OMA-SMD7050 Quartz Oscillator
The OMA-SMD7050 is a miniature AT-cut strip oscillator unit with an SMD7050 miniature base. It is designed for applications requiring precise frequency control, including WLAN/WiMAX, mobile phones, DSC, Set-Top Boxes, and HDTV.
Product Attributes
- Brand: CREC
- Origin: Chengdu, Sichuan, China
- Product Type: OSC OMA-SMD7050
- Certifications: MIL-STD-883H, MIL-STD-202, IEC 60068-2, ANSI/EIA-481-C, JEDEC J-STD-020C
Technical Specifications
| Item | Symbol | Min. | Type | Max. | Unit | Remark |
| Nominal Frequency | F0 | - | 54.000000 | - | MHz | - |
| Supply Voltage | Vdd | 2.97 | 3.3 | 3.63 | V | - |
| Operating Temperature | TOPR | -20 | - | 70 | - | |
| Frequency Stability | Fr | -50 | - | 50 | ppm | Overall |
| Current Consumption | Icc | - | - | 30 | mA | at 253 |
| Output Load Capacitance | CL | - | 15 | - | pF | - |
| Output High Voltage | VOH | 90%Vdd | - | - | V | at 253 |
| Output Low Voltage | VOL | - | - | 10%Vdd | V | at 253 |
| Rise Time | Tr | - | - | 5 | nSec | at 10% to 90% Vdd |
| Fall Time | Tf | - | - | 5 | nSec | at 10% to 90% Vdd |
| Duty Cycle | - | 45 | 50 | 55 | % | at 253 |
| Start Time | - | - | - | 5 | mSec | - |
| Aging (First Year) | - | - | 3 | - | ppm | - |
| Storage Temperature | TSTG | -55 | - | 125 | (Humidity: 40%~60%) |
Product Dimensions and Solder Pad Layout
Refer to Figure 6.1 for detailed product dimensions and solder pad layout.
Marking
Refer to Figure 6.2 for marking details.
Measurement Circuit
Refer to Figure 6.3 for the measurement circuit.
Output Waveform (CMOS Load)
Refer to Figure 6.4 for the output waveform.
IR Reflow Profile
Refer to Section 7 for the IR reflow profile specifications, based on JEDEC J-STD-020C.
Packing Specification
Refer to Section 8 for detailed packing specifications, including tape dimensions, reel and inner box dimensions, and carton dimensions.
Reliability Test Items
Refer to Section 9 for a comprehensive list of reliability tests performed on the OMA-SMD7050, including High Temperature Storage, Vibration, Fine Leak, Drop Test, Solderability, Aging, Salt Spray, Humidity, Temperature Cycle, Thermal Shock, and IR Reflow.
Product Handling and Control Procedures
Refer to Section 10 for important handling and control procedures, including precautions for storage, mounting of SMD type products, ultrasonic cleaning, and ultrasonic welding.
2410121936_CREC-01-O-MA-1GTGRIAF54000000_C7570551.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
