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quality Low Profile High Current Power Inductor COILMX MTP2915S-3R3L-F for DC DC Converter Applications factory
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quality Low Profile High Current Power Inductor COILMX MTP2915S-3R3L-F for DC DC Converter Applications factory
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Specifications
Current - Saturation (Isat):
55A
Mfr. Part #:
MTP2915S-3R3L-F
Package:
SMD,27.9x19mm
Key Attributes
Model Number: MTP2915S-3R3L-F
Product Description

High Current Power Inductor - MTP2915S-3R3L-F

Product Overview

The MTP2915S-3R3L-F is a high current power inductor designed for low-profile, high-efficiency applications. It features a sturdy construction with flat wire winding for low DC resistance, resulting in high inductance and current handling capabilities with low magnetic loss and ESR. This inductor is suitable for various power supply and DC/DC converter applications, including battery-powered devices and distributed power systems. Its design ensures that temperature rise current and saturation current are less influenced by environmental factors, making it reliable in demanding conditions.

Product Attributes

  • Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd
  • Model Number: MTP2915S-3R3L-F
  • Certifications: IATF16949 / ISO9001 / ISO14000
  • Origin: Shenzhen, China
  • Core Material: DR:(P95)27*19*7.5*B12
  • Wire Material: >220(1.0*4.0*4.75)
  • Solder Material: TIN-Sn99.95
  • Marking: 3R3 on top of the body

Technical Specifications

Parameter Specification Condition Test Instrument
Inductance (L) 3.3 ± 15% µH 100KHz / 0.25V MICROTEST 6377
DCR 1.41 Ω MAX At 25°C TH2512A
Saturation Current (I sat) 55A TYP L0A*80% MICROTEST 6377+6220
RMS Current (I rms) 36A TYP ΔT ≤ 40°C MICROTEST 6377+6220
Operating Temperature Range -40°C ~ +125°C
Product Dimension (mm) A: 27.9 MAX
B: 19.7 MAX
C: 15.4 MAX
D: 27 MAX
E: 4.0 ± 0.3
F: 6.5 ± 0.5

Applications

  • Low profile, high current power supplies.
  • Battery powered devices.
  • DC/DC converters in distributed power systems.
  • DC/DC converters for field programmable gate array.

Features

  • Assemblage design, sturdy structure.
  • High inductance, high current, low magnetic loss, low ESR, small parasitic capacitance.
  • Flat wire winding, achieve a low D.C. Resistance.
  • Temperature rise current and saturation current is less influenced by environment.

Reliability Testing

Item Specification and Requirement Test Method
Solderability Test Terminals area must have 95% min solder coverage Solder heat proof: (1) Preheating: 160±10°C for 90 seconds (2) Retention time: 245±5°C for 2±0.5 seconds
Vibration Test Inductance change: Within±5% Without mechanical damage such as break (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max
Shock Test Inductance change: Within±5% Without mechanical damage such as break (1) Peak value: 100G (2) Duration of pulse: 11ms (3) 3 times in each positive and negative direction of 3 mutual perpendicular directions
Thermal Shock Inductance change: Within±5% Without mechanical damage such as break 100 cycles: (-55±2°C, 30±3 minutes) → Room temp, 5 minutes → (+125±2°C, 30±3 minutes) → Room temp, 5 minutes. Recovery: 48+4/-0 hours under standard conditions.
High Temperature Life Test Inductance change: Within±5% Without mechanical damage such as break Environment: 85±2°C, Applied current: Rated current, Duration: 1000+4/-0 hours.
Humidity Resistance Inductance change: Within±5% Without mechanical damage such as break Environment: 60±2°C, Humidity: 90~95%, Applied current: Rated current, Duration: 1000+4/-0 hours.
Low Temperature Life Test Inductance change: Within±5% Without mechanical damage such as break Store temperature: -55±2°C for 1000+4/-0 hours.
High Temperature Storage Test Inductance change: Within±5% Without mechanical damage such as break Store temperature: +125±2°C for 1000+4/-0 hours.

Packaging Information

  • Product Series: MTP2915S
  • Quantity/Tray: 50 PCS
  • Quantity/Bundle: 300 PCS
  • Quantity/Carton: 300 PCS

Soldering Profile

  • Reflow Soldering Method: Refer to Reflow Curve.
  • Soldering Iron Method: 350±5°C Max. 3 seconds.

2410121632_COILMX-MTP2915S-3R3L-F_C20069099.pdf
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