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Specifications
Capacitance:
680nF
Tolerance:
±5%
Voltage Rating:
450V
Mfr. Part #:
MPP684J2SC06HB200ZR-H16
Package:
Through Hole
Key Attributes
Model Number:
MPP684J2SC06HB200ZR-H16
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications. These capacitors feature an epoxy encapsulated, non-inductive winding structure with tinned copper wire or tinned copper-clad steel wire leads. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties due to the metallized polypropylene film, low loss, and low internal temperature rise, all encapsulated in a flame-retardant epoxy resin powder coating.
Product Attributes
- Brand: DGCX (implied by company trademark)
- Origin: Dongguan, Guangdong, China
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Series: CBB21/MPP
- Encapsulation: Flame-retardant epoxy resin powder coating (UL94V-0)
- Lead Material: Tinned copper-clad steel wire
- Internal Coating: Epoxy resin
- Environmental Compliance: RoHS, REACH, Halogen-free (optional)
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | CBB21/MPP Type Metallized Polypropylene Film Capacitor (Impregnated Type) |
| Model Example | MPP684J2SC06HB200ZR-H16 |
| Capacitance Example | 0.68uF 5% |
| Rated Voltage Example | 450V.dc |
| Dimensions Example (L*W*H) | (12*16.5*6.5) mm |
| Product Code Guide | MPP (CBB21), Capacity Code (e.g., 105=1.0uF), Tolerance Code (F=1%, G=2%, H=2.5%, J=5%, K=10%, M=20%), Voltage Code, Pitch Code, Thickness Code, Internal Feature Code, Lead Type Code, Lead Length & Taping Code, Environmental Code. |
| Scope | Epoxy encapsulated metallized polypropylene film capacitors for electronic equipment. |
| Construction | Non-inductive winding structure using metallized polypropylene film. Leads are tinned copper wire or tinned copper-clad steel wire. Encapsulated with flame-retardant epoxy resin powder. |
| Typical Applications | DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. |
| Product Features | Non-inductive structure, good self-healing, low loss, low internal temperature rise, flame-retardant epoxy resin powder coating. |
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40 to +105 (Voltage derating of 1.25%/ from +85 to +105) |
| Rated Temperature | 85 |
| Capacitance Range | 0.001F to 6.8F |
| Capacitance Tolerance | 5%(J), 10%(K) |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 |
| Dissipation Factor (DF) @ 1kHz, 20 | 0.0010 |
| Insulation Resistance | 30,000M for C0.33uF (100VDC, 60s) 10,000M*uF for C>0.33uF (100VDC, 60s) |
| Dielectric Strength | 1.6 UR(VDC), 5 seconds |
| Max. Pulse Rise Rate (dV/dt) | Refer to chart in original document (dependent on UR and pitch) |
| Marking | DGCX Trademark, MPP Model Code, Capacitance & Tolerance (e.g., 105J), Rated Voltage (e.g., 250V.dc) |
| Packaging | Inner carton: 34.5*23.5*24.5 cm Outer carton: 49*36*27 cm Includes manufacturer part number, quantity per bag, Lot No. Capacitors packed in transparent PVC bags for moisture and dust protection. RoHS environmental mark. |
| Storage Conditions | Temperature: Max 35, Relative Humidity: Max 80% Storage time: Max 12 months from production date. |
| Environmental Characteristics | RoHS compliant, REACH compliant, Halogen-free (optional). |
| Test Conditions (Standard) | Ambient Temperature: 1535, Relative Humidity: 25%75% |
| Test Conditions (Strict) | Ambient Temperature: 202, Relative Humidity: 60%70% |
| Terminal Strength | Tensile: 10N, 10s. Bending: 5N, 90x2 times (for 0.6 & 0.8mm leads) |
| Soldering Heat Resistance | Appearance: No visible damage. Solder Temp: 2605, Immersion: 101s. Recovery: 1-2 hours. DF increase 0.004, C/C 3%. |
| Climate Sequence Test | Dry Heat (+105, 16h), Cyclic Damp Heat (DB), Cold (-40, 2h), Low Pressure (8.5kPa, 1h). C/C 5%, DF increase 0.005, Insulation Resistance IR/IR 50%. |
| Damp Heat Test (Steady State) | 90-95%RH, 402 for 21 days. C/C 5%, DF increase 0.002 (C1.0F, 10kHz) / 0.004 (C>1.0F, 1kHz), Insulation Resistance IR/IR 50%. |
| Endurance Test | 85, 1000 hours, applied voltage 1.25UR. C/C 8%, DF increase 0.004, Insulation Resistance IR/IR 50%. |
| Usage Rules | Do not exceed upper category temperature, avoid overload, do not exceed maximum pulse current. Avoid repeated squeezing at lead root. Soldering iron tip temperature not to exceed 350 for max 3 seconds. Wave soldering parameters vary based on pitch and thickness. |
2505291610_DGCX-MPP684J2SC06HB200ZR-H16_C49003010.pdf
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