Product Overview
The CBB22/MPP series metallized polypropylene film capacitors are designed for electronic equipment, featuring an epoxy encapsulated, non-inductive wound structure. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties due to the metallized polypropylene film, low loss, and minimal internal temperature rise, all encapsulated in a flame-retardant epoxy resin powder coating.
Product Attributes
- Brand: CBB22/MPP
- Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Construction: Non-inductive wound structure
- Encapsulation: Flame-retardant epoxy resin powder coating
- Origin: Dongguan Chengxi Electronics Co., Ltd. ()
- Certifications: RoHS compliant, REACH compliant, Halogen-free compliant (if required)
Technical Specifications
| Model | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) @ 1KHz (%) | Dimensions (mm) (L x W x T) | Pitch (P) (mm) | Lead Diameter (d) (mm) |
|---|---|---|---|---|---|---|---|
| CBB22/MPP 0.1uF5% 400V.dc | 0.1 | 5% | 400 | 0.1 | 16.5 x 10.0 x 5.8 | 15.0 | 0.8 |
| MPP104J2GD060C3F0ZR | 0.1 | 5% | 400 | 0.1 | 16.5 x 10.0 x 5.8 | 15.0 | 0.8 |
| Specification | Value |
|---|---|
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40 ~ +105 |
| Rated Temperature | 85 |
| Capacitance Range | 0.001F ~ 6.8F |
| Capacitance Tolerance | 5% (J), 10% (K) |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 |
| Insulation Resistance (C0.33uF) | 30,000M (100VDC, 60s) |
| Insulation Resistance (C>0.33uF) | 10000M*uF (100VDC, 60s) |
| Withstand Voltage | 1.6 UR(VDC), 5 seconds |
| Lead Material | Tinned copper clad steel wire |
| Outer Encapsulation Material | Flame-retardant Epoxy Resin Powder (UL94V-0) |
| Storage Temperature | Max 35 |
| Storage Humidity | Max 80% RH |
| Maximum Storage Time | 12 months (from production date) |
| Test Item | Condition | Parameter |
|---|---|---|
| Terminal Strength (Tensile) | 10N, 10 seconds | No visible mechanical damage |
| Terminal Strength (Bending) | 5N, 90 2 times | No visible mechanical damage |
| Solderability | 2455, 2.50.5 sec | 95% tinning rate on leads |
| Soldering Heat Resistance | 2605, 101 sec | Capacitance change 3%, DF increase 0.004 |
| Rapid Temperature Change | -40 to +105, 5 cycles | No visible damage, Capacitance change 5%, DF increase 0.004 |
| Vibration | 10-500Hz, 0.75mm or 98m/s | No visible damage, Capacitance change 5%, DF increase 0.004 |
| Shock | 390m/s, 6ms, 4000 times | No visible damage, Capacitance change 5%, DF increase 0.004 |
| Steady State Damp Heat | 402, 90-95% RH, 21 days | Capacitance change 5%, DF increase 0.002 (C1.0uF), 0.004 (C>1.0uF), Insulation Resistance IR/IR 50% |
| Endurance | 85, 1000 hours, 1.25UR applied | Capacitance change 8%, DF increase 0.004, Insulation Resistance IR/IR 50% |
Soldering Guidelines:
- Wave Soldering: TP 110 for 120 sec; Ts 120 for 45 sec. For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temperature 350, time 3 seconds.
2512031620_DGCX-MPP104J2GD060C3F0ZR_C53070636.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible