Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and tinned copper wire or tinned copper-clad steel wire leads. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and low internal temperature rise, with a flame-retardant epoxy resin powder coating for encapsulation.
Product Attributes
- Brand: Dongguan Chengxi Electronics Co., Ltd. (DGCX)
- Product Type: CBB21/MPP Metallized Polypropylene Film Capacitor (Impregnated Type)
- Construction: Non-inductive winding, epoxy encapsulated
- Leads: Tinned copper wire or tinned copper-clad steel wire
- Encapsulation: Flame-retardant epoxy resin powder coating (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Origin: Dongguan, Guangdong Province, China
Technical Specifications
| Model | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) (1KHz) | Dimensions (mm) (L*W*H) | Pitch (mm) | Lead Diameter (mm) |
|---|---|---|---|---|---|---|---|
| MPP103J2JB050C3T0ZR | 0.01 | 5% | 630 | 0.1% | 9.5*8.5*5 | 7.5 | 0.6 |
General Electrical Characteristics
| Parameter | Specification | Test Conditions |
|---|---|---|
| Climate Category | 40/105/21 | - |
| Operating Temperature Range | -40 to +105 | (Derating factor 1.25% / for +85 to +105) |
| Rated Temperature | 85 | - |
| Capacitance Range | 0.001F to 6.8F | - |
| Capacitance Tolerance | 5%(K), 10%(M) | - |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | - |
| Dissipation Factor (DF) | 0.0010 | 1kHz, 20 |
| Insulation Resistance | 30,000 M (for C0.33uF) | 100VDC, 60s |
| Insulation Resistance | 10,000 M*uF (for C>0.33uF) | 100VDC, 60s |
| Withstand Voltage | 1.6 UR(VDC) | 5s |
Maximum Pulse Rise Rate (dV/dt)
| UR (VDC) | P=7.5 (V/s) | P=10.0 (V/s) | P=15.0 (V/s) | P=22.5 (V/s) | P=27.5 (V/s) |
|---|---|---|---|---|---|
| 100/160 | 130 | 110 | 100 | 70 | 50 |
| 250 | 240 | 220 | 200 | 120 | 100 |
| 400 | 450 | 350 | 300 | 180 | 150 |
| 630 | 550 | 420 | 400 | 250 | 180 |
| 1000/1250 | 2300 | 1950 | 975 | 600 | 300 |
| 1600 | / | 6000 | 4500 | 2400 | / |
| 2000 | / | / | 8000 | 4500 | / |
Note: If actual working voltage (U) is lower than rated voltage (UR), the allowable dV/dt value should be multiplied by UR/U.
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Metal Layer | Zinc-tin alloy wire | -/- |
| 3 | Leads | Tinned copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame retardant UL94V-0 |
| 5 | Inner Protective Material | Epoxy resin | - |
All raw materials and finished products comply with RoHS environmental requirements.
Packaging Specifications
| Item | Dimensions (L*W*H) |
|---|---|
| Inner Carton | 34.5*23.5*24.5 cm |
| Outer Carton | 49*36*27 cm |
Carton Packing Details: Includes manufacturer part number, package count and quantity per package, Lot No. Capacitors are packed in transparent PVC bags for moisture and dust protection. RoHS environmental mark included. Other customer marking requirements are accommodated.
Storage Conditions
- Prolonged exposure to air may degrade lead solderability.
- Avoid high temperature and high humidity environments.
- Temperature: Max 35
- Relative Humidity: Max 80%
- Storage Time: Maximum 12 months from the production date marked on the packaging bag.
Environmental Characteristics
- Complies with RoHS requirements.
- Complies with REACH requirements.
- Complies with Halogen-free requirements (if specified).
