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Specifications
Current - Saturation (Isat):
34A
Mfr. Part #:
DH1040H-R56M
Package:
SMD,11x10.2mm
Key Attributes
Model Number:
DH1040H-R56M
Product Description
Product Overview
This document outlines the specifications for the DH1040H-R56M SMD Molding Power Inductor from Guangdong Dehong Sensing Microelectronics Co., Ltd. This product is designed for consumer electronics applications and offers reliable performance with specific electrical and mechanical characteristics. The document details its dimensions, materials, electrical properties, testing procedures, and handling precautions.
Product Attributes
- Brand: (Dehong)
- Origin: Guangdong, China
- Product Type: (SMD Molding Power Inductor)
- Grade: (General)
Technical Specifications
| Part Number | Inductance (L0) @100kHz/1.0V | DC Resistance (DCR) | Rated Current (Irms) | Saturation Current (Isat) | Dimensions (A x B x C) | Operating Temperature Range |
|---|---|---|---|---|---|---|
| DH1040H-R56M | 0.56 H 20% | 1.7 m (Typ.) / 2.2 m (Max.) | 17 A (Typ.) | 34 A (Typ.) | 10.2 x 11.0 x 4.0 mm | -45 ~ +125 |
Electrical Characteristics
| Test Item | Specification | Test Condition / Method |
|---|---|---|
| Inductance (L) | Refer to Characteristic Data | MICROTEST 6377 |
| DC Resistance (DCR) | Refer to Characteristic Data | TH2511 |
| Rated Current (IDC) | Inductance change 30% or Temp. rise 40 | Applied current to coils |
| Temperature Rise Test | 40 | Applied rated current for 4 hours |
| Over Load Test | No evident electrical damage | Applied 1.5x rated current for 5 minutes |
Mechanical and Environmental Tests
| Test Item | Specification | Test Condition / Method |
|---|---|---|
| Solder Heat Resistance | No appearance or electrical damage; Inductance change 10% | Preheat: 150, 100s; Solder Temp: 2555, Dip Time: 10s Max. |
| Vibration Test | N/A | Amplitude: 1.5 mm; Frequency: 10-55-10Hz/1 min; Direction: X, Y, Z; Time: 2 hrs/axis |
| Shock Test | N/A | Dropped 10 times from 1m height onto 3cm wooden board |
| Solderability Test | >90% electrode covered with solder | Preheat: 150, 120s; Solder Temp: 2555, Time: 10s Max. |
| Temperature Characteristic | Appearance: No damage; Inductance change 10% of initial value | -45 ~ +125 |
| Humidity Test | N/A | 602 / 962 hrs, R.H: 90-95%RH |
| Low Temperature Storage | N/A | -452 / 24 hrs (Test after 1 hr at room temp.) |
| Thermal Shock Test | N/A | -452 (30 min) +852 (30 min), 100 cycles (Test after 1 hr at room temp.) |
| High Temperature Storage | N/A | 852 / 24 hrs (Test after 1 hr at room temp.) |
Packaging
| Product Series | Pieces per Reel | Inner Box Quantity | Outer Box Quantity | Reel Dimensions (mm) | Tape Peel Force (g) |
|---|---|---|---|---|---|
| DH1040 | 1000pcs/ | 2000pcs/ | 6000pcs/ | 13 (16.00.1 x 24.00.3) | 20~140g |
Points For Attention
- Optimal shelf life: Within 180 days from the manufacturing date.
- Seal unused products with tape to prevent oxidation of solder pads.
- Avoid contact with moisture, sweat, or dust on solder pads to ensure solderability. Do not touch solder pads with bare hands.
- Re-test if using in different applications due to potential changes in operating conditions.
- Exceeding voltage, current, or temperature limits can cause irreversible damage and product failure.
- Not suitable for humid, dark, or strongly corrosive environments.
2411121051_dehongganying-DH1040H-R56M_C41407200.pdf
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