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Specifications
Mfr. Part #:
MPP103J2JD06OC3F0ZR
Package:
Through Hole,P=15mm
Key Attributes
Model Number:
MPP103J2JD06OC3F0ZR
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitor is an epoxy encapsulated, oil-filled type designed for various electronic applications. It features a non-inductive winding structure with metallized polypropylene film and a tin-plated copper wire or tin-plated copper-clad steel lead. The capacitor offers excellent self-healing properties, low loss, and minimal internal temperature rise. It is widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The product is manufactured by Dongguan Chengxi Electronics Co., Ltd.
Product Attributes
- Brand: Chengxi (DGCX)
- Product Type: Metallized Polypropylene Film Capacitor (Oil-filled)
- Series: CBB21/MPP
- Origin: Dongguan, China
- Encapsulation: Epoxy
- Construction: Non-inductive winding
- Leads: Tin-plated copper wire or tin-plated copper-clad steel wire
- Coating: Flame-retardant epoxy resin powder
- Certifications: RoHS compliant, REACH compliant, Halogen-free (if required)
Technical Specifications
| Parameter | Specification | Details |
|---|---|---|
| Model | CBB21/MPP 0.01uF5% 630V.dc | MPP103J2JD06OC3F0ZR |
| Capacitance | 0.01F | 5% (J) |
| Rated Voltage (DC) | 630V.dc | Available ratings: 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600 Vdc, 2000 Vdc |
| Dimensions (L*W*T) | 17.0mm * 10.7mm * 5.6mm | P=15mm, Lead diameter d=0.6mm |
| Lead Pitch (P) | 15.0mm | Other available pitches: 5.0mm, 7.5mm, 10.0mm, 12.5mm, 17.5mm, 20mm, 22.5mm, 25mm, 27.5mm, 31mm, 37.5mm, 41mm |
| Body Thickness Code | 06 | Corresponds to 5.5mm thickness |
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40 to +105 | (Voltage derating of 1.25%/ for temperatures between +85 and +105) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.001F to 6.8F | |
| Capacitance Tolerance | 5% (J), 10% (K) | |
| Dissipation Factor (DF) | 0.0010 (1kHz, 20) | |
| Insulation Resistance | 30,000M for C0.33uF (100VDC, 60s) | 10000M*uF for C>0.33uF (100VDC, 60s) |
| Dielectric Strength | 1.6 UR(VDC) for 5 seconds | |
| Max Pulse Rise Rate (dV/dt) | Refer to chart in document | Value depends on UR and Pitch (P) |
| Main Material | Metallized Polypropylene Film (MPPZAH) | Spray welding layer: Zinc-tin alloy wire; Lead: Tin-plated copper-clad steel wire; Encapsulation: Flame-retardant epoxy resin powder (UL94V-0) |
| Packaging (Inner Box) | 34.5cm * 23.5cm * 24.5cm (L*W*H) | |
| Packaging (Outer Box) | 49cm * 36cm * 27cm (L*W*H) | |
| Storage Conditions | Max Temp: 35, Max RH: 80% | Maximum storage time: 12 months (from production date) |
| Soldering (Wave Soldering) | TP 110 for 120s; Ts 120 for 45s | For P7.5mm, T4mm: Soldering time < 4 seconds |
| Soldering (Soldering Iron) | Tip temperature 350, time 3 seconds |
2512091725_DGCX-MPP103J2JD06OC3F0ZR_C53133377.pdf
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