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Specifications
Current - Saturation (Isat):
4.8A
Mfr. Part #:
MSM252010-R82M
Package:
SMD,2.5x2mm
Key Attributes
Model Number:
MSM252010-R82M
Product Description
Product Overview
The MSM252010 series is a range of unibody power inductors manufactured by Shenzhen Meixiang Technology Co., Ltd. These components are designed for low profile, high current applications, making them suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. They feature ROHS compliance, super low resistance, ultra-high current rating, and high performance realized by a metal dust core. The operating frequency range is up to 1MHz.
Product Attributes
- Brand: Meixiang ()
- Product Type: Unibody Power Inductor ()
- Origin: China
- Certifications: ROHS compliant
- Core Material: Metal dust core
Technical Specifications
| Model No. | Inductance L(uH) 20% | DCR (m) TYP. | DCR (m) MAX. | Isat (A) MAX. | Irms (A) MAX. |
|---|---|---|---|---|---|
| MSM252010-R22M | 0.22 | 12 | 17 | 7.90 | 6.50 |
| MSM252010-R24M | 0.24 | 12 | 17.5 | 7.80 | 6.40 |
| MSM252010-R33M | 0.33 | 13 | 19 | 7.20 | 6.20 |
| MSM252010-R47M | 0.47 | 15 | 22 | 6.50 | 5.60 |
| MSM252010-R68M | 0.68 | 23 | 27 | 5.50 | 5.00 |
| MSM252010-R82M | 0.82 | 25 | 29 | 4.80 | 4.10 |
| MSM252010-1R0M | 1.00 | 25 | 30 | 4.80 | 4.10 |
| MSM252010-1R5M | 1.50 | 45 | 55 | 3.90 | 3.00 |
| MSM252010-2R2M | 2.20 | 62 | 70 | 3.00 | 2.10 |
| MSM252010-3R3M | 3.30 | 86 | 100 | 2.50 | 2.10 |
| MSM252010-4R7M | 4.70 | 160 | 180 | 2.00 | 1.60 |
| MSM252010-6R8M | 6.80 | 270 | 320 | 1.90 | 1.40 |
| MSM252010-100M | 10.00 | 500 | 560 | 1.40 | 0.95 |
| Dimension | Size (mm) |
|---|---|
| A | 2.5 0.2 |
| B | 2.0 0.2 |
| C | 1.0 Max |
| D | 0.85 0.2 |
| E | 0.8 0.2 |
Characteristics
- Ambient temperature: 25 for all test data.
- Operating temperature range: -55 to +125.
- Part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
- No marking on top of the body.
Reliability
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solder ability test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration test | Inductance change: Within 5% Without mechanical damage such as break | Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period. Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions. Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within 5% Without mechanical damage such as break | Peak value: 100G. Duration of pulse: 11ms. 3 times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within 5% Without mechanical damage such as break | Repeat 100 cycles: (-552, 303 minutes) -> Room temp, 5 mins -> (+1252, 303 minutes) -> Room temp, 5 mins. Recovery: 48+4/-0 hours under standard conditions. |
| High temperature life test | Inductance change: Within 5% Without mechanical damage such as break | Environment condition: 852. Applied current: Rated current. Duration: 1000+4/-0 hours. |
| Humidity Resistance | Inductance change: Within 5% Without mechanical damage such as break | Environment condition: 602, Humidity: 90~95%. Applied current: Rated current. Duration: 1000+4/-0 hours. |
| Low temperature life test | Inductance change: Within 5% Without mechanical damage such as break | Store temperature -552 for total 1000+4/-0 hours. |
| High temperature life test | Inductance change: Within 5% Without mechanical damage such as break | Store temperature +1252 for total 1000+4/-0 hours. |
Packaging
| Item | Dimensions (mm) | Quantity (PCS) |
|---|---|---|
| Tape packaging dimensions W | 8.0 0.30 | |
| Tape packaging dimensions A0 | 2.45 0.10 | |
| Tape packaging dimensions B0 | 2.80 0.10 | |
| Tape packaging dimensions K0 | 1.20 0.05 | |
| Tape packaging dimensions P | 4.0 0.10 | |
| Tape packaging dimensions F | 3.5 0.1 | |
| Tape packaging dimensions E | 1.75 0.10 | |
| Tape packaging dimensions D0 | 1.50 0.10 | |
| Tape packaging dimensions P0 | 4.0 0.10 | |
| Tape packaging dimensions T | 0.25 0.05 | |
| Reel dimensions A | 180.0 2.0 | |
| Reel dimensions B | 60.0 1.0 | |
| Reel dimensions C | 13.0 1.0 | |
| Reel dimensions D | 2.0 0.2 | |
| Reel dimensions W | 14.4 Max | |
| Reel dimensions W1 | 8.4 1.0 | |
| Carton dimensions | 1 Reel: 3000 PCS, 1 Inner Box: 30000 PCS, 1 Outer Box: 120000 PCS |
Reflow Profile
1. Reflow Soldering Method
2. Soldering iron method: 3505 Max. 3 seconds.
2507171700_COILMX-MSM252010-R82M_C49328918.pdf
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