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Specifications
Current - Saturation (Isat):
22A
Mfr. Part #:
MTF1810-150M
Package:
SMD,18.3x18.2mm
Key Attributes
Model Number:
MTF1810-150M
Product Description
Product Overview
The MTF1810 series is a high-current power inductor designed for low-profile, high-current power supplies, battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. It features an assemblage design with a sturdy structure, offering high inductance, high current capability, low magnetic loss, low ESR, and small parasitic capacitance. The flat wire winding contributes to a low D.C. Resistance, and the temperature rise current and saturation current are less influenced by the environment.
Product Attributes
- Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd
- Series: MTF1810
- Certifications: IATF16949 / ISO9001 / ISO14000
- Origin: Shenzhen, China
Technical Specifications
Product Dimensions
| Dimension | Value (mm) |
|---|---|
| A | 18.2 0.5 |
| B | 18.3 1.0 |
| C | 8.9 0.3 |
| D | 4.5 1.0 |
| E | 3.0 0.5 |
Electrical Requirements
| Part No. | Inductance (uH) 20% | DCR (m) MAX | Saturation Current (A) | Temperature Rise Current (A) |
|---|---|---|---|---|
| (100KHz/0.25V) | (AT25 MICROTEST 6377) | (100KHz/0.25V) | (100KHz/0.25V) | (T40) |
| MTF1810-2R2M | 2.2 | 1.82 | 50 | 32 |
| MTF1810-3R3M | 3.3 | 2.60 | 43 | 25 |
| MTF1810-4R7M | 4.7 | 3.40 | 39 | 23 |
| MTF1810-6R8M | 6.8 | 4.70 | 31 | 19 |
| MTF1810-100M | 10 | 6.90 | 24 | 16 |
| MTF1810-150M | 15 | 10.00 | 22 | 14 |
| MTF1810-220M | 22 | 14.10 | 18 | 11 |
| MTF1810-330M | 33 | 23.00 | 14 | 8.5 |
Characteristics
- Operating temperature range: -40~+125
- The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
Product Identification
MTF 1810 - XXX M
- : Series name
- : Product dimensions
- : Inductance
- : Tolerance: M20%, N30%
Applications
- Low profile, high current power supplies
- Battery powered devices
- DC/DC converters in distributed power systems
- DC/DC converters for field programmable gate array
Features
- Assemblage design, sturdy structure
- High inductance, high current, low magnetic loss, low ESR, small parasitic capacitance
- Flat wire winding, achieve a low D.C. Resistance
- Temperature rise current and saturation current is less influenced by environment
Reliability
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solderability test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration test | Inductance change: Within5% Without mechanical damage such as break | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within5% Without mechanical damage such as break | (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within5% Without mechanical damage such as break | (1) Repeat 100 cycles: (-552, 303 minutes) Room temperature, 5 minutes; (+1252, 303 minutes) Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under standard condition |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 852 (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours |
| Humidity Resistance | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 602, Humidity: 90~95% (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours |
| Low temperature life test | Inductance change: Within5% Without mechanical damage such as break | Store temperature -552 for total 1000+4/-0 hours |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | Store temperature +1252 for total 1000+4/-0 hours |
Packaging
| Item | Dimensions (mm) |
|---|---|
| Tape packaging dimensions | |
| W | 32.00 0.30 |
| A0 | 19.40 0.10 |
| B0 | 18.80 0.10 |
| K0 | 9.50 0.10 |
| P | 0.20 0.05 |
| F | 14.2 0.10 |
| E | 1.75 0.10 |
| D0 | 1.50 0.10 |
| P0 | 4.00 0.1 |
| T | 0.50 0.05 |
| Reel dimensions | |
| A | 330.0 0.5 |
| B | 100.0 0.5 |
| C | 38.4 MAX |
| G | 100 MAX |
| Carton dimensions | |
| Quantity (PCS) per Reel | 250 |
| Quantity (PCS) per Inner Box | 250 |
| Quantity (PCS) per Outer Box | 750 |
Reflow Profile
1. Reflow Soldering Method
2. Soldering iron method: 3505 Max. 3 seconds.
2410121308_COILMX-MTF1810-150M_C5361008.pdf
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