Product Overview
This specification document details the DONGGUAN CITY DERSONIC ELECTRONICS CO., LTD. CBB series metallized polypropylene film capacitors. These capacitors are designed for blocking, coupling, decoupling, filtering, bypassing, timing, and temperature control applications. They are ideal for use in telecommunication equipment, data processing equipment, industrial instruments, automatic control systems, and other general electronic equipment. Key features include non-inductive construction, excellent moisture resistance, self-healing properties, flame retardancy (UL 94V-0), very small loss, excellent capacitance and DF for frequency and temperature characteristics, and high insulation resistance.
Product Attributes
- Brand: Dersonic
- Origin: Dongguan City, China
- Material: Metallized polypropylene film
- Certifications: ROHS, REACH, UL 94V-0 (Flame retardant)
Technical Specifications
| Product PN | Specification | Capacitance Range | Capacitance Tolerance | Rated Voltage (VDC) | Dissipation Factor (1KHz) | Insulation Resistance | Operating Temperature | Lead Pitch (mm) |
|---|---|---|---|---|---|---|---|---|
| DER-SA-FM016 REV.:A0 | CBB (Metallized Polypropylene Film Capacitor) | 0.001uF10.0uF | 1%(F), 2%(G), 2.5%(H), 3%(I), 5%(J), 10%(K) | 100/160/250/400/450/630/1000 | 0.10% (C0.47F, 0.47F | C0.33F: IR100000M C0.33F: IR30000s or30000MUf | -40+105 | 5.08, 7.5, 10.0, 15.0, 17.5, 20, 25, 27.5, 30, 37.5 |
Key Materials
| No. | Main Materials | Specification | Remark |
|---|---|---|---|
| 1 | Metallized polypropylene Film | MPPZAH or MPPA(412um) | |
| 2 | Zinc Tin Layer | Zn,Sn line | Zn or Zn and Sn alloy |
| 3 | Terminal | Tin plated copper clad steel wire (0.6 or 0.8/1.0mm) | CP or CU, Tin plating thickness within 7um |
| 4 | Inside Coating Material | Epoxy resin | UL94-V0 |
| 5 | Outside Coating Material | Epoxy powder | UL94-V0 |
Soldering Guidelines
Soldering Iron: Iron tip temperature not exceeding 350, soldering time within 5 seconds.
Flow/Wave Soldering: Refer to application guidelines for through-hole film capacitors.
Assembly: Avoid proximity to heat sources when assembling onto circuit boards.
Environmental Requirements
- Compliance with ROHS requirements.
- Compliance with REACH requirements.
- Without Halogen (as required).
Reference Standards
- GB-T2693-2001 (IDT IEC 60384-1-2008)
- GB-T10190-1988
- IEC-60384-16-2005
- GB-T 2828.1-2003
2410121328_Dersonic-CFC2E115JI1I220T9100_C2681663.pdf
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