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quality COILMX MTA74-R68M power inductor featuring 0.68 microhenry inductance and metal dust core for high current factory
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quality COILMX MTA74-R68M power inductor featuring 0.68 microhenry inductance and metal dust core for high current factory
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Specifications
Current - Saturation (Isat):
30A
Mfr. Part #:
MTA74-R68M
Package:
SMD,7.5x7.5mm
Key Attributes
Model Number: MTA74-R68M
Product Description

Product Overview

The MTA74-R68M is a high-current power inductor designed for low-profile applications. Featuring a metal dust core for high performance and ultra-high current rating, it is suitable for DC/DC converters, battery-powered devices, and distributed power systems. This RoHS-compliant component offers super low resistance and operates effectively up to 1MHz.

Product Attributes

  • Brand: (Mai Xiang Technology)
  • Model Number: MTA74-R68M
  • Customer Part Number: LILE NO.
  • Revision: A/0
  • Date: 2019.7.3
  • Core Material: Metal Dust
  • Compliance: ROHS compliant
  • Marking: R68

Technical Specifications

Parameter Specification Condition Test Instrument
Inductance (L) 0.68 20% H 100KHz / 1.0V MICROTEST 6377
DC Resistance (DCR) 5 MAX m At 25 TH2512A
Saturation Current (I sat) 30A TYP L0A * 70% @ 100KHz / 1.0V MICROTEST 6377+6220
Operating Temperature Range -40 to + 125
Maximum Part Temperature 155 (ambient + temp rise) under worst-case conditions
Frequency Range Up to 1MHz

Product Dimensions (Unit: mm)

Dimension Value
A 7.5 0.5
B 7.5 0.3
C 5.0 MAX
D 1.5 0.15
E 2.0 0.3

Packaging & Shipping

Item Dimensions (mm)
Tape Packaging (W) 16.00 0.30
Tape Packaging (A0) 8.00 0.10
Tape Packaging (B0) 8.00 0.10
Tape Packaging (K0) 5.30 0.10
Tape Packaging (P) 12.50 0.10
Tape Packaging (F) 7.80 0.1
Tape Packaging (E) 1.75 0.10
Tape Packaging (D0) 1.50 0.10
Tape Packaging (P0) 4.0 0.10
Tape Packaging (T) 0.35 0.05
Reel (A) 330.0 2.0
Reel (B) 100.0 1.0
Reel (C) 13.0 1.0
Reel (D) 1.9 0.4
Reel (W) 30.4 Max
Reel (W1) 24.4 1.0
Carton Quantity 1000 PCS / Reel

Reliability Testing

Mechanical

Item Specification and Requirement Test Method
Solder Ability Terminals area must have 95% min solder coverage Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds
Vibration test Inductance change: Within5% Without mechanical damage such as break (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max
Shock test Inductance change: Within5% Without mechanical damage such as break (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions

Endurance

Item Specification and Requirement Test Method
Thermal shock Inductance change: Within5% Without mechanical damage such as break (1) Repeat 100 cycles: (-552, 303 minutes) -> Room temperature, 5 minutes -> (+1252, 303 minutes) -> Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under standard conditions
High temperature life test Inductance change: Within5% Without mechanical damage such as break (1) Environment condition: 852, Applied current: Rated current (2) Duration: 1000+4/-0 hours
Humidity Resistance Inductance change: Within5% Without mechanical damage such as break (1) Environment condition: 602, Humidity: 90~95%, Applied current: Rated current (2) Duration: 1000+4/-0 hours
Low temperature life test Inductance change: Within5% Without mechanical damage such as break Store at -552 for 1000+4/-0 hours
High temperature life test Inductance change: Within5% Without mechanical damage such as break Store at +1252 for 1000+4/-0 hours

Applications

  • Low profile, high current power supplies.
  • Battery powered devices.
  • DC/DC converters in distributed power systems.
  • DC/DC converters for field programmable gate arrays.

Features

  • ROHS compliant.
  • Super low resistance, ultra high current rating.
  • High performance (I sat) realized by metal dust core.
  • Frequency Range: up to 1MHz.

Recommended PCB Layout

Refer to the drawing for recommended PCB layout dimensions (H: 3.5, S: 3, M: 7.4).

Reflow Profile

1. Reflow Soldering Method. 2. Soldering iron method: 3505 Max. 3 seconds.


2409272301_COILMX-MTA74-R68M_C5360999.pdf

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