Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation and a non-inductive winding structure. Featuring a self-healing capability, low loss, and minimal internal temperature rise, these capacitors are ideal for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They are manufactured by Dongguan Chengxi Electronics Co., Ltd. and are compliant with RoHS and REACH environmental standards.
Product Attributes
- Brand: DGCX
- Product Type: CBB21/MPP Series Metallized Polypropylene Film Capacitors (Impregnated Type)
- Manufacturer: Dongguan Chengxi Electronics Co., Ltd.
- Origin: Dongguan, Guangdong Province, China
- Encapsulation: Flame-retardant epoxy resin powder coating
- Internal Sealing Material: Epoxy Resin
- Lead Material: Tinned copper clad steel wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Construction: Non-inductive winding structure
Technical Specifications
| Model/Part Number | Capacitance (uF) | Tolerance (%) | Rated Voltage (V.dc) | Dissipation Factor (DF) (1KHz, 20C) | Dimensions (mm) - L (2.0) | Dimensions (mm) - W (1.0) | Dimensions (mm) - H (1.0) | Dimensions (mm) - T (1.0) | Lead Pitch (P 1.0) | Lead Diameter (d 0.05) |
|---|---|---|---|---|---|---|---|---|---|---|
| MPP125J2SC060C03OZR | 1.2 | 5 | 450 | 0.1% | 11.0 | 16.7 | 5.9 | 10.0 | 3.0 | 0.6 |
| Item | Specification | Test Method |
|---|---|---|
| Terminal Strength | Tensile Strength: 10N for 10s (0.6/0.8mm wire diameter) | No visible mechanical damage |
| Bending Strength: 5N, 90 x 2 times (0.6/0.8mm wire diameter) | No visible mechanical damage | |
| Solderability: 95% tinning rate on leads | Soldering flux temp: 2455, Immersion time: 2.50.5s | |
| Solder Heat Resistance | Appearance: No visible damage | Soldering temp: 2605, Immersion time: 101s, Recovery time: 1-2 hours |
| DF Increase: 0.004 (for C1.0uF, 10kHz) / 0.004 (for C>1.0uF, 1kHz) | ||
| Capacitance Change: C/C 3% | ||
| Rapid Temperature Change | Appearance: No visible damage | A=-40, B=+105, 5 cycles, 30 min each |
| Vibration: Amplitude 0.75mm or acceleration 98m/s, 10-500Hz, 2h/direction, 6h total | No visible damage | |
| Impact: 4000 times, acceleration 390m/s, pulse duration 6ms | No visible damage | |
| Climate Sequence | Appearance: No visible damage | Dry Heat (+105, 16h), Cyclic Damp Heat (Test Db, 1st cycle), Cold (-40, 2h), Low Pressure (8.5kPa, 1h) |
| Capacitance Change: C/C 5% | ||
| DF Increase: 0.005 | ||
| Steady State Damp Heat | Appearance: No visible damage | RH 90-95%, Temp: 402, 21 days, Recovery time: 1-2 hours |
| Capacitance Change: C/C 5% | ||
| DF Increase: 0.002 (for C1.0uF, 10kHz) / 0.004 (for C>1.0uF, 1kHz) | ||
| Endurance | Appearance: No visible damage | T=85, 1000h, Voltage: 1.25UR |
| Capacitance Change: C/C 8% | ||
| DF Increase: 0.004 | ||
| Charge/Discharge | Capacitance Change: C/C 5% | 10,000 cycles. Charge voltage: UR. Charge time: 0.5s. Discharge time: 0.5s. |
| DF Increase: 0.005 |
| Model | Capacitance Range | Capacitance Tolerance | Rated Voltage (Vdc) | Working Temperature Range | Climate Category | DF (1kHz, 20C) | Insulation Resistance |
|---|---|---|---|---|---|---|---|
| CBB21/MPP | 0.001F 6.8F | 5%(K), 10%(M) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 Vdc | -40C to +105C (derating above 85C) | 40/105/21 | 0.0010 | 30,000 M (for C0.33uF) / 10,000 M*uF (for C>0.33uF) at 100VDC for 60s |
Maximum Pulse Rise Time (dV/dt): Values vary based on rated voltage (UR) and lead pitch (P). Refer to the provided dV/dt table in the original document for specific values.
Soldering Rules:
- Wave Soldering: Preheating section TP 120C for 120s; Ts 120C for 45s. For P7.5mm, T4mm, soldering time < 4 seconds.
- Soldering Iron: Tip temperature 350C, time 3 seconds.
- Not suitable for reflow soldering.
Storage Conditions: Temperature: Max 35C, Relative Humidity: Max 80%. Maximum storage time: 12 months from the production date.
2504101957_DGCX-MPP125J2SC060C03OZR_C46596150.pdf
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