Product Overview
The MS252010-SERIES is a series of unibody power inductors manufactured by Huizhou Maixiang Electronics Co., Ltd. These inductors are designed for low profile, high current applications, making them suitable for various power supply and DC/DC converter systems. They feature super low resistance, ultra-high current ratings, and high performance achieved through a metal dust core. The series is ROHS compliant and operates effectively up to 1MHz.
Product Attributes
- Brand: Maixiang ()
- Product Type: Unibody Power Inductor ()
- Origin: China
- Certifications: ROHS compliant
- Material: Metal dust core
- Marking: No marking on top of the body.
Technical Specifications
| Model No. | Inductance (L0 @ 0A) | DCR (m) TYP. | DCR (m) MAX. | Isat (A) MAX. | Idc (A) MAX. |
|---|---|---|---|---|---|
| MS252010-R47M-W | 0.4720% H | 35 | 46 | 3.5 | 3.1 |
| MS252010-1R0M-W | 1.020% H | 60 | 78 | 2.7 | 2.5 |
| MS252010-1R5M-W | 1.520% H | 90 | 108 | 2.1 | 1.9 |
| MS252010-2R2M-W | 2.220% H | 130 | 156 | 1.9 | 1.5 |
| MS252010-3R3M-W | 3.320% H | 195 | 228 | 1.5 | 1.2 |
| MS252010-4R7M-W | 4.720% H | 250 | 300 | 1.3 | 1.0 |
| MS252010-6R8M-W | 6.820% H | 415 | 516 | 1.1 | 0.76 |
| MS252010-100N-W | 1030% H | 590 | 689 | 1.00 | 0.68 |
Characteristics
- All test data is based on 25 ambient.
- Idc current(A) that will cause an approximate T 40.
- Isat current(A) that will cause L0 to drop approximately 30% Typ.
- Operating temperature range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the application.
Applications
- Low profile, high current power supplies.
- Battery powered devices.
- DC/DC converters in distributed power systems.
- DC/DC converters for field programmable gate arrays.
Product Identification
Product Symbol Dimensions Inductance Tolerance: M20%, N30%. Material
Recommended PCB Layout Dimensions (mm)
| H | S | 1.2 | M | 2.8 |
|---|---|---|---|---|
| (Dimensions not fully specified in source) | (Dimensions not fully specified in source) | (Dimensions not fully specified in source) | (Dimensions not fully specified in source) | (Dimensions not fully specified in source) |
Reliability
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solder ability test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration test | Inductance change: Within5% Without mechanical damage such as break | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within5% Without mechanical damage such as break | (1) Peak value: 100G (2) Duration of pulse: 11MS (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within5% Without mechanical damage such as break | (1) Repeat 100 cycles: (-552, 303 minutes) Room temperature, 5 minutes; (+1252, 303 minutes) Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under standard condition. |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 852 (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours. |
| Humidity Resistance | Inductance change: Within5% Without mechanical damage such as break | (1) Environment condition: 602, Humidity: 90~95% (2) Applied current: Rated current (3) Duration: 1000+4/-0 hours. |
| Low temperature life test | Inductance change: Within5% Without mechanical damage such as break | Store temperature -552 for total 1000+4/-0 hours. |
| High temperature life test | Inductance change: Within5% Without mechanical damage such as break | Store temperature +1252 for total 1000+4/-0 hours. |
Packaging - Tape Packaging Dimensions (mm)
| W | A0 | B0 | K0 | P | F | E | D0 | P0 | T |
|---|---|---|---|---|---|---|---|---|---|
| 8.0 0.10 | 2.8 0.05 | 2.35 0.05 | 1.35 0.05 | 4.0 0.10 | 3.5 0.1 | 1.75 0.10 | 1.50 0.10 | 4.0 0.10 | 0.25 0.05 |
Packaging - Reel Dimensions (mm)
| Item | Dimensions (mm) |
|---|---|
| A | 178.0 2.0 |
| B | 60.0 1.0 |
| C | 13.0 1.0 |
| D | 1.9 0.4 |
| W | 14.4 Max |
| W1 | 8.4 1.0 |
Packaging - Carton Dimensions
| Item | Quantity (PCS) |
|---|---|
| 1 Reel | 3000 |
| 1 Inner Box | 30000 |
| 1 Outer Box | 120000 |
Reflow Profile
1. Reflow Soldering Method
2. Soldering iron method: 3505 Max. 3 seconds.
2512051427_COILMX-MS252010-1R5M-W_C2858822.pdf
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