Product Electrical Characteristics and Test Conditions
General Test Conditions: Ambient temperature: 1535, Relative humidity: 25%75%. For any questions regarding test results, use: Ambient temperature: 202, Relative humidity: 60%70%.
| No. | Item | Characteristic | Test Method |
|---|---|---|---|
| 1 | Terminal Strength | Tensile Strength | No visible mechanical damage. Lead diameter: 0.6 & 0.8mm. Load: 10N, Time: 10s. |
| Bending Strength | Lead diameter: 0.6 & 0.8mm. Force: 5N, 90 2 times. | ||
| 2 | Solderability | - | Tinning rate of leads 95%. Soldering temperature: 2455. Immersion time: 2.50.5s. |
| 3 | Soldering Heat Resistance | Appearance | No visible damage. Soldering temperature: 2605. Immersion time: 101s. Recovery time: 1-2 hours. |
| DF Increase | 0.004 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | ||
| Capacitance Change | C/C 3% | ||
| 4 | Temperature Rapid Change | Appearance | No visible damage. A=-40, B=+105, 5 cycles. Duration: t=30min. |
| Vibration | No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is less severe), frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h. | ||
| Shock | No visible damage. 4000 times, acceleration 390m/s, pulse duration: 6ms. | ||
| Final Measurement | Appearance | No visible damage. | |
| Capacitance Change | C/C 5% | ||
| DF Increase | 0.004 | ||
| Insulation Resistance | IR/IR 50% | ||
| 5 | Climatic Sequence | Appearance | No visible damage. Dry heat +105, 16h; Cyclic damp heat Test Db, first cycle; Cold -40, 2h; Low air pressure 8.5kPa, 1h (no permanent breakdown, arcing or harmful deformation of the case); Cyclic damp heat Test Db, remaining cycles. |
| Capacitance Change | C/C 5% | ||
| DF Increase | 0.005 | ||
| Insulation Resistance | IR/IR 50% | ||
| 6 | Damp Heat, Steady State | Appearance | No visible damage. Relative humidity 90-95%RH, Temperature: 402, No load, Duration: 21 days. Recovery time: 1-2 hours. |
| Capacitance Change | C/C 5% | ||
| DF Increase | 0.002 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | ||
| Insulation Resistance | IR/IR 50% | ||
| 7 | Endurance | Appearance | No visible damage. T=85, 1000 hours. Applied voltage: 1.25UR. |
| Capacitance Change | C/C 8% | ||
| DF Increase | 0.004 | ||
| Insulation Resistance | IR/IR 50% | ||
| 8 | Characteristics Dependent on Temperature | Capacitance measurement at points b, d, f | Static method, capacitor held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202). |
| At lower category temperature -40 | 0 (Cb-Cd)/Cd +3% | ||
| At upper category temperature 105 | -4.0% (Cf-Cd)/Cd 0 | ||
| 9 | Charge and Discharge | Capacitance Change | C/C 5% |
| - | Charge/discharge cycles: 10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: Rated voltage UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is greater). CR: Rated capacitance (uF). | ||
| DF Increase | 0.005 (10KHz, CR1.0uF); 0.005 (1KHz, CR>1.0uF) | ||
| Insulation Resistance | IR/IR 50% |
Usage Rules
- Usage Range: Do not exceed the upper category temperature. Avoid overload. Do not exceed maximum pulse current.
- Operation Precautions: Avoid repeated squeezing at the lead root. Pay attention to the lead tip.
- Soldering: Solder heat can transfer to the capacitor core through leads and encapsulation. Be cautious of capacitor electrical characteristic degradation or damage due to high temperature and prolonged soldering.
- Soldering Temperature Range:
- Wave Soldering: TP 110 for 120s; Ts 120 for 45s. For P7.5mm, T4mm, wave soldering time < 4s.
- Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3s.
- Lead film capacitors are not suitable for reflow soldering.
- Definitions: Ts: Maximum temperature the capacitor body can withstand during wave soldering. Tp: Maximum temperature the capacitor body can withstand during the preheating stage.
Maximum Effective Voltage vs. Frequency Curve Diagram
Note: The typical values in the curve diagram are tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.
Product Electrical Characteristic Diagram
(Diagram content not provided in the source text)
2504101957_DGCX-MPP103J2JB050C3T0ZR_C42460031.pdf
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