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Specifications
Current - Saturation (Isat):
10A
Mfr. Part #:
D1040HP-4R7MT
Package:
SMD,11x10.1mm
Key Attributes
Model Number:
D1040HP-4R7MT
Product Description
Shenzhen Deyan Electronics Co., Ltd - Power Inductor
This document details the specifications for an integrated molded power inductor from Shenzhen Deyan Electronics Co., Ltd. Designed for various electronic applications, this inductor offers reliable performance and robust construction.
Product Attributes
- Brand: Deyan Electronics
- Origin: Shenzhen, China
- Core Material: Alloy powder
- Wire Material: Copper Wire
- Electrode Material: Cu
- Marking Ink: Black
- Product P/No.: D1040HP-4R7MT
- Customer P/No.: ABC
Technical Specifications
| Part Number | Inductance (H) | Saturation Current Max. (A) | Temperature Rise Current (T40) (A) | D.C.R. (m) | Dimensions (mm) | Operating Temperature (C) | Storage Temperature (C) |
|---|---|---|---|---|---|---|---|
| D1040HP-4R7MT | 4.720% | 16.5 | 12 | Typ: 10, Max: 9 | 10.10.3 (A) x 11.00.6 (B) x 4.0 Max. (C) x 3.00.5 (D) x 2.50.5 (E) | -40 ~ +125 | -30 ~ +105 |
General Characteristics
| Item | Conditions | Specification |
|---|---|---|
| Operation Temperature | (Including Coil Temperature Rise) | -40 + 125 |
| Storage Temperature | -40 + 125 | |
| Temperature Coefficient | 0 2000 ppm/ | |
| Fixing Strength | Sample pushed in three directions (X, Y, Z) with 5.0N force for 105 seconds after soldering. | No electrode detachment. |
| Resistance to Soldering Heat Test | Refer to SPEC STD-001NP. | No mechanical breakage. L: Within 10% relative to initial value. |
| Solderability Test | Electrode immersed in flux for 5s, then dipped in soldering bath of 2455 for 20.5s. | Over 95% of the surface being immersed shall be covered with new solder uniformly. |
| Vibration Test | Amplitude: 1.5mm P-P, Frequency: 105510Hz (1 minute per cycle), Duration: 1 hour in each of X, Y, Z axis. | L: Within 10% relative to initial value. |
| Humidity Test | Temperature: 402, Humidity: 90%95%RH, Duration: 964 hours. | L: Within 10% relative to initial value. |
| Thermal Shock Test | 20 cycles of +105 for 30 minutes, -40 for 30 minutes. Characteristics measured after 1 hour exposure to ambient air. | L: Within 10% relative to initial value. |
| High Temperature Storage Test | Temperature: 1252, Duration: 964 hours. | |
| Low Temperature Storage Test | Temperature: -403, Duration: 964 hours. |
Reflow Profile for SMT Components
| Profile Feature | Lead(Pb) Free solder | Unit |
|---|---|---|
| Preheat and soak temperature Min.(Tsmin) | 150 | |
| Preheat and soak temperature Max.(Tsmax) | 200 | |
| Time (tsmin to tsmax)(ts) | 60-120 | Seconds |
| Average ramp up rate Tsmax to Tp | 3 Max. | /Second |
| Liquidous temperature (TL) | 217 | C |
| Time (TL) maintained above TL | 60-150 | seconds |
| Peak package body temperature (Tp) | See Table 2 | C |
| Time (tp)* within 5 C of the specified classification temperature (Tc) | 30* | seconds |
| Average Ramp-down rate (Tp to TL) | 6 Max. | C/second |
| Time 25 C to peak temperature | 8 Max. | minutes |
Table 2. Pb-Free Process - Classification Temperatures (Tc)
| Volume mm | Package Thickness | < 1.6 mm | 1.6mm- 2.5mm | >2.5 mm |
|---|---|---|---|---|
| <350 | 260 | 260 | 260 | |
| 350~2000 | 260 | 250 | 245 | |
| >2000 | 250 | 245 | 245 |
Packing
Refer to Standard Packing Drawing. 500 PCS/REEL, 3000 PCS/BOX.
Notes
Soldering Tin Period of Validity: Six Months. Storage Temperature: 255. Comparatively Humidity: 35%--70%.
2411220031_DEYAN-D1040HP-4R7MT_C41410646.pdf
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