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quality metallized polypropylene film capacitor DGCX MPP683J2JB040C4F0ZR with non inductive winding structure factory
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quality metallized polypropylene film capacitor DGCX MPP683J2JB040C4F0ZR with non inductive winding structure factory
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Specifications
Capacitance:
68nF
Tolerance:
±5%
Voltage Rating:
630V
Mfr. Part #:
MPP683J2JB040C4F0ZR
Package:
Through Hole
Key Attributes
Model Number: MPP683J2JB040C4F0ZR
Product Description

Product Overview

The CBB21/MPP series capacitors are metallized polypropylene film capacitors, designed with a non-inductive winding structure and encapsulated in flame-retardant epoxy resin powder. They are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key features include excellent self-healing properties due to the metallized film construction, low loss, and low internal temperature rise, all contributing to reliable performance in electronic equipment.

Product Attributes

  • Brand: DGCX (Dongguan Chengxi Electronics Co., Ltd.)
  • Origin: Dongguan, Guangdong Province, China
  • Capacitor Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
  • Construction: Non-inductive winding
  • Encapsulation: Flame-retardant epoxy resin powder coating
  • Lead Material: Tinned copper wire or tinned copper-clad steel wire
  • Certifications: RoHS compliant, REACH compliant, Halogen-free (if required)

Technical Specifications

Model Capacitance (uF) Tolerance (%) Rated Voltage (VDC) Dissipation Factor (DF) (1KHz) Dimensions (mm) (L x W x H) Pitch (mm) Lead Diameter (mm)
MPP683J2JB040C4F0ZR 0.068 5% 630 0.1% (9.5 x 11 x 4.5) 7.5 0.6

Electrical Characteristics

Parameter Specification Test Conditions
Climate Category 40/105/21
Operating Temperature Range -40 to +105 (Voltage derating factor 1.25%/ from +85 to +105)
Rated Temperature 85
Capacitance Range 0.001F to 6.8F
Capacitance Tolerance 5%(K), 10%(M)
Rated Voltage (VDC) 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000
Dissipation Factor (DF) 0.0010 (1kHz, 20)
Insulation Resistance 30,000 M (for C 0.33uF) (100VDC, 60 seconds)
Insulation Resistance 10,000 M*uF (for C > 0.33uF) (100VDC, 60 seconds)
Withstand Voltage 1.6 UR(VDC) (5 seconds)
Terminal Strength (Tensile) No visible mechanical damage 10N load, 10 seconds (for 0.6 & 0.8mm leads)
Terminal Strength (Bending) No visible mechanical damage 5N force, 90 2 times (for 0.6 & 0.8mm leads)
Solderability 95% tinning rate on leads 2455 solder bath, 2.50.5 seconds immersion
Solder Heat Resistance No visible damage, DF increase 0.004, C/C 3% 2605 solder bath, 101 seconds immersion; 1-2 hours recovery
Rapid Temperature Change No visible damage 5 cycles of -40 (30 min) to +105 (30 min)
Endurance (1000 hours) C/C 8%, DF increase 0.004, IR decrease 50% 85, 1.25UR applied
Stable Humidity (21 days) C/C 5%, DF increase 0.002 (C1.0uF), 0.004 (C>1.0uF), IR decrease 50% 402, 90-95% RH

Product Structure and Main Materials

No. Main Material Description Remarks
1 Metallized Polypropylene Film MPPZAH -/-
2 Spray-welded Layer Zinc-tin alloy wire -/-
3 Leads Tinned copper-clad steel wire -/-
4 Outer Encapsulation Material Epoxy resin powder Flame-retardant UL94V-0
5 Internal Coating Material Epoxy resin

Packaging Information

Item Dimensions (L*W*H)
Inner Carton 34.5*23.5*24.5 cm
Outer Carton 49*36*27 cm

Packaging Details: Carton packaging includes manufacturer part number, number of packages, quantity per package, and Lot No. Capacitors are packed in transparent PVC bags for moisture and dust protection. RoHS environmental mark is applied. Other customer-specific markings can be accommodated.

Storage Conditions

  • Avoid prolonged exposure to air, which can degrade lead soldering performance.
  • Do not store in high temperature and high humidity environments.
  • Storage Conditions: Temperature: Max 35, Relative Humidity: Max 80% (in original packaging).
  • Storage Time: Maximum 12 months from the production date indicated on the packaging bag.

Usage Rules

  • Usage Range: Do not exceed the upper category temperature. Avoid overload. Do not exceed maximum pulse current.
  • Operation Precautions: Avoid repeated squeezing at the lead root. Pay attention to the lead tip.
  • Soldering: Solder heat can transfer to the capacitor core through leads and encapsulation. Be mindful of potential degradation or damage from high temperatures and prolonged soldering times.
  • Soldering Temperature Limits:
    • Wave Soldering: TP 110 for 120 seconds; Ts 120 for 45 seconds. For P7.5mm, T4mm, wave soldering time < 4 seconds.
    • Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
    • Not suitable for reflow soldering.
  • Ts: Maximum temperature the capacitor body can withstand during wave soldering.
  • Tp: Maximum temperature the capacitor body can withstand during the preheating stage.

2505291610_DGCX-MPP683J2JB040C4F0ZR_C49003008.pdf

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