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quality metal dust core power inductor COILMX MPA4030S1R0M for in FPGA and distributed power DC DC converters factory
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quality metal dust core power inductor COILMX MPA4030S1R0M for in FPGA and distributed power DC DC converters factory
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Specifications
Current - Saturation (Isat):
6.5A
Mfr. Part #:
MPA4030S1R0M
Package:
SMD,4x4mm
Key Attributes
Model Number: MPA4030S1R0M
Product Description

Product Overview

The MPA4030S1R0M is a high-performance SMD power inductor designed for low-profile, high-current applications. It features super low resistance and an ultra-high current rating, realized by a metal dust core for enhanced performance. This inductor is suitable for use in various power supply applications, including battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. It is ROHS compliant and operates effectively up to 1MHz.

Product Attributes

  • Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd
  • Model Number: MPA4030S1R0M
  • Certifications: IATF16949 / ISO9001 / ISO14000
  • Material: Metal dust core
  • Compliance: ROHS compliant
  • Marking: "1R0" on top of the body

Technical Specifications

Parameter Specification Condition Test Instrument
Inductance (L) 1.0 ±20% µH 100KHz / 1.0V MICROTEST 6377
DCR 0.018 Ω MAX At 25°C TH2512A
Saturation Current (I sat) 6.5A TYP LOA* 70% (100KHz / 1.0V) MICROTEST 6377+6220
RMS Current (Irms) 4.15A TYP ΔT ≤ 40°C (100KHz / 1.0V) MICROTEST 6377+6220
Dimensions (L x W x H) 4.0 x 4.0 x 3.0 mm MAX - -
Operating Temperature Range -55°C to +125°C - -
Frequency Range Up to 1MHz - -

Reliability Testing

Test Item Specification Test Method
Solderability Terminals area must have 95% min solder coverage Solder heat proof: Preheating: 160±10°C for 90 seconds; Retention time: 245±5°C for 2±0.5 seconds
Vibration Test Inductance change: Within ±5%; Without mechanical damage Frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period; Time: 2 hours in each of 3 mutual perpendicular directions; Amplitude: 1.5 mm Max
Shock Test Inductance change: Within ±5%; Without mechanical damage Peak value: 100G; Duration of pulse: 11ms; 3 times in each positive and negative direction of 3 mutual perpendicular directions
Thermal Shock Inductance change: Within ±5%; Without mechanical damage 100 cycles of (-55±2°C for 30±3 minutes) to Room temperature (5 minutes) to (+125±2°C for 30±3 minutes) to Room temperature (5 minutes); Recovery: 48+4/-0 hours under standard conditions
High Temperature Life Test Inductance change: Within ±5%; Without mechanical damage Environment: 85±2°C; Applied current: Rated current; Duration: 1000+4/-0 hours
Humidity Resistance Inductance change: Within ±5%; Without mechanical damage Environment: 60±2°C, Humidity: 90~95%; Applied current: Rated current; Duration: 1000+4/-0 hours
Low Temperature Life Test Inductance change: Within ±5%; Without mechanical damage Store temperature: -55±2°C for 1000+4/-0 hours
High Temperature Storage Test Inductance change: Within ±5%; Without mechanical damage Store temperature: +125±2°C for 1000+4/-0 hours

Packaging Information

Item Dimensions (mm) Quantity
Tape Packaging (W) 8.00 ±0.30 -
Tape Packaging (A0) 1.9 ±0.10 -
Tape Packaging (B0) 2.3 ±0.10 -
Tape Packaging (K0) 1.2 ±0.10 -
Tape Packaging (E) 1.75 ±0.10 -
Tape Packaging (F) 3.5 ±0.05 -
Tape Packaging (P) 4.0 ±0.10 -
Tape Packaging (D0) 1.5 ±0.10 -
Tape Packaging (P0) 4.0 ±0.10 -
Tape Packaging (T) 0.18 ±0.03 -
Reel (A) 178 ± 2.0 -
Reel (B) 58 ± 1.0 -
Reel (C) 13.5 ±0.2 -
Reel (D) 9.0 ± 1.5 -
Carton - 1 Reel = 2000 PCS

Soldering Profile

Reflow Soldering Method:

  • Reflow Profile

Soldering Iron Method:

  • Max. 350°C ±5°C for 3 seconds.

2409290933_COILMX-MPA4030S1R0M_C429967.pdf

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