Product Overview
The CMBM1608 Series Multilayer Chip Ferrite Bead offers advanced filtering capabilities with internal silver printed layers and magnetic shielded structures to minimize crosstalk. It features sharp impedance characteristics at desirable frequencies without affecting signal integrity. Suitable for reflow and wave soldering, these SMD components are available in four material types and a wide range of impedance values, providing excellent solderability and heat resistance. They are RoHS Compliant.
Product Attributes
- Brand: CybermaxTech
- Series: CMBM1608
- Certifications: RoHS Compliant
- Type: Multilayer Chip Ferrite Bead
- Soldering Method: SMD Type & suitable for reflow and wave soldering
Technical Specifications
| Part Number | Impedance () | Test Frequency (MHz) | DCR Max. () | Rated Current (mA) | Size(EIA) | Dimensions (mm) L x W x T |
| CMBM1608G050JSP | 0~15 | 100 | 0.05 | 800 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G300JSP | 3025% | 100 | 0.05 | 800 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G600HSP | 6025% | 100 | 0.10 | 600 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G900HSP | 9025% | 100 | 0.15 | 600 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G121HSP | 12025% | 100 | 0.20 | 600 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G181GSP | 18025% | 100 | 0.25 | 500 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G221GSP | 22025% | 100 | 0.30 | 500 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G301GSP | 30025% | 100 | 0.35 | 500 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G471GSP | 47025% | 100 | 0.45 | 500 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G601GSP | 60025% | 100 | 0.50 | 500 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G102ESP | 100025% | 100 | 0.60 | 300 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608G152CSP | 150025% | 100 | 0.75 | 150 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608K202BSP | 200025% | 100 | 1.00 | 100 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608K222BSP | 220025% | 100 | 1.00 | 100 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608K252BSP | 250025% | 100 | 1.20 | 100 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
| CMBM1608K272BSP | 270025% | 100 | 1.40 | 100 | 1608(0603) | 1.600.150 x 0.800.150 x 0.800.150 |
General Technical Data
| Parameter | Value |
| Operating Temperature Range | -55 ~ +125 |
| Storage Condition | Less than 40 and 70% RH |
| Soldering Method | Reflow or Wave Soldering |
Application Scenarios
Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry, high frequency EMI prevention of computer, printers, VCRs, TVs and portable telephones.
2410121245_Cybermax-CMBM1608G600HSP_C404979.pdf
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