Product Overview
The FDCW2012 series wire wound chip common mode choke coil offers excellent noise suppression performance due to its high common mode impedance at high frequencies. These coils are designed for small size and low profile, measuring 2.0*1.2*1.2 mm. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant, making them suitable for a wide range of applications including power switches, servers, telecommunication, USB communication, and panel links for LCD panels, effectively countering common mode noise in high-speed lines.
Product Attributