Product Overview
The MSY2617 series low voltage, high density hot-pressed molding power inductors are designed for high-performance applications. Featuring super low resistance and ultra-high current ratings, these inductors utilize a metal dust core for high saturation (Isat) performance. They are ROHS compliant and suitable for operation up to 1MHz. Ideal for low profile, high current power supplies, battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays.
Product Attributes
- Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd ()
- Certifications: IATF16949 / ISO9001 / ISO14000
- Compliance: ROHS compliant
- Core Material: Metal dust core
- Manufacturing Process: Hot pressed molding
- Marking: MSY2617 on top of the body
Technical Specifications
| Part Number | Inductance (H 20%) | Test Frequency | DC Resistance (m) MAX | Isat (A) | Irms (A) | Dimensions (A x B x C) (mm) | Dimensions (D x E) (mm) |
|---|---|---|---|---|---|---|---|
| MSY2617-2R2 | 2.2 | 100KHz/1V | 0.60 | 175 | 105 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-3R3 | 3.3 | 100KHz/1V | 0.82 | 130 | 93 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-4R7 | 4.7 | 100KHz/1V | 1.08 | 115 | 80 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-6R8 | 6.8 | 100KHz/1V | 1.44 | 95 | 71 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-8R2 | 8.2 | 100KHz/1V | 1.84 | 85 | 64 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-100 | 10.0 | 100KHz/1V | 2.30 | 75 | 64 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-150 | 15.0 | 100KHz/1V | 3.40 | 60 | 44 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
| MSY2617-220 | 22.0 | 100KHz/1V | 4.85 | 50 | 35 | 26.00.5 x 26.00.5 x 18.0Max | 17.50.5 x 10.750.5 |
Characteristics
- All test data is based on 25 ambient.
- DC current (A) that will cause an approximate T40.
- DC current (A) that will cause L0 to drop approximately 30% Typ.
- Operating temperature range: -50 to +150.
- The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
- Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Reliability
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solder ability test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration test | Inductance change: Within5% Without mechanical damage such as break | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within5% Without mechanical damage such as break | (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within5% Without mechanical damage such as break | (1) Repeat 100 cycles: (-552, 303 minutes) Room temperature, 5 minutes (+1252, 303 minutes) Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under the standard condition after the test. |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 852 Applied current: Rated current (2) Duration: 1000+4/-0 hours |
| Humidity Resistance | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 602 Humidity: 90~95% Applied current: Rated current (2) Duration: 1000+4/-0 hours |
| Low temperature life test | Inductance change: Within5% Without mechanical damage such as break | (1) Store temperature: -552 for total 1000+4/-0 hours |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | (1) Store temperature: +1252 for total 1000+4/-0 hours |
Reflow Profile
1. Reflow Soldering Method
2. Soldering iron method: 3505 Max. 3 seconds.
2410121450_COILMX-MSY2617-220M_C20069107.pdf
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