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Specifications
Current - Saturation (Isat):
18.5A
Mfr. Part #:
D0630HP-1R0MT
Package:
SMD,7.1x6.6mm
Key Attributes
Model Number:
D0630HP-1R0MT
Product Description
Product Overview
This product is an integrated molded power inductor from Shenzhen Deyan Electronics Co., Ltd. It is designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: Shenzhen Deyan Electronics Co., Ltd
- Origin: Shenzhen
- Core Material: Alloy powder
- Wire Material: Copper Wire
- Electrode Material: Cu
- Marking Ink: Black
- Color: Black
Technical Specifications
| P/N | Inductance (H) | Saturation Current Max. (A) | Temperature rise current(T40) (A) | D.C.R. (m) | Dimensions (mm) (A x B x C x D x E) | Recommended Land Pattern (mm) (F x G x H) | Structure Parts |
| D0630HP-1R0MT | 1.020% | 10 | 12 | 18.5 Typ / 22 Max | 6.60.3 x 7.1 0.3 x 3.0 MAX x 3.0 0.3 x 1.6 0.5 | 8.4 Ref. x 3.5 Ref. x 3.7 Ref. | CORE: Alloy powder WIRE: Copper Wire ELECTRODE: Cu MARKING INK: Black |
General Characteristics
| Item | Conditions | Specification |
| Operation Temperature | -40 + 125 (Including Coil Temperature Rise) | |
| Storage Temperature | -40 + 125 | |
| Temperature Coefficient | 0 2000 ppm/ | |
| Fixing Strength | Sample pushed in three directions of X, Y and Z with force of 5.0N for 105 seconds. After soldering between copper plate and electrodes. | No electrode detachment. |
| Resistance to Soldering Heat Test | Refer to the spec STD-001NP. | No mechanical breakage. Deviation relative to initial value: L: Within 10% |
| Solderability Test | Immerse the electrode in flux for 5 seconds. Then dip the electrode into a soldering bath of 2455 for 20.5 seconds. | Over 95% of the surface being immersed shall be covered with new solder uniformly. |
| Vibration Test | Amplitude: 1.5mm P-P Frequency: 105510Hz (1 minute per cycle) Duration: 1 hour in each of X, Y, Z axis. | Deviation relative to initial value: L: Within 10% |
| Humidity Test | Temperature: 402 Humidity: 90%95%RH Duration: 964 hours. | Deviation relative to initial value: L: Within 10% |
| Thermal Shock Test | 20 cycles of +105 for 30 minutes, -40 for 30 minutes. Characteristics are measured after the ambient air exposure of 1 hour. | Deviation relative to initial value: L: Within 10% |
| High Temperature Storage Test | Temperature: 1252 Duration: 964 hours | |
| Low Temperature Storage Test | Temperature: -403 Duration: 964 hours. |
SMT Reflow Profile
| Reflow Profile Feature | Pb(Lead) Free Solder |
| Preheat and Soak Temperature (Tsmin) | 150 |
| Preheat and Soak Temperature (Tsmax) | 200 |
| Time (tsmin to tsmax) | 60-120 Seconds |
| Average ramp up rate Tsmax to Tp | 3 /Second Max. |
| Liquidous temperature (TL) | 217 C |
| Time maintained above TL | 60-150 seconds |
| Peak package body temperature (Tp) | See Table 2 |
| Time (tp)* within 5 C of the specified classification temperature (Tc) | 30* seconds |
| Average Ramp-down rate (Tp to TL) | 6 C/second max |
| Time 25 C to peak temperature | 8 minutes max. |
| Pb-Free Process - Classification Temperatures (Tc) | Volume mm <350 | Volume mm 350~2000 | Volume mm >2000 |
| Package Thickness <1.6 mm | 260 | 260 | 260 |
| Package Thickness 1.6mm- 2.5mm | 260 | 250 | 245 |
| Package Thickness >2.5 mm | 250 | 245 | 245 |
Packing
| Item | Pcs Q'ty | N.W. (KGS) | G.W. (KGS) |
| REEL | 1000PCS | 375 | 375 |
| BOX | 8000PCS | 260 | 235 |
Notes
Soldering Tin Period of Validity: Six Months
Storage Temperature: 255
Comparatively Humidity: 35%--70%
2411220032_DEYAN-D0630HP-1R0MT_C41410466.pdf
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