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quality Low Resistance SMD Power Inductor COILMX MPA4030S181M Suitable for DC DC Converters and Battery Devices factory
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quality Low Resistance SMD Power Inductor COILMX MPA4030S181M Suitable for DC DC Converters and Battery Devices factory
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Specifications
Current - Saturation (Isat):
480mA
Mfr. Part #:
MPA4030S181M
Package:
SMD,4x4mm
Key Attributes
Model Number: MPA4030S181M
Product Description

Product Overview

The MPA4030S181M is a SMD Power Inductor designed for high-performance applications. It features super low resistance and an ultra-high current rating, realized by a metal dust core. This inductor is suitable for use in low profile, high current power supplies, battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. It operates up to 1MHz and is ROHS compliant.

Product Attributes

  • Brand: SHENZHEN MOTTO TECHNOLOGY Co., Ltd
  • Model Number: MPA4030S181M
  • Certifications: IATF16949 / ISO9001 / ISO14000
  • Compliance: ROHS compliant
  • Core Material: Metal dust core
  • Marking: 181 on top of the body

Technical Specifications

Product Dimension (UNIT:mm) Specification Value
Dimensions A 4.00.2 4.00.2
B 4.00.2 4.00.2
C 3.0MAX 3.0MAX
D 2.10.2 2.10.2
Parameter Specification Condition Test Instruments
Inductance (L) 18020% H 1KHz/1.0V MICROTEST 6377
DC Resistance (DCR) 1.836 MAX At 25 TH2512A
Saturation Current (I sat) 0.48A TYP L0A* 70% 1KHz/1.0V MICROTEST 6377+6220
Current Rating (Irms) 0.40A TYP T40, 1KHz/1.0V MICROTEST 6377+6220
Characteristic Description
Ambient Temperature All test data is based on 25 ambient.
Saturation Current Definition DC current(A) that will cause an approximate T40.
Current Rating Definition DC current(A) that will cause L0 to drop approximately 10% Typ.
Operating Temperature Range -55~+125
Maximum Part Temperature The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Factors affecting part temperature include circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions. Part temperature should be verified in the actual application.
Application Description
Power Supplies Low profile, high current power supplies.
Battery Powered Devices Suitable for battery powered devices.
DC/DC Converters Used in distributed power systems and for field-programmable gate arrays.
Feature Description
Resistance Super low resistance.
Current Rating Ultra high current rating.
Performance High performance (I sat) realized by metal dust core.
Frequency Range Up to 1MHz.
Packaging Specification
Tape Packaging Dimensions (W) 8.00 0.30 mm
Tape Packaging Dimensions (A0) 1.9 0.10 mm
Tape Packaging Dimensions (B0) 2.3 0.10 mm
Tape Packaging Dimensions (K0) 1.2 0.10 mm
Tape Packaging Dimensions (E) 1.75 0.10 mm
Tape Packaging Dimensions (F) 3.5 0.05 mm
Tape Packaging Dimensions (P) 4.0 0.10 mm
Tape Packaging Dimensions (D0) 1.5 0.10 mm
Tape Packaging Dimensions (P0) 4.0 0.10 mm
Tape Packaging Dimensions (T) 0.18 0.03 mm
Reel Dimensions (A) 178 2.0 mm
Reel Dimensions (B) 58 1.0 mm
Reel Dimensions (C) 13.5 0.2 mm
Reel Dimensions (D) 9.0 1.5 mm
Carton Dimensions 1 reel/outer box
Quantity per Reel 2000 PCS
Reliability Test Specification
Solder Ability Test Terminals area must have 95% min solder coverage. Solder heat proof: Preheating: 16010 for 90 seconds; Retention time: 2455 for 20.5 seconds.
Vibration Test Inductance change: Within5% without mechanical damage. Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period. Vibration time: 2 hours in each of 3 mutual perpendicular directions. Amplitude: 1.5 mm Max.
Shock Test Inductance change: Within5% without mechanical damage. Peak value: 100G. Duration of pulse: 11ms. 3 times in each positive and negative direction of 3 mutual perpendicular directions.
Thermal Shock Inductance change: Within5% without mechanical damage. Repeat 100 cycles: (-552, 303 minutes) -> Room temperature, 5 minutes -> (+1252, 303 minutes) -> Room temperature, 5 minutes. Recovery: 48+4/-0 hours under standard conditions.
High Temperature Life Test Inductance change: Within5% without mechanical damage. Environment condition: 852. Applied current: Rated current. Duration: 1000+4/-0 hours.
Humidity Resistance Inductance change: Within5% without mechanical damage. Environment condition: 602, Humidity: 90~95%. Applied current: Rated current. Duration: 1000+4/-0 hours.
Low Temperature Life Test Inductance change: Within5% without mechanical damage. Store temperature: -552 for 1000+4/-0 hours.
High Temperature Storage Test Inductance change: Within5% without mechanical damage. Store temperature: +1252 for 1000+4/-0 hours.
Soldering Method Specification
Reflow Soldering Method Reflow Profile
Soldering Iron Method 3505 Max. 3 seconds.

2410121435_COILMX-MPA4030S181M_C429981.pdf

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