Product Overview
The DH0630H-R82M is an SMD Molding Power Inductor from Guangdong Dehong Sensing Microelectronics Co., Ltd. This product is designed for consumer electronics applications and offers reliable performance with its integrated molding construction. Key features include a wide operating temperature range and adherence to strict quality specifications for electrical, mechanical, and environmental characteristics.
Product Attributes
- Brand: (Dehong)
- Origin: Guangdong, China
- Product Type: SMD Molding Power Inductor
- Application: Consumer Electronics
Technical Specifications
| Part Number | Inductance (L0) @100kHz/1.0V (H) | DC Resistance (DCR) (m) | Rated Current (Irms) (A) | Saturation Current (Isat) (A) | Dimensions (A x B x C) (mm) | Pitch (P) (mm) | Reel Width (W) (mm) | Package Quantity (pcs/reel) |
|---|---|---|---|---|---|---|---|---|
| DH0630H-R82M | 0.82 20% | Typ. 5.6 / Max. 7.4 | Typ. 11 | Typ. 20 | 6.6 0.3 x 7.1 0.5 x 3.0 Max. | 12.00.1 | 16.00.3 | 1000 |
Electrical Characteristics
| Test Item | Specification | Test Condition / Method |
|---|---|---|
| Inductance (L) | Refer to Characteristic Data | MICROTEST 6377 |
| DC Resistance (DCR) | Refer to Characteristic Data | TH2511 |
| Rated Current (IDC) | Inductance change 30% or Temp. rise 40 | Applied current for 4 hours |
| Temperature Rise Test | 40 | Applied rated current for 4 hours |
| Over Load Test | No electrical damage | Applied 1.5x rated current for 5 minutes |
Mechanical Characteristics
| Test Item | Specification | Test Condition / Method |
|---|---|---|
| Solder Heat Resistance | No damage, Inductance change 10% | Preheat: 150 100s, Solder Temp: 2555, Dip Time: 10s Max. |
| Vibration Test | N/A | Amplitude: 1.5mm, Freq: 10-55-10Hz/1min, Direction: X,Y,Z, Time: 2hrs/axis |
| Shock Test | N/A | Dropped 10 times from 1m height onto 3cm wooden board |
| Solderability Test | >90% electrode covered with solder | Preheat: 150 120s, Solder Temp: 2555, Time: 10s Max. |
Environmental Characteristics
| Test Item | Specification | Test Condition / Method |
|---|---|---|
| Temperature Characteristic | Appearance: No damage, Inductance change 10% | -45 ~ +125 |
| Humidity Test | N/A | 602 / 962 hours, RH: 90-95%RH |
| Low Temperature Storage | N/A | -452 / 24 hours, test after 1hr at room temp. |
| Thermal Shock Test | N/A | -452 30min, +852 30min, 100 cycles, test after 2hr at room temp. |
| High Temperature Storage | N/A | 852 / 24 hours, test after 1hr at room temp. |
Points For Attention
- Best shelf life: within 180 days from ex-factory date.
- Seal remaining unused products with tape to prevent pad oxidation.
- Avoid direct contact with pads by bare hands to prevent affecting solderability due to water, sweat, or dust.
- Re-test product if used in different applications due to potential changes in operating conditions.
- Exceeding voltage, current, or temperature limits can cause irreversible damage.
- Not suitable for humid, dark, or strongly corrosive environments.
2411121621_dehongganying-DH0630H-R82M_C41407091.pdf
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