Product Overview
The MSB capacitor is constructed with metallized polypropylene series film dielectric in a non-inductive, wound structure. It features tinned copper leads and is encapsulated in a flame-retardant plastic case with epoxy resin, meeting UL94-V0 standards. This capacitor offers excellent self-healing capabilities, good flame retardancy, and is designed for high-frequency, high-current pulse applications.
Product Attributes
- Brand: DERSONIC
- Origin: Dongguan, China
- Material: Metallized polypropylene film, tinned copper leads, flame-retardant plastic case, epoxy resin encapsulation
- Color: Gray shell
- Certifications: UL94-V0, ROHS, REACH
Technical Specifications
| Item | Characteristic requirement | Test method&Condition |
| Capacitance Range | 0.001uF2.2uF | 1KHz ,1.0Vrms ,20 |
| Capacitance Tolerance | 5%(J),10%(K),20%(M) | 1KHz ,1.0Vrms ,20 |
| Rated Voltage | 250V/450V/630V/800V/1000V/1250V/1600V/2000VDC | |
| Climatic Category | 40/110 | |
| Passive Flammability Class | UL94-V0 | |
| Operating Temperature | -40+110 | |
| Dissipation Factor (tan) | C0.47F: 0.10% 0.47F<C1.0F: 0.10% C>1.0F: 0.10% | 1KHZ |
| Insulation Resistance | C0.33F: 50000MUf C0.33F: 10000MUf | Ur100V,100VDC, 60s,20 |
| Withstand voltage (Between Terminals) | 1.6Ur(d.c) 60s | |
| Withstand voltage (Between Terminals and Case) | 2Ur+1500V(a.c) 60s | 2000V(a.c), |
| MAX. Pulse rise time | 150v/us | |
| Lead spacing | 7.5mm, 10mm, 15mm, 22.5mm, 27.5mm, 37.5mm | |
| Cut off Current | 10mA , ARC=OFF, Voltage raising time 510s |
| Item | Characteristic requirement | Test method&Condition |
| Pull Strength | 5N, 10N, 20N (depending on wire diameter) | 904, 10S |
| Terminal Strength | No visible mechanical damage | IEC60384-16 C4.3, IEC60384-1 C4.13, IEC60068-2-21 Test Ua1 |
| Bending Strength | No visible mechanical damage | IEC60384-16 C4.3, IEC60384-1 C4.13, IEC60068-2-21 Test Ua1 |
| Solderability | At least 95% of the circumference of the lead wire coated with solder, no visible damage to the body. | Solder temp: 2355, Immersion time: 2.00.5S. IEC60384-16 C4.5, IEC60384-1 C4.15, IEC60068-2-20 Test Ta |
| Resistance to Soldering heat | Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ, Insulation Resistance: R/R50% | Solder temp: 2605, Immersion time: 101S. Recovery time 1-2 hours. IEC60384-16 C4.5, IEC60384-1 C4.14, IEC60068-2-20 Test Ta |
| Endurance | Capacitance Variation: C/C10%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ, Insulation Resistance: R/R50% | Temp: 1103, Duration: 1000+48h, Applied voltage: 1.25 Ur(a.c.)50hz. Recovery time at least 16 hours. IEC60384-16 C4.14, IEC60384-1 C4.23, IEC60068-2-2 |
| Steady State Humidity | Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ | Temp: 402, Humidity: 90-95%RH, Duration: 56 days. No voltage applied. Recovery time 1-2 hours. IEC60384-16 C4.12, IEC60384-1 C4. |
2411131606_Dersonic-CF72W274KE1H130HB100_C42382274.pdf
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