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quality Metal dust core unibody power inductor COILMX MSM252010-3R3M designed for low profile power supplies factory
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quality Metal dust core unibody power inductor COILMX MSM252010-3R3M designed for low profile power supplies factory
quality Metal dust core unibody power inductor COILMX MSM252010-3R3M designed for low profile power supplies factory
quality Metal dust core unibody power inductor COILMX MSM252010-3R3M designed for low profile power supplies factory
>
Specifications
Current - Saturation (Isat):
2.5A
Mfr. Part #:
MSM252010-3R3M
Package:
SMD,2.5x2mm
Key Attributes
Model Number: MSM252010-3R3M
Product Description

Product Overview

The MSM252010 series is a range of unibody power inductors designed for high-current applications. These components feature super low resistance and ultra-high current ratings, realized by a metal dust core for high performance. They are suitable for use in low-profile, high-current power supplies, battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. The inductors are ROHS compliant and operate effectively at frequencies up to 1MHz.

Product Attributes

  • Brand: (Coilmx)
  • Product Type: Unibody Power Inductor
  • Certifications: ROHS compliant
  • Core Material: Metal dust core
  • Marking: No marking on top of the body.

Technical Specifications

Model No. Inductance L (uH) ±20%, 1MHz, 1V DCR (m) TYP. DCR (m) MAX. Isat (A) MAX. Irms (A) MAX.
MSM252010-R22M 0.22 12 17 7.90 6.50
MSM252010-R24M 0.24 12 17.5 7.80 6.40
MSM252010-R33M 0.33 13 19 7.20 6.20
MSM252010-R47M 0.47 15 22 6.50 5.60
MSM252010-R68M 0.68 23 27 5.50 5.00
MSM252010-R82M 0.82 25 29 4.80 4.10
MSM252010-1R0M 1.00 25 30 4.80 4.10
MSM252010-1R5M 1.50 45 55 3.90 3.00
MSM252010-2R2M 2.20 62 70 3.00 2.10
MSM252010-3R3M 3.30 86 100 2.50 2.10
MSM252010-4R7M 4.70 160 180 2.00 1.60
MSM252010-6R8M 6.80 270 320 1.90 1.40
MSM252010-100M 10.00 500 560 1.40 0.95
Product Dimension (mm) Value
A 2.5±0.2
B 2.0±0.2
C 1.0Max
D 0.85±0.2
E 0.8±0.2

Characteristics

  • All test data is based on 25 ambient.
  • DC current (A) that will cause an approximate ▵T40.
  • DC current (A) that will cause L0 to drop approximately 30% Typ.
  • Operating temperature range: -55~+125.
  • The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the application.

Product Identification

  • Product Symbol
  • Dimensions
  • Inductance
  • Tolerance: M±20%, N±30%.
  • Material

Application

  • Low profile, high current power supplies.
  • Battery powered devices.
  • DC/DC converters in distributed power systems.
  • DC/DC converters for field programmable gate array.

Features

  • ROHS compliant.
  • Super low resistance, ultra high current rating.
  • High performance (Isat) realized by metal dust core.
  • Frequency Range: up to 1MHz.

Reliability

Item Specification and Requirement Test Method
Solder ability test Terminals area must have 95% min solder coverage Solder heat proof: (1) Preheating: 160±10 for 90 seconds (2) Retention time: 245±5 for 2±0.5 seconds
Vibration test Inductance change: Within±5% Without mechanical damage such as break (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max
Shock test Inductance change: Within±5% Without mechanical damage such as break (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions
Thermal shock Inductance change: Within±5% Without mechanical damage such as break (1) Repeat 100 cycles: (-55±2, 30±3 minutes) Room temperature, 5 minutes; (+125±2, 30±3 minutes) Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under the standard condition after the test.
High temperature life test Inductance change: Within±5% Without mechanical damage such as break (1) Environment condition: 85±2 Applied current: Rated current (2) Duration: 1000+4/-0 hours
Humidity Resistance Inductance change: Within±5% Without mechanical damage such as break (1) Environment condition: 60±2 Humidity: 90~95% Applied current: Rated current (2) Duration: 1000+4/-0 hours
Low temperature life test Inductance change: Within±5% Without mechanical damage such as break (1) Store temperature -55±2 for total 1000+4/-0 hours
High temperature life test Inductance change: Within±5% Without mechanical damage such as break (1) Store temperature +125±2 for total 1000+4/-0 hours

Packaging

Tape packaging dimensions (mm)
W A0 B0 K0 P F E D0 P0 T
8.0 ±0.30 2.45 ±0.10 2.80 ±0.10 1.20 ±0.05 4.0 ±0.10 3.5 ±0.1 1.75 ±0.10 1.50 ±0.10 4.0 ±0.10 0.25 ±0.05
Reel dimensions (mm)
Item A B C D W W1
Dimensions 180.0 ± 2.0 60.0 ± 1.0 13.0 ± 1.0 2.0± 0.2 14.4 Max 8.4 ± 1.0
Carton dimensions
Item Quantity (PCS)
1 Reel 3000
1 Inner Box 30000
1 Outer Box 120000

Reflow Profile

  • Reflow Soldering Method
  • Soldering iron method: 350±5 Max. 3 seconds.

2507171700_COILMX-MSM252010-3R3M_C49328922.pdf

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