Product Overview
The MTP2920 series is a high-current power inductor designed for low-profile applications. It features an assemblage design with a sturdy structure, high inductance, and high current handling capabilities. The inductor offers low magnetic loss, low ESR, and small parasitic capacitance, utilizing flat wire winding for extremely low DC resistance. Its temperature rise and saturation currents are minimally affected by environmental conditions, making it suitable for demanding power supply and DC/DC converter applications.
Product Attributes
- Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd (Motto Technology)
- Certifications: IATF16949 / ISO9001 / ISO14000
- Origin: Shenzhen, China
Technical Specifications
| Part Number | Inductance (uH) 20% | DCR (m) MAX | Saturation Current (A) (Typ) | Temperature Rise Current (A) (Typ) |
|---|---|---|---|---|
| MTP2920-1R5MC | 1.5 | 2.5 | >100 | 30 |
| MTP2920-2R2MC | 2.2 | 2.5 | >100 | 30 |
| MTP2920-3R3MC | 3.3 | 2.5 | >70 | 30 |
| MTP2920-4R7MC | 4.7 | 2.5 | 60 | 30 |
| MTP2920-6R8MC | 6.8 | 2.5 | 46 | 30 |
| MTP2920-100MC | 10 | 2.5 | 32 | 30 |
| MTP2920-150MC | 15 | 2.5 | 21 | 30 |
| MTP2920-220MC | 22 | 2.5 | 15 | 30 |
| MTP2920-330MC | 33 | 2.5 | 11 | 30 |
| MTP2920-470MC | 47 | 2.5 | 10 | 30 |
Product Dimensions (Unit: mm)
- A: 28 MAX
- B: 27 MAX
- C: 21.5 MAX
- D: 10 0.2
General Characteristics
- All test data is based on 25 ambient.
- DC current (A) that will cause an approximate T 40.
- DC current (A) that will cause L0 to drop approximately 30% Typ.
- Operating temperature range: -40 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the application.
Applications
- Low profile, high current power supplies.
- Battery powered devices.
- DC/DC converters in distributed power systems.
- DC/DC converters for field-programmable gate arrays (FPGA).
Features
- Assemblage design, sturdy structure.
- High inductance, high current, low magnetic loss, low ESR, small parasitic capacitance.
- Flat wire winding, achieve a low D.C. Resistance.
- Temperature rise current and saturation current is less influenced by environment.
Reliability
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solderability Test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration Test | Inductance change: Within 5% Without mechanical damage such as break | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock Test | Inductance change: Within 5% Without mechanical damage such as break | (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal Shock | Inductance change: Within 5% Without mechanical damage such as break | (1) Repeat 100 cycles: (-552, 303 minutes) Room temperature, 5 minutes (+1252, 303 minutes) Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under standard conditions. |
| High Temperature Life Test | Inductance change: Within 5% Without mechanical damage such as break | (1) Environment condition: 852 (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours. |
| Humidity Resistance | Inductance change: Within 5% Without mechanical damage such as break | (1) Environment condition: 602, Humidity: 90~95% (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours. |
| Low Temperature Life Test | Inductance change: Within 5% Without mechanical damage such as break | Store temperature -552 for total 1000+4/-0 hours. |
| High Temperature Life Test | Inductance change: Within 5% Without mechanical damage such as break | Store temperature +1252 for total 1000+4/-0 hours. |
Packaging
| Product Series | Quantity/Tray | Quantity/Bundle | Quantity/Carton |
|---|---|---|---|
| MTP2920 | 40 PCS | 280 PCS | 280 PCS |
Reflow Profile
- Reflow Soldering Method
- Soldering iron method: 3505 Max. 3 seconds.
2410121308_COILMX-MTP2920-2R2MC_C2858862.pdf
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