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quality Low EMI Power Inductor cjiang FXLB252012-2R2-M Magnetically Shielded Powder Iron Core for Graphics Cards factory
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quality Low EMI Power Inductor cjiang FXLB252012-2R2-M Magnetically Shielded Powder Iron Core for Graphics Cards factory
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Specifications
Current - Saturation (Isat):
3.3A
Mfr. Part #:
FXLB252012-2R2-M
Package:
1008
Key Attributes
Model Number: FXLB252012-2R2-M
Product Description

Product Overview

The SZ CJIANG TECHNOLOGY CO.,LTD High Current, Power Inductors, FXLB252012-XXX-M series, are magnetically shielded power chokes designed for high current applications. Featuring a powder iron core material, these inductors offer low EMI and low core losses, making them suitable for demanding power management solutions. They operate up to a maximum total temperature of 125C and are RoHS compliant. Applications include Voltage Regulator Modules (VRM), multi-phase regulators, point-of-load modules, smartphone POL modules, SSD modules, notebook regulators, battery power systems, graphics cards, and data networking and storage systems.

Product Attributes

  • Brand: SZ CJIANG TECHNOLOGY CO.,LTD
  • Product Series: FXLB252012
  • Core Material: Powder iron
  • Shielding: Magnetically shielded
  • Certifications: Halogen Free, RoHS compliant
  • Packaging: Tape & Reel (3000 pieces/reel)

Technical Specifications

Part No. Inductance (L0) (µH) ±20 % DC Resistance (DCR) (mΩ) TYP. DC Resistance (DCR) (mΩ) MAX. Heating Rating Current (Idc) (A) TYP. Heating Rating Current (Idc) (A) MAX. Saturation Current (Isat) (A) TYP. Saturation Current (Isat) (A) MAX. Dimensions (mm)
FXLB252012-R33-M 0.33 14.0 19.0 6.0 5.1 8.5 7.6 2.7 x 2.2 x 1.2
FXLB252012-R47-M 0.47 17.0 21.0 6.1 5.5 7.3 6.7 2.7 x 2.2 x 1.2
FXLB252012-R68-M 0.68 25.0 30.0 5.5 5.0 6.3 6.0 2.7 x 2.2 x 1.2
FXLB252012-1R0-M 1.0 35.0 42.0 4.2 3.9 5.4 5.0 2.7 x 2.2 x 1.2
FXLB252012-1R5-M 1.5 53.0 61.0 3.6 3.2 3.6 3.4 2.7 x 2.2 x 1.2
FXLB252012-2R2-M 2.2 68.0 82.0 3.0 2.7 3.3 3.0 2.7 x 2.2 x 1.2
FXLB252012-3R3-M 3.3 110.0 135.0 2.1 1.8 2.8 2.5 2.7 x 2.2 x 1.2
FXLB252012-4R7-M 4.7 160.0 190.0 1.8 1.5 2.4 2.1 2.7 x 2.2 x 1.2

Notes:

  • All test data is referenced to 25 °C ambient.
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise).
  • Idc(A): DC current (A) that will cause an approximate ΔT of 40 °C (reference ambient temperature is 25 °C).
  • Isat(A): DC current (A) that will cause L0 to drop approximately 30 %.
  • The part temperature (ambient + temp rise) should not exceed 125 °C under worst-case operating conditions. Part temperature should be verified in the end application.

Environmental Data:

  • Storage temperature range: -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 compliant

Mechanical Reliability:

Item Specification and Requirement Test Method
Solderability The surface of terminal immersed shall be minimum of 95% covered with a new coating of solder -
Solder heat proof 1. Precondition: 8 hours steam aging
2. Retention time: 255 ±5 °C for 5 ±0.5 seconds
-
Vibration Inductance change: Within ±10%
Without mechanical damage such as break
1. Vibration frequency:(10 Hz to 2000 Hz)
2. Vibration time:Each four hours (12 times) in X, Y, Z direction: 12 hours in total
3. Amplitude: 1mm or 10 G
-
Shock Inductance change: Within ±10%
Without mechanical damage such as break
1. Peak value: 100 G
2. Duration of pulse: 6ms
3. Waveform: Half-sine Shocks; 3 times in X, Y, Z direction, 9 times in total
-

Endurance Reliability:

Item Specification and Requirement Test Method
Thermal Shock Inductance change: Within ±10%
Without distinct damage in appearance
1. Repeat 1000 cycles as follow: (-55 ±2 °C; 30 ±3 min) →(+125 ±2 °C, 30 ±3 min) changeover time of temperature: ≤10s
2. Recovery: 24 + 4 / -0 hours of recovery under the standard condition after the test.
-
High Temperature & Humidity Inductance change: Within ±10%
Without distinct damage in appearance
85°C, 85%RH, Duration: 240+4/-0 hours
-
Operational Life Inductance change: Within ±10%
Without distinct damage in appearance
1.Rated current ( Idc )
2.Environment condition: 85 °C
3.Duration: 1000 + 4 / -0 hours
-
Low Temperature Store Inductance change: Within ±10%
Without distinct damage in appearance
Store temperature: -55 ±2 °C, 1000 + 4 / -0 hours
-
High Temperature Store Inductance change: Within ±10%
Without distinct damage in appearance
Store temperature: +125 ±2 °C, 1000 + 4 / -0 hours
-

Tape Packaging Dimensions:

A0 B0 K0 t
2.35±0.05 2.80±0.05 1.35±0.05 0.25±0.05

Reel Dimensions:

  • Peel force of top cover tape: The peel speed shall be about 300mm/minute. The peel force of top cover tape shall be between 0.1 to 1.3 N.
  • Numbers of taping: 3000 pieces/reel.

2208121800_cjiang-FXLB252012-2R2-M_C3040393.pdf

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