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quality Wire wound chip common mode choke coil cjiang FDCW2012-2-481TF designed for in servers and power switch applications factory
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quality Wire wound chip common mode choke coil cjiang FDCW2012-2-481TF designed for in servers and power switch applications factory
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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
550mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Mfr. Part #:
FDCW2012-2-481TF
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number: FDCW2012-2-481TF
Product Description

Product Overview

The FDCW2012 series of wire wound chip common mode choke coils offers excellent noise suppression performance due to high common mode impedance at high frequencies. These coils are designed in a compact and low-profile 2.0*1.2*1.2 mm package, making them suitable for space-constrained applications. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant, ensuring environmental responsibility. Key applications include power switches, servers, telecommunication systems, USB communication, and panel links for LCD panels, effectively countering common mode noise in high-speed lines.

Product Attributes

  • Series Name: FDCW
  • Compliance: 100% Lead (Pb) & Halogen-Free, RoHS compliant
  • HSF Products (Hazardous Substance Free Products)

Technical Specifications

Part Number Common Mode Impedance (Z @100MHz) ( 25%) DCR (m) MAX Rated Current (IR) (mA) Rated Voltage (Vdc) Dimensions (mm) (L*W*H) Operating Temperature Range (C)
FDCW2012-2-300TF 30 200 450 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-500TF 50 250 550 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-750TF 75 250 400 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-900TF 90 300 400 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-121TF 120 300 400 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-161TF 160 350 350 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-181TF 180 350 350 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-201TF 200 350 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-221TF 220 350 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-251TF 250 400 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-261TF 260 400 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-301TF 300 400 290 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-361TF 360 400 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-371TF 370 450 280 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-481TF 480 550 200 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-501TF 500 550 200 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-601TF 600 550 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-671TF 670 600 180 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-681TF 680 700 180 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-751TF 750 800 150 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-801TF 800 1000 300 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-901TF 900 1000 100 50 2.0*1.2*1.2 -40 to +85
FDCW2012-2-102TF 1000 1000 100 50 2.0*1.2*1.2 -40 to +85
Dimension (mm) A B C D E
Value 2.000.20 1.200.20 1.200.20 0.5TYP 0.5TYP
Structure Component Material Name
Lid Ni-Zn Ferrite
Epoxy Epoxy resin
Wire Enameled copper wire
Core Ni-Zn Ferrite
Electrode structure Ag+Ni+Sn plating
Reliability Test Item Requirements Test Methods and Remarks
Operating life 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Reflow 2 times
2. temperature: 155 2
Resistance to Soldering Heat 1. No visible mechanical damage
2. Impedance change: Within20%
1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times.
2. Test board thickness: 1.5mm
3. Test board material: glass epoxy resin
4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.product showed no damage under microscope.
High Temperature 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature: 1252
2. Duration: 1000 hours
Steady damp-heat 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature:85
2. Humidity: 85% RH
3. Duration:1000 hours
Mechanical Vibration 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Frequency: 10HZ55HZ10HZ/Min Cycles
2. Amplitude: 1.5 mm
3. Directions: X,Y,Z
4. Time: 2 hours in each directions (total of 6 hours)
Thermal Shock 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature and time: -40for 303 min125for 303min
2. Transforming interval: Max. 3 Min
3. Tested cycle: 1000 cycles
Salt Spray 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Salt concentration: (5 1)% (mass percent)
2. pH value:6.5 - 7.2
3. temperature: 35 2
4. humidity: 85%
5. time: 24 hours
6. in normal temperature and humidity for 1 2 hours, testing inductance, the inductance value change can not be more than before test 10%.
Terminal strength No visible mechanical damage 1. The electrode of the inductor is soldered to the PCB, then apply a force in the direction of the arrow.
2. 5N force.
3. Keep time: 10(1)s
The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min.
Packaging Information Dimension (mm) Value
Tape Packaging Type W 8.00 0.10
Tape Packaging P1 P1 4.00 0.10
Tape Packaging A0 A0 1.50 0.10
Tape Packaging B0 B0 2.30 0.10
Tape Packaging K0 K0 1.45 0.10
Tape Packaging t t 0.20 0.05
Tape Packaging E E 1.75 0.10
Tape Packaging F F 3.50 0.10
Tape Packaging P2 P2 2.00 0.10
Tape Packaging D0 D0 1.55 0.05
Tape Packaging D1 D1 0.80 0.05
Tape Packaging P0 P0 4.00 0.10
Reel Inner box Quantity 5 Reel / box (10000 pcs)
Reel Carton box Quantity 10 Middle boxes, (100000 pcs)
Peel force of top cover tape Speed Approx. 300mm/minute
Peel force of top cover tape Force Between 10 to 100gf
Inner Box Dimensions A (mm) 188
Inner Box Dimensions B (mm) 195
Inner Box Dimensions C (mm) 67
Carton Packaging Dimensions L (mm) 390
Carton Packaging Dimensions W (mm) 350
Carton Packaging Dimensions H (mm) 215

2206081500_cjiang-FDCW2012-2-481TF_C3029265.pdf

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