<
>
Specifications
Current - Saturation (Isat):
5A
Mfr. Part #:
D0520HP-2R2MT
Package:
SMD,5.7x5.2mm
Key Attributes
Model Number:
D0520HP-2R2MT
Product Description
Product Overview
This document details the specifications for the D0520HP-2R2MT power inductor from Shenzhen Deyan Electronics Co., Ltd. It is an integrated molding power inductor designed for various electronic applications.
Product Attributes
- Brand: Shenzhen Deyan Electronics Co., Ltd
- Origin: China (implied by company location)
- Core Material: Alloy powder
- Wire Material: Copper Wire
- Electrode Material: Cu
- Marking Ink: Black
- Product P/N: D0520HP-2R2MT
Technical Specifications
| Part Number | Inductance (H) | D.C.R. (m) Typ. | D.C.R. (m) MAX | Saturation Current (Isat) (A) Typ. | Saturation Current (Isat) (A) MAX | Temperature rise current(A) (T 40 ) | Dimensions (mm) A | Dimensions (mm) B | Dimensions (mm) C | Dimensions (mm) D | Dimensions (mm) E | Dimensions (mm) F (Ref) | Dimensions (mm) G (Ref) | Dimensions (mm) H (Ref) |
| D0520HP-2R2MT | 2.220% | 45 | 6.0 | 5.0 | 4.0 | 3.4 | 5.20.2 | 5.70.20 | 2.0 Max. | 2.00.30 | 1.50.30 | 6.0 | 2.5 | 2.2 |
General Characteristics
| Item | Conditions | Specification |
| Operation Temperature | -40 + 125 (Including Coil Temperature Rise) | |
| Storage Temperature | -30 +105 | |
| Temperature Coefficient | 0 2000 ppm/ | |
| Fixing Strength | Sample is pushed in three directions of X, Y and Z with force of 5.0N for 105 seconds. After soldering between copper plate and electrodes. | No electrode detachment. |
| Resistance to Soldering Heat Test | Refer to the spec STD-001NP. | No mechanical breakage. Deviation relative to initial value: L: Within 10% |
| Solderability Test | Immerse the electrode in flux for 5 seconds. Then dip the electrode into a soldering bath of 2455 for 20.5 seconds. | Over 95% of the surface being immersed shall be covered with new solder uniformly. |
| Vibration Test | Amplitude: 1.5mm P-P Frequency: 105510Hz (1 minute per cycle) Duration: 1 hour in each of X, Y, Z axis. | Deviation relative to initial value: L: Within 10% |
| Humidity Test | Temperature: 402 Humidity: 90%95%RH Duration: 964 hours. | Deviation relative to initial value: L: Within 10% |
| Thermal Shock Test | 20 cycles of +105 for 30 minutes, -40 for 30 minutes. Characteristics are measured after the ambient air exposure of 1 hour | Deviation relative to initial value: L: Within 10% |
| High Temperature Storage Test | Temperature: 1252 Duration: 964 hours | |
| Low Temperature Storage Test | Temperature: -403 Duration: 964 hours. |
SMT Reflow Profile
| Profile Feature | Pb Free Solder |
| Preheat and Soak Temperature (Tsmin) | 150 |
| Preheat and Soak Temperature (Tsmax) | 200 |
| Preheat and Soak Time (tsmin to tsmax) | 60-120 Seconds |
| Average ramp up rate (Tsmax to Tp) | 3 /Second Max. |
| Liquidous temperature (TL) | 217 C |
| Time (TL) maintained above TL | 60-150 seconds |
| Peak package body temperature (Tp) | See Table 2 |
| Time (tp)* within 5 C of the specified classification temperature (Tc) | 30* seconds |
| Average Ramp-down rate (Tp to TL) | 6 C/second max |
| Time 25 C to peak temperature | 8 minutes max. |
Table 2. Pb-Free Process - Classification Temperatures (Tc)
| Volume mm | Package Thickness | 350~2000 3 | >2000 3 | <350 3 |
| <1.6 mm | 260 | 260 | 260 | |
| 1.6mm- 2.5mm | 260 | 250 | 245 | |
| >2.5 mm | 250 | 245 | 245 |
Packing
| Item | PCS | Q'TY | N.W. (KGS) | G.W. (KGS) |
| REEL | 3000PCS | 3000 | 3.75 | 3.75 |
| BOX | 30000PCS | 30000 | 35.5 | 35.5 |
Notes
Soldering Tin Period of Validity: Six Months. Storage Temperature: 255. Comparatively Humidity: 35%--70%.
2411220031_DEYAN-D0520HP-2R2MT_C41410461.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
