Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. Featuring a non-inductive winding structure and metallized polypropylene film, these capacitors offer excellent self-healing properties, low loss, and reduced internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The capacitors are encapsulated with flame-retardant epoxy resin powder, meeting RoHS and REACH environmental standards.
Product Attributes
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Series: CBB21/MPP
- Encapsulation: Flame-retardant epoxy resin powder (UL94V-0)
- Lead Material: Tinned copper-clad steel wire
- Core Material: Metallized Polypropylene Film
- Spray Gold Layer: Zinc-tin alloy wire
- Origin: Dongguan Chengxi Electronics Co., Ltd.
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Technical Specifications
| Model | Capacitance (uF) | Tolerance (%) | Rated Voltage (V.dc) | Dissipation Factor (DF @ 1KHz, 20) | Dimensions (mm) (L x H x T) | Pitch (mm) | Product Code |
|---|---|---|---|---|---|---|---|
| CBB21/MPP | 2.2 | 5% | 630 | 0.1% | 26.8 x 21.5 x 13.6 | 25 | MPP225J2JP140B200ZR |
Electrical Characteristics
| Parameter | Specification | Test Method / Conditions |
|---|---|---|
| Climate Category | 40/105/21 | GB 10190, IEC 60384-16 |
| Operating Temperature Range | -40 to +105 | (Voltage derating factor 1.25% / for +85 to +105) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.001F to 6.8F | |
| Capacitance Tolerance | 5% (J), 10% (K) | |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | |
| Dissipation Factor (DF) | 0.0010 (1kHz, 20) | |
| Insulation Resistance | 30,000 M for C0.33uF (100VDC, 60s) | |
| 10,000 M*uF for C>0.33uF (100VDC, 60s) | ||
| Dielectric Strength | 1.6 UR(VDC), 5 seconds | |
| Max. Pulse Rise Time (dV/dt) | Refer to table in datasheet | Dependent on UR and Pitch |
| Terminal Strength | Tensile: 10N, 10s; Bending: 5N, 90x2 | Wire diameter: 0.6 & 0.8mm |
| Soldering Adhesion | Tinning rate 95% | Soldering temp: 2455, Immersion time: 2.50.5s |
| Soldering Heat Resistance | Appearance: No visible damage; DF increase 0.004; Capacitance change C/C 3% | Soldering temp: 2605, Immersion time: 101s |
| Rapid Temperature Change | Appearance: No visible damage | -40 to +105, 5 cycles |
| Vibration | Appearance: No visible damage | 0.75mm or 98m/s, 10-500Hz, 2h/direction, 6h total |
| Shock | Appearance: No visible damage | 4000 cycles, 390m/s, 6ms pulse |
| Damp Heat (Steady State) | Appearance: No visible damage; DF increase 0.002 (C1.0F); IR/IR 50% | 90-95%RH, 402, 21 days |
| Endurance | Appearance: No visible damage; C/C 8%; DF increase 0.004; IR/IR 50% | 85, 1000 hours, 1.25UR applied voltage |
| Charge/Discharge | C/C 5%; DF increase 0.005; IR/IR 50% | 10,000 cycles |
Storage Conditions
- Temperature: Max 35
- Relative Humidity: Max 80%
- Storage Time: Max 12 months from production date.
Soldering Rules
- Wave Soldering: Preheating temp Ts 120 (45s), Peak temp Tp 110 (120s). For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temp 350, time 3 seconds.
- Lead film capacitors are not suitable for reflow soldering.
2512171500_DGCX-MPP225J2JP140B200ZR_C53190251.pdf
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