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Specifications
Mfr. Part #:
MPP104J2JB060B20NZR
Package:
Through Hole,P=7.5mm
Key Attributes
Model Number:
MPP104J2JB060B20NZR
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitor (impregnated type) is an epoxy encapsulated component designed for electronic equipment. It features a non-inductive winding structure with metallized polypropylene film and tin-plated copper wire or tin-plated copper-clad steel leads. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and low internal temperature rise, all encapsulated in a flame-retardant epoxy resin powder coating.
Product Attributes
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Series: CBB21/MPP
- Brand: Chengxi Electronics ()
- Encapsulation: Flame-retardant Epoxy Resin Powder Coating
- Construction: Non-inductive winding
- Leads: Tin-plated copper wire or Tin-plated copper-clad steel wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Certifications: UL94V-0 (for encapsulation material)
Technical Specifications
| Parameter | Specification | Test Method/Condition |
|---|---|---|
| Product Code | MPP104J2JB060B20NZR | N/A |
| Customer Part Number | N/A | N/A |
| Approval Certificate Number | CX-MPP-251118-01 | N/A |
| Issue Date | 2025-11-18 | N/A |
| Model | CBB21/MPP | N/A |
| Capacitance | 0.1uF 5% | N/A |
| Rated Voltage | 630V.dc | N/A |
| Pitch (P) | 7.5mm | N/A |
| Dimensions (W*H*T) | 9.5*9.1*5.8 mm | N/A |
| Low Noise | Yes | N/A |
| Climate Category | 40/105/21 | GB 10190, IEC60384-16 |
| Operating Temperature Range | -40~+105 | (Voltage derating 1.25% / for +85~+105) |
| Rated Temperature | 85 | N/A |
| Capacitance Range | 0.001F6.8F | N/A |
| Capacitance Tolerance | 5%(J), 10%(K) | N/A |
| Rated Voltage (DC) | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600 Vdc, 2000 Vdc | N/A |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 | N/A |
| Insulation Resistance | 30,000M for C0.33uF (100VDC, 60s) | N/A |
| Insulation Resistance | 10000M*uF for C>0.33uF (100VDC, 60s) | N/A |
| Dielectric Strength | 1.6UR(VDC), 5 seconds | N/A |
| Maximum Pulse Rise Rate (dV/dt) | See chart in source document (dependent on UR and Pitch) | N/A |
| Lead Strength (Tensile) | No visible mechanical damage | 10N, 10 seconds (for 0.6 & 0.8mm wire diameter) |
| Lead Strength (Bending) | No visible mechanical damage | 5N, 90x2 times (for 0.6 & 0.8mm wire diameter) |
| Solderability | 95% tinning rate on leads | 2455, 2.50.5 seconds |
| Soldering Heat Resistance | Appearance: No visible damage; DF increase 0.004; Capacitance change C/C3% | 2605, 101 seconds, 1-2 hours recovery |
| Rapid Temperature Change | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | 5 cycles of -40 (30min) to +105 (30min) |
| Vibration | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | Amplitude 0.75mm or 98m/s, 10-500Hz, 2h per direction (total 6h) |
| Impact | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.004; Insulation Resistance IR/IR50% | 4000 times, 390m/s, 6ms pulse duration |
| Climatic Sequence | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.005; Insulation Resistance IR/IR50% | Test Db cycles, Dry Heat (+105, 16h), Cold (-40, 2h), Low Pressure (8.5kPa, 1h) |
| Damp Heat (Steady State) | Appearance: No visible damage; Capacitance change C/C5%; DF increase 0.002 (C1.0F, 10kHz) or 0.004 (C>1.0F, 1kHz); Insulation Resistance IR/IR50% | 90-95%RH, 402, 21 days, 1-2 hours recovery |
| Endurance | Appearance: No visible damage; Capacitance change C/C8%; DF increase 0.004; Insulation Resistance IR/IR50% | 1000 hours at 85 with 1.25UR applied voltage |
| Characteristics with Temperature | See source document for specific capacitance change percentages at -40 and +105 relative to 20. | Static method, holding at specified temperatures (a, b, d, f, g) |
| Charge/Discharge | Capacitance change C/C5%; DF increase 0.005; Insulation Resistance IR/IR50% | 10,000 cycles (0.5s charge, 0.5s discharge) at UR, specific resistance values |
| Main Material: Metallized Polypropylene Film | MPPZAH | N/A |
| Main Material: Spraying Layer | Zinc-tin alloy wire | N/A |
| Main Material: Leads | Tin-plated copper-clad steel wire | N/A |
| Main Material: Outer Encapsulation | Epoxy resin powder | Flame retardant UL94V-0 |
| Main Material: Inner Protective Material | Epoxy resin | N/A |
| Packaging (Inner Box) | 34.5*23.5*24.5 cm (L*W*H) | N/A |
| Packaging (Outer Box) | 49*36*27 cm (L*W*H) | N/A |
| Storage Conditions | Temperature: Max 35, Relative Humidity: Max 80% | Original packaging, max 12 months from production date |
| Soldering Rules (Wave Soldering) | TP 110, 120s; Ts 120, 45s; For P7.5mm, T4mm: < 4 seconds | N/A |
| Soldering Rules (Soldering Iron) | Tip temperature 350, time 3 seconds | N/A |
| Soldering Rules (Reflow Soldering) | Not suitable for leaded film capacitors | N/A |
2512171500_DGCX-MPP104J2JB060B20NZR_C53190258.pdf
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