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Specifications
Current - Saturation (Isat):
3A
Mfr. Part #:
CMLO1040H680MTT
Package:
SMD,10.8x10mm
Key Attributes
Model Number:
CMLO1040H680MTT
Product Description
Product Overview
The CMLO1040H Series is a magnetically shielded SMD molding power inductor designed for DC-DC converter applications. It features low DC resistance, high current capability due to magnetic iron powder, and low audible core noise. Ideal for portable electronic devices and next-generation mobile technology, it operates up to 3.0MHz and is RoHS compliant.
Product Attributes
- Brand: Cybermaxtech
- Series: CMLO1040H
- Construction: Magnetically shielded
- Material: Magnetic iron powder
- Certification: RoHS compliant
Technical Specifications
| Part Number | Inductance (Lo) (H) | Rdc (m) Max | Test Condition | Saturation Current (Isat) (DC AMPS) (Typ.) | Heat Rating Current (Idc) (DC AMPS) (Typ.) | Dimensions (A x B x C) (mm) | Inductance Tolerance |
| CMLO1040HR15MTT | 0.15 | 0.65 | 100KHz/1V | 75 | 45 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR22MTT | 0.22 | 0.65 | 100KHz/1V | 60 | 35 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR30MTT | 0.30 | 0.65 | 100KHz/1V | 45 | 35 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR36MTT | 0.36 | 0.65 | 100KHz/1V | 45 | 30 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR47MTT | 0.47 | 0.65 | 100KHz/1V | 40 | 30 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR56MTT | 0.56 | 0.65 | 100KHz/1V | 33 | 25 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR68MTT | 0.68 | 0.65 | 100KHz/1V | 30 | 23 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040HR80MTT | 0.80 | 0.65 | 100KHz/1V | 29 | 23 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H1R0MTT | 1.0 | 0.65 | 100KHz/1V | 28 | 19 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H1R5MTT | 1.5 | 0.65 | 100KHz/1V | 24 | 16 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H2R2MTT | 2.2 | 0.65 | 100KHz/1V | 16.5 | 12 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H3R3MTT | 3.3 | 0.65 | 100KHz/1V | 16 | 11 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H4R7MTT | 4.7 | 0.65 | 100KHz/1V | 13 | 9.0 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H6R8MTT | 6.8 | 0.65 | 100KHz/1V | 12 | 8.5 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H8R2MTT | 8.2 | 0.65 | 100KHz/1V | 9.0 | 8.0 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H100MTT | 10 | 0.65 | 100KHz/1V | 8.5 | 7.8 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H150MTT | 15 | 0.65 | 100KHz/1V | 7.0 | 6.5 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H220MTT | 22 | 0.65 | 100KHz/1V | 5.5 | 5.0 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H330MTT | 33 | 0.65 | 100KHz/1V | 4.8 | 4.4 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H470MTT | 47 | 0.65 | 100KHz/1V | 3.5 | 3.3 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H680MTT | 68 | 0.65 | 100KHz/1V | 3.0 | 2.5 | 10.8 x 10.0 x 4.0 | M (20%) |
| CMLO1040H101MTT | 100 | 0.65 | 100KHz/1V | 2.3 | 2.0 | 10.8 x 10.0 x 4.0 | M (20%) |
Notes:
