Product Overview
The CBB21/MPP series capacitors are metallized polypropylene film capacitors with an epoxy encapsulated, non-inductive winding structure. They feature a self-healing capability, low loss, and low internal temperature rise. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They are widely used in electronic equipment.
Product Attributes
- Brand: DGCX (Company trademark)
- Product Series: CBB21/MPP
- Construction: Non-inductive winding, epoxy encapsulated
- Material: Metallized polypropylene film
- Leads: Tinned copper wire or tinned copper-clad steel wire
- Encapsulation: Flame-retardant epoxy resin powder coating (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Origin: Dongguan City, Guangdong Province, China
Technical Specifications
| Parameter | Specification | Test Method/Condition |
|---|---|---|
| Product Type | CBB21/MPP Metallized Polypropylene Film Capacitor (Impregnated Type) | |
| Model/Part Number | MPP684J2SC05HB200ZR-H16 | |
| Nominal Capacitance | 0.68 F 5% | |
| Rated Voltage | 450 V.dc | |
| Dimensions (L*W*H) | 12*16.5*5.5 mm (approximate) | |
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40 to +105 | (Derating factor 1.25% / for +85 to +105) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.001F to 6.8F | |
| Capacitance Tolerance | 5% (K), 10% (M) | |
| Rated Voltage Options | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 450Vdc, 520Vdc, 630Vdc, 800Vdc, 1000Vdc, 1200Vdc, 1250Vdc, 1600Vdc, 2000Vdc, 2500Vdc, 3000Vdc | |
| Dissipation Factor (DF) | 0.0010 (1kHz, 20) | |
| Insulation Resistance | 30,000 M for C 0.33F (100VDC, 60s) | |
| Insulation Resistance (cont.) | 10,000 M*F for C > 0.33F (100VDC, 60s) | |
| Dielectric Strength | 1.6 UR(VDC), 5 seconds | |
| Max. Pulse Rise Rate (dV/dt) | Refer to chart in document (dependent on UR and lead pitch) | |
| Terminal Strength (Tensile) | No visible mechanical damage | Wire diameter: 0.6 & 0.8mm; Load: 10N, Time: 10 seconds |
| Terminal Strength (Bending) | No visible damage | Wire diameter: 0.6 & 0.8mm; Force: 5N, 90 2 times |
| Solderability | 95% tinning rate on leads | Flux temp: 2455, Immersion time: 2.50.5s |
| Soldering Heat Resistance | No visible damage | Solder temp: 2605, Immersion time: 101s, Recovery time: 1-2 hours |
| Capacitance Change (Soldering Heat) | C/C 3% | |
| DF Increase (Soldering Heat) | 0.004 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | |
| Vibration Resistance | No visible damage | Amplitude 0.75mm or acceleration 98m/s, Frequency 10-500Hz, 2h per direction (3 directions) |
| Impact Resistance | No visible damage | 4000 times, acceleration 390m/s, pulse duration 6ms |
| Capacitance Change (after tests) | C/C 5% | |
| DF Increase (after tests) | 0.004 | |
| Insulation Resistance Change (after tests) | IR/IR 50% | |
| Steady State Damp Heat | No visible damage | RH 90-95%, Temp: 402, 21 days |
| Capacitance Change (Damp Heat) | C/C 5% | |
| DF Increase (Damp Heat) | 0.002 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz) | |
| Insulation Resistance Change (Damp Heat) | IR/IR 50% | |
| Endurance Test | No visible damage | 85, 1000 hours, Voltage: 1.25UR |
| Capacitance Change (Endurance) | C/C 8% | |
| DF Increase (Endurance) | 0.004 | |
| Insulation Resistance Change (Endurance) | IR/IR 50% | |
| Charge/Discharge Cycles | No visible damage | 10,000 cycles; Charge time: 0.5s, Discharge time: 0.5s, Charge voltage: UR |
| Capacitance Change (Charge/Discharge) | C/C 5% | |
| DF Increase (Charge/Discharge) | 0.005 (10KHz, CR1.0uF); 0.005 (1KHz, CR>1.0uF) | |
| Insulation Resistance Change (Charge/Discharge) | IR/IR 50% | |
| Storage Conditions | Temperature: Max 35, Relative Humidity: Max 80% | Max storage time: 12 months from production date |
| Soldering Temperature (Wave) | TP 110 for 120s; Ts 120 for 45s | For P7.5mm, T4mm, wave soldering time < 4 seconds |
| Soldering Temperature (Iron) | Tip temp 350, time 3 seconds |
2505291610_DGCX-MPP684J2SC05HB200ZR-H16_C49003009.pdf
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