MS0530 Inductor Series

Product Overview

The MS0530 is a series of low-profile, high-current power inductors designed for various power supply and DC/DC converter applications. Its compact form factor makes it suitable for battery-powered devices, distributed power systems, and field-programmable gate array (FPGA) power solutions. The series offers a range of inductance values with precise specifications for DC current ratings, saturation current, and DC resistance, ensuring reliable performance in demanding electronic systems.

Product Attributes

• Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
• Website: http://www.coilmx.com
• Email: sales@mottotech.com

Technical Specifications

Applications

• Low profile, high current power supplies.
• Battery powered devices.
• DC/DC converters in distributed power systems.
• DC/DC converters for field programmable gate arrays (FPGAs).

Notes and Considerations

• All test data is referenced to 25 ambient.
• Irms: DC current (A) that will cause an approximate T of 40.
• Isat: DC current (A) that will cause L0 to drop approximately 30%.
• Operating temperature range: -55 to +125.
• The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Factors affecting part temperature include circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions. Part temperature should be verified in the end application.
• The rated current as listed is either the saturation current or the heating current depending on which value is lower.
• Storage time is within 6 months; storage conditions: temperature 5 ~ 40C, humidity below 10 ~ 75%RH.
• Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
• Preheating is required before soldering.
• The temperature difference between preheating temperature, soldering temperature, and chip temperature should be within 150C.
• Soldering correction after mounting should be within the conditions specified in the procurement specification.
• Overheating may lead to short circuits, performance degradation, or reduced lifespan.
• When assembling the printed circuit board with the mounted chip into the device, be careful not to apply residual stress to the chip due to overall deformation of the printed circuit or local deformation such as fastening parts.
• Devices generate heat (temperature rise) when energized, so allow sufficient margin in thermal design.
• For magnetic shielded types, pay attention to coil placement during substrate design.
• Electromagnetic interference may cause malfunction.
• Use an anti-static wrist strap as static electricity from the human body can be transferred to the ground line.
• Do not place this product near magnets or magnetic objects.
• Use within the range specified in the procurement specification.
• This product is intended for use in general electronic equipment under normal operating and usage conditions. For applications requiring high safety and reliability, or where device failure, malfunction, or poor operation may cause damage to life, body, or property, or have significant social impact (referred to as 'Specific Applications'), the company does not guarantee applicability, performance, or quality. Customers intending to use the product outside the scope, conditions, or in Specific Applications listed should consult with the company's relevant department beforehand.