Product Overview
The CBB22(H)/MPP series metallized polypropylene film capacitor is an epoxy-encapsulated, non-inductive wound type designed for DC filtering applications such as Power Factor Correction (PFC) and DC link circuits. It features a self-healing metallized polypropylene film construction, excellent electrical performance, and a flame-retardant epoxy resin powder coating. This capacitor is widely used in switching power supplies, electronic ballasts, and frequency converters.
Product Attributes
- Brand: Dongguan Chengxi Electronics Co., Ltd.
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Model Series: CBB22(H)/MPP
- Construction: Non-inductive wound structure, epoxy encapsulation
- Leads: Tin-plated copper clad steel wire
- Outer Coating: Flame-retardant epoxy resin powder (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (if specified)
- Origin: Guangdong, China (Manufacturing location implied by address)
Technical Specifications
| Part Number | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) @ 1kHz (%) | Dimensions (mm) W x H x T | Pitch (P) | Lead Length (L) | Lead Diameter (d) |
|---|---|---|---|---|---|---|---|---|
| MPP104J2EB050C4F0ZR | 0.1 | 5% | 250 | 0.1 | 9.3 x 8.5 x 5.3 | 7.5 | 4.5 | 0.6 |
General Electrical Characteristics
| Parameter | Specification | Test Conditions |
|---|---|---|
| Climate Category | 40/105/21 | |
| Operating Temperature Range | -40~+105 | (Voltage derating of 1.25% / for +85 to +105) |
| Rated Temperature | 85 | |
| Capacitance Range | 0.027F10F | |
| Capacitance Tolerance | 5%(J), 10%(K), 20%(M) | |
| Rated Voltage | 250Vdc, 400/450Vdc, 520Vdc, 630Vdc | |
| Dissipation Factor (DF) | 0.0010 | (1kHz, 20) |
| Insulation Resistance | 30,000M for C0.33uF | (100VDC, 60 seconds) |
| Insulation Resistance | 10000M*uF for C>0.33uF | (100VDC, 60 seconds) |
| Withstand Voltage | 1.6UR(VDC) | 5 seconds |
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Tin Layer | Zinc-tin alloy wire | -/- |
| 3 | Leads | Tin-plated copper clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame-retardant UL94V-0 |
| 5 | Inner Protective Material | Epoxy resin |
Packaging Specifications
| Item | Dimensions (L*W*H) |
|---|---|
| Inner Carton | 34.5*23.5*24.5 cm |
| Outer Carton | 49*36*27 cm |
Storage Conditions
| Parameter | Condition |
|---|---|
| Temperature | Max 35 |
| Relative Humidity | Max 80% |
| Storage Time | Max 12 months (from production date) |
Usage Guidelines
- Do not exceed the upper category temperature.
- Avoid overload operation.
- Do not exceed the maximum pulse current.
- Avoid repeated pressing at the lead root.
- Be cautious of lead tips.
- Soldering temperature and time must be controlled to prevent degradation or damage.
Soldering Requirements
- Wave Soldering: TP 110 for 120 seconds; Ts 120 for 45 seconds. For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
- Not suitable for reflow soldering.
Note: Ts: Maximum temperature of the component body during wave soldering. Tp: Maximum temperature the component body can withstand during the preheating stage.
2512171500_DGCX-MPP104J2EB050C4F0ZR_C53190247.pdf
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