1. DC current (Idc) that will cause an approximate T of 40.
2. DC current (Isat) that will cause Lo to drop approximately 20%.
3. All test data is referenced to 25 ambient.
4. Operating Temperature Range: -55 to +150.
5. The part temperature (ambient + temp rise) should not exceed 150 under the worst operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Applications
- Smart phone, MID
- Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras
- Flat-screen TVs, blue-ray disc recorders, set top box
- Notebooks, desktop computers, servers, graphic cards
- Portable gaming devices, personal navigation systems, personal multimedia devices
- Automotive systems
- Telecomm base stations
Reliability Test Summary
| Test Item | Specification and Requirement | Test Method |
| Solderability | 1. No case deformation or change in appearance 2. New solder coverage More than 90% | 1. Preheat: 155 5 , 60S2S 2. Tin: lead-free. 3. Temperature: 245 5, flux 3.0S0.5S. |
| Mechanical shock | 1. No case deformation or change in appearance 2. L/Lo10% | 1. Acceleration: 100G 2. Pulse time: 6ms 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions |
| Mechanical vibration | 1. No case deformation or change in appearance 2. L/Lo10% | 1. The test samples shall be soldered to the board. Then it shall be submitted to below test conditions. Fre. Range 10~55Hz Total Amplitude 1.5mm Sweeping Method 10Hz to 55Hz to 10Hz Time For 2 hours on each X,Y,Z axis. 2. Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 2 hours. |
| Thermal Shock | Inductance change: Within 10% Without distinct damage in appearance | 1. First -55 for 30 minutes, last 125 for 30 minutes as 1 cycle. Go through 1000 cycles. 2. Max transfer time is 2 minutes. 3. Measured at room temperature after placing for 242 hours |
| Humidity Resistance | Inductance change: Within 10% Without distinct damage in appearance | 1.Reflow 2 times, 2.85,85%RH,1000 hours 3.Measured at room temperature after placing for 242 hours |
| Low temperature storage | Inductance change: Within 10% Without distinct damage in appearance | 1. Temperature: -55 2 2. Time: 1000 hours 3. Measured at room temperature after placing for 242 hours |
| High temperature storage | Inductance change: Within 10% Without distinct damage in appearance | 1. Temperature: +125 2 2. Time: 1000 hours 3. Measured at room temperature after placing for 242 hours |
| Board Flex | Inductance change: Within 10% Without distinct damage in appearance | 1. Run through IR reflow for 2 times; 2. Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down 3. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. 4. The duration of the applied forces shall be 605 sec. The force is to be applied only once to the board. |
| Terminal Strength | No removal or split of the termination or other defects shall occur. | 1. The test samples shall be soldered to the board 2. Push the product vertically from the side of the sample using the thrust tester. 3. Automotive electronics: 17.7N, 60S1s, X, Y direct. |
Recommended Soldering Technologies
Re-flowing Profile
- Preheat condition: 150 ~200/60~180sec.
- Allowed time above 217: 80~120sec.
- Max temp: 260
- Max time at max temp: 10 sec.
- Solder paste: Sn/3.0Ag/0.5Cu
- Allowed Reflow time: 2x max
Iron Soldering Profile
- Iron soldering power: Max. 30W
- Pre-heating: 150 /60sec.
- Soldering time: 3sec. Max.
- Solder paste: Sn/3.0Ag/0.5Cu
- Max. 1 times for iron soldering
Packaging Information
Tape Packaging Dimensions
| Type | W (0.3) | P (0.1) | P0 (0.1) | P2 (0.05) | D0 (0.1) | D1 (0.1) | T (0.05) | A0 (0.1) | B0 (0.1) | K0 (0.1) | E (0.1) | F (0.1) |
| CMLO1040 | 24 | 16 | 4 | 2 | 1.5 | 1.5 | 0.35 | 10.4 | 11.6 | 4.3 | 1.75 | 11.5 |
Reel Dimensions
| A (mm) | W (mm) | N (mm) | B (mm) | C (mm) | D (mm) |
| 330+2.0 | 240.5 | 970.5 | 2.2+0.5 | 13.00.2 | 10.750.25 |
Packaging Quantity
- CMLO1040: 500 pcs / reel
- 2Reel / box (1000 pcs)
- 4 Middle boxes, (4000 pcs)
Peel force of top cover tape
- The peel speed shall be about 300mm/minute
- The peel force of top cover tape shall be between 0.1 to 1.3 N
Reel Label
- Customer's part Number
- Lot Number
- Quantity
- date code
Shipping Label
- Customer's part Number
- Manufacturer's part Number
- Quantity
- date code
2410121322_Cybermax-CMLO1040H680MTT_C961481.pdf
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