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quality Flame Retardant Epoxy Encapsulated Metallized Polypropylene Film Capacitor DGCX MPP225J2JP140B200ZR factory
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quality Flame Retardant Epoxy Encapsulated Metallized Polypropylene Film Capacitor DGCX MPP225J2JP140B200ZR factory
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Specifications
Mfr. Part #:
MPP225J2JP140B200ZR
Package:
Through Hole,P=25mm
Key Attributes
Model Number: MPP225J2JP140B200ZR
Product Description

Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. Featuring a non-inductive winding structure and metallized polypropylene film, these capacitors offer excellent self-healing properties, low loss, and reduced internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The capacitors are encapsulated with flame-retardant epoxy resin powder, meeting RoHS and REACH environmental standards.

Product Attributes

  • Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
  • Series: CBB21/MPP
  • Encapsulation: Flame-retardant epoxy resin powder (UL94V-0)
  • Lead Material: Tinned copper-clad steel wire
  • Core Material: Metallized Polypropylene Film
  • Spray Gold Layer: Zinc-tin alloy wire
  • Origin: Dongguan Chengxi Electronics Co., Ltd.
  • Environmental Compliance: RoHS, REACH, Halogen-free (if required)

Technical Specifications

Model Capacitance (uF) Tolerance (%) Rated Voltage (V.dc) Dissipation Factor (DF @ 1KHz, 20) Dimensions (mm) (L x H x T) Pitch (mm) Product Code
CBB21/MPP 2.2 5% 630 0.1% 26.8 x 21.5 x 13.6 25 MPP225J2JP140B200ZR

Electrical Characteristics

Parameter Specification Test Method / Conditions
Climate Category 40/105/21 GB 10190, IEC 60384-16
Operating Temperature Range -40 to +105 (Voltage derating factor 1.25% / for +85 to +105)
Rated Temperature 85
Capacitance Range 0.001F to 6.8F
Capacitance Tolerance 5% (J), 10% (K)
Rated Voltage (VDC) 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000
Dissipation Factor (DF) 0.0010 (1kHz, 20)
Insulation Resistance 30,000 M for C0.33uF (100VDC, 60s)
10,000 M*uF for C>0.33uF (100VDC, 60s)
Dielectric Strength 1.6 UR(VDC), 5 seconds
Max. Pulse Rise Time (dV/dt) Refer to table in datasheet Dependent on UR and Pitch
Terminal Strength Tensile: 10N, 10s; Bending: 5N, 90x2 Wire diameter: 0.6 & 0.8mm
Soldering Adhesion Tinning rate 95% Soldering temp: 2455, Immersion time: 2.50.5s
Soldering Heat Resistance Appearance: No visible damage; DF increase 0.004; Capacitance change C/C 3% Soldering temp: 2605, Immersion time: 101s
Rapid Temperature Change Appearance: No visible damage -40 to +105, 5 cycles
Vibration Appearance: No visible damage 0.75mm or 98m/s, 10-500Hz, 2h/direction, 6h total
Shock Appearance: No visible damage 4000 cycles, 390m/s, 6ms pulse
Damp Heat (Steady State) Appearance: No visible damage; DF increase 0.002 (C1.0F); IR/IR 50% 90-95%RH, 402, 21 days
Endurance Appearance: No visible damage; C/C 8%; DF increase 0.004; IR/IR 50% 85, 1000 hours, 1.25UR applied voltage
Charge/Discharge C/C 5%; DF increase 0.005; IR/IR 50% 10,000 cycles

Storage Conditions

  • Temperature: Max 35
  • Relative Humidity: Max 80%
  • Storage Time: Max 12 months from production date.

Soldering Rules

  • Wave Soldering: Preheating temp Ts 120 (45s), Peak temp Tp 110 (120s). For P7.5mm, T4mm, soldering time < 4 seconds.
  • Soldering Iron: Tip temp 350, time 3 seconds.
  • Lead film capacitors are not suitable for reflow soldering.

2512171500_DGCX-MPP225J2JP140B200ZR_C53190251.pdf

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