Product Overview

This is an SMD Molding Power Inductor, model DH0520H-3R3M. It is designed for consumer electronics applications and offers reliable performance with specific electrical and mechanical characteristics. The product is manufactured by Guangdong Dehong Sensing Microelectronics Co., Ltd.

Product Attributes

• Brand: (Dehong)
• Origin: (China)
• Product Name: (SMD Molding Power Inductor)
• Color: (Black Ink)

Technical Specifications

External Dimensions & PCB Pattern

A: 5.2 0.3
B: 5.6 0.5
C: 2.0 Max.
D: 1.3 0.5
E: 2.2 0.3
G: 1.9 Ref.
H: 6.2 Ref.
I: 2.5 Ref.

Material List

CORE: (Alloy Powder)
COPPER: (Polyesterimide Enameled Copper Wire)
BASE: (Silver-white Material)
INK: (Black Ink)

Electrical Characteristic Test Conditions

*Testing Conditions: All tests are performed at room temperature 252. Inductance is tested at 100KHz/1V.
*Rated Current: Current value at which the temperature rises by approximately 40 at room temperature 25.
*Saturation Current: Current value at which the inductance drops by approximately 30% of the initial inductance after instantaneous current loading.
*Operating Temperature Range: -45~+125.

Environmental & Mechanical Tests

Environmental Tests:
- Temperature Characteristic: -45 ~ +125; Inductance change within 10% of initial value.
- Humidity Test: 602 / 962 hours, R.H:90-95%RH.
- Low Temperature Storage: -452 / 24 hours.
- Thermal Shock Test: -452 for 30 minutes, +852 for 30 minutes, 100 cycles.
- High Temperature Storage: 852 / 24 hours.

Mechanical Tests:
- Solder Heat Resistance: Inductors should have no evidence of electrical and mechanical damage. Inductance change should not exceed 10%.
- Vibration Test: Amplitude: 1.5 mm, Frequency: 10-55-10Hz / 1 MIN, Direction: X, Y, Z, Duration: 2 HRS/X, Y, Z.
- Shock Test: Inductors should be dropped 10 times from a height of 1m onto a 3cm wooden board.
- Solderability Test: More than 90% of terminal electrode should be covered with solder.

Points For Attention

1. Optimal shelf life: within 180 days from the date of manufacture.
2. Seal remaining unused products with sealing tape to prevent oxidation of solder pads.
3. Avoid contact with solder pads by bare hands to prevent contamination from moisture, sweat, or dust, which can affect solderability.
4. This product's performance may vary with operating conditions. Re-test if using in different applications.
5. Exceeding voltage, current, or temperature limits can cause irreversible damage and product failure.
6. Not suitable for humid, dark, or strongly corrosive environments.