_DGCX-MPP104J2JC050C3T0ZR_C53070543.pdf

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