Product Overview
This document outlines the specifications for the R161G Dual Unit Series potentiometers, manufactured by DONG GUAN IDEAL ELECTRONICS & TECHNOLOGY CO.,LTD. These components are designed for various electronic applications requiring precise rotational control and resistance adjustment.
Product Attributes
- Brand: DONG GUAN IDEAL ELECTRONICS & TECHNOLOGY CO.,LTD.
- Origin: DONG GUAN
- Applicable Models: R161G Dual Unit Series
Technical Specifications
| SPECIFICATION | R161G Dual Unit Series |
| Mechanical Characteristics | |
| Total rotational angle | 3005 |
| Rotational torque | 20-100gf.cm (Note: 60/turn) |
| Rotational stopper strength | 6kgf.cm |
| Push-pull strength | 7Kgf.max. |
| Shaft wobble | 0.7L/30mm p-p max |
| Bushing mount Strength | 5kgf.cm (Shaft support bushing) |
| Numder of click | 30 (250gf.cm) |
| Click sliout force | N/A |
| Electrical Characteristics | |
| Total resistance | 20 K 20% |
| Total resistance tolerance | R1-2: 20 , R2-3: 20 |
| Resistance taper | B taper (Standard) |
| Ratings power | 0.1W (B taper) / 0.05W (other taper) |
| Maximum operating voltage | 150V AC (B taper) / 20V DC (other taper) |
| Slider noise | 100M min.at 500V DC |
| Gang error | 3dB Max.(-40~0dB) |
| Insulation resistance | 100M min.at 500V DC |
| Voltage proof | 500V AC for 1 minute |
| Rotational life | 10,000 cycles |
| Work temperature | -10C ~ +70C |
| Storage temperature | -25C ~ +75C |
| Storage conditions | Keep in a dry and clean place, avoid direct sunlight and high temperature. Avoid contact with corrosive gases. Store in a well-ventilated environment. |
| Residual resistance | 20 |
| Construction | |
| Appearance | Every Part Should Be Finished Not To Exist Rust Flaw Crack And Plating Fail |
| Soldering Specifications | |
| Lead-free solder specifications | Soldering conditions potentiometer placed in the following 1.6mm thickness of single layer printed circuit board |
| Manual soldering | To be performed within 3 seconds at 350C or below. |
| Automated/Semi-automated soldering | Soldering process machine set the temperature below 260C, 4 seconds or less. Warm-up time of no more than two minutes, solder junction maximum preheat temperature does not exceed 100C. |
| Flux ratio | Foam-type and flux ratio above 0.82, foam height to half the thickness of the printed circuit board as a standard. Flux cannot flow onto the potentiometer substrate surface and the surface of the printed circuit board. |
2410122024_CTR-R16156G0-KA15D6-5-B203-000_C19712524.pdf
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