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quality Noise suppression chip coil cjiang FDCW2012-2-251TF ideal for USB communication and LCD panel links factory
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quality Noise suppression chip coil cjiang FDCW2012-2-251TF ideal for USB communication and LCD panel links factory
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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
400mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Mfr. Part #:
FDCW2012-2-251TF
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number: FDCW2012-2-251TF
Product Description

Product Overview

The FDCW2012 series wire wound chip common mode choke coil offers excellent noise suppression performance due to its high common mode impedance at high frequencies. Designed for small size and low profile (2.0*1.2*1.2 mm), these coils are 100% Lead (Pb) & Halogen-Free and RoHS compliant. They are ideal for various applications including power switches, servers, telecommunication equipment, USB communication, and panel links for LCD panels, effectively countering common mode noise in high-speed lines.

Product Attributes

  • Series Name: FDCW
  • Compliance: 100% Lead (Pb) & Halogen-Free, RoHS compliant
  • HSF Products (Hazardous Substance Free Products)

Technical Specifications

Part Number Common Mode Impedance () @100MHz (25%) DCR (m) MAX IR (A) MIN Rated Voltage (Vdc)
FDCW2012-2-300TF 30 200 10 50
FDCW2012-2-500TF 50 250 10 50
FDCW2012-2-750TF 75 250 10 50
FDCW2012-2-900TF 90 300 10 50
FDCW2012-2-121TF 120 300 10 50
FDCW2012-2-161TF 160 350 10 50
FDCW2012-2-181TF 180 350 10 50
FDCW2012-2-201TF 200 350 10 50
FDCW2012-2-221TF 220 350 10 50
FDCW2012-2-251TF 250 400 10 50
FDCW2012-2-261TF 260 400 10 50
FDCW2012-2-301TF 300 400 10 50
FDCW2012-2-361TF 360 400 10 50
FDCW2012-2-371TF 370 450 10 50
FDCW2012-2-481TF 480 550 10 50
FDCW2012-2-501TF 500 550 10 50
FDCW2012-2-601TF 600 550 10 50
FDCW2012-2-671TF 670 600 10 50
FDCW2012-2-681TF 680 700 10 50
FDCW2012-2-751TF 750 800 10 50
FDCW2012-2-801TF 800 1000 10 50
FDCW2012-2-901TF 900 1000 10 50
FDCW2012-2-102TF 1000 1000 10 50
Dimension Unit:mm A B C D E
FDCW2012 Series 2.000.20 1.200.20 1.200.20 0.5TYP 0.5TYP
Structure and Components Part Name Material Name
Structure Lid Ni-Zn Ferrite
Epoxy Epoxy resin
Wire Enameled copper wire
Core Ni-Zn Ferrite
Electrode structure Ag+Ni+Sn plating
Operating Conditions Value
Ambient Temperature 25 C (for test data reference)
Operating Temperature Range -40 C to +85 C
Maximum Part Temperature 125 C (under worst case operating conditions, including ambient + temp rise)
Reliability Test Items Requirements Test Methods and Remarks
Operating life 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Reflow 2 times
2. Temperature: 155 2
Resistance to Soldering Heat 1. No visible mechanical damage
2. Impedance change: Within20%
1. Solder on PCB to Reflow test Peak Temp. 2605 510 secs, Cycles: 2 times. Re-flowing Profile: Please refer to Fig-1
2. Test board thickness: 1.5mm
3. Test board material: glass epoxy resin
4. Storage: standard atmospheric conditions for 1 hour before measurement. Product showed no damage under microscope.
High Temperature 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature: 1252
2. Duration: 1000 hours
3. Storage: standard atmospheric conditions for 1 hour before measurement.
Steady damp-heat 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature: 85
2. Humidity: 85% RH
3. Duration: 1000 hours
4. Storage: standard atmospheric conditions for 1 hour before measurement.
Mechanical Vibration 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Frequency: 10HZ55HZ10HZ/Min Cycles
2. Amplitude: 1.5 mm
3. Directions: X,Y,Z
4. Time: 2 hours in each direction (total of 6 hours)
Thermal Shock 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature and time: -40 for 303 min 125 for 303min, please refer to Fig-2
2. Transforming interval: Max. 3 Min
3. Tested cycle: 1000 cycles
4. Storage: standard atmospheric conditions for 1 hour before measurement.
Salt Spray 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Salt concentration: (5 1)% (mass percent)
2. pH value: 6.5 - 7.2
3. Temperature: 35 2
4. Humidity: 85%
5. Time: 24 hours
6. Inductance measurement after 1-2 hours in normal temperature and humidity: inductance value change cannot be more than 10% before test.
Terminal strength No visible mechanical damage 1. The electrode of the inductor is soldered to the PCB, to Fig-3 Then apply a force in the direction of the arrow.
2. 5N force.
3. Keep time: 10(1)s
The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min.
Packaging Information Type W P1 A0 B0 K0 t E F P2 D0 D1 P0
Tape Packaging Dimensions (Unit:mm) FDCW 2012 8.00 0.10 4.00 0.10 1.50 0.10 2.30 0.10 1.45 0.10 0.20 0.05 1.75 0.10 3.50 0.10 2.00 0.10 1.55 0.05 0.80 0.05 4.00 0.10
Packaging Information Type Standard Quantity Reel Inner box Carton box
Packaging Quantity FDCW2012 2000 pcs / reel 5Reel / box (10000 pcs) 10 Middle boxes, (100000 pcs)
Packaging Information Peel force of top cover tape
The peel speed shall be about 300mm/minute. The peel force of top cover tape shall be between 10 to 100gf.
Packaging Information Type A (mm) B (mm) C (mm)
Inner Box 188 195 67
Packaging Information Packaging Type L (mm) W (mm) H (mm)
Carton Packaging 390 350 215
Label Information Content
Reel Label Customer's part Number
Lot Number
Quantity
date code
Shipping Label Customer's part Number
Manufacturer's part Number
Quantity
date code

2206081500_cjiang-FDCW2012-2-251TF_C3029260.pdf

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