Product Overview
The MPX X2 series of metallized polypropylene film capacitors are designed for suppressing electromagnetic interference in power supplies. These capacitors feature a non-inductive winding structure with metallized polypropylene film and tin-plated copper-clad steel leads. Encased in a flame-retardant plastic shell and epoxy resin, they offer excellent self-healing properties and can withstand high voltage surges. They are widely used in interference suppressors and X-line capacitor circuits, suitable for applications where capacitor failure does not pose a risk of electric shock. Compliance with safety standards like UL, CUL, ENEC-VDE, and CQC is assured.
Product Attributes
- Brand: Chengxi Electronics ()
- Product Series: MPX
- Capacitor Type: Metallized Polypropylene Film Capacitor for EMI Suppression (X2)
- Construction: Non-inductive winding
- Encapsulation: Flame-retardant plastic shell (PBT) and flame-retardant epoxy resin (UL94V-0)
- Leads: Tin-plated copper-clad steel wire
- Certifications: UL & CUL (E499953), ENEC-VDE (40048056), CQC (CQC18001191338)
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Case Color: Yellow (as per example code Y)
Technical Specifications
| Specification | Details | Notes |
|---|---|---|
| Product Model | MPX X2 | |
| Nominal Capacitance | 0.47F | |
| Capacitance Tolerance | 10% (K) | |
| Rated AC Voltage | 275VAC / 300VAC / 310VAC | |
| Pitch (P) | 10.0 mm | |
| Dimensions (W x H x T) | 13.0mm x 14.0mm x 8.0mm | (0.5mm for W, H, T) |
| Product Code | MX2474KQ3C50YB2000R | |
| Working Temperature Range | -40C to +110C | |
| Climate Category / Flammability Rating | 40/110/56 B | |
| Dissipation Factor (DF) at 1kHz, 20C | 0.0010 (for 0.001F CR 0.47F) | |
| Dissipation Factor (DF) at 10kHz, 20C | 0.0020 (for 0.001F CR 0.47F) | |
| Dissipation Factor (DF) at 1kHz, 20C | 0.0020 (for 0.47F CR 1.0F) | |
| Dissipation Factor (DF) at 10kHz, 20C | 0.0040 (for 0.47F CR 1.0F) | |
| Dissipation Factor (DF) at 1kHz, 20C | 0.0030 (for CR > 1.0F) | |
| Insulation Resistance | 15,000M for C0.33uF (100VDC, 60s) | |
| Insulation Resistance | 5000M*uF for C>0.33uF (100VDC, 60s) | |
| Dielectric Strength (Between electrodes) | 1000VDC for 5 seconds | |
| Dielectric Strength (Between case and electrodes) | 2120VAC for 60 seconds | |
| Lead Strength (Tensile) | 10N for 0.6 & 0.8mm leads; 20N for 1.0 & 1.2mm leads (10s) | |
| Lead Strength (Bending) | 5N for 0.6 & 0.8mm leads; 10N for 1.0 & 1.2mm leads (90 x 2 times) | |
| Solderability | 95% tinning rate on leads | Flux temp: 2455, Immersion time: 2.50.5s |
| Soldering Heat Resistance | No visible damage | Flux temp: 2605, Immersion time: 101s |
| Capacitance Change after Soldering Heat Resistance | C/C 5% | |
| DF Increase after Soldering Heat Resistance | 0.005 | |
| Packaging - Inner Box Dimensions (L*W*H) | 34.5*23.5*24.5 cm | |
| Packaging - Outer Box Dimensions (L*W*H) | 49*36*27 cm | |
| Storage Temperature | Max 35C | |
| Storage Relative Humidity | Max 80% | |
| Maximum Storage Time | 12 months | From production date marked on packaging |
Note: Technical specifications are based on the provided datasheet and may vary slightly. Refer to the official product documentation for definitive details.
2411151510_DGCX-MX2474KQ3C50YB2000R_C42381362.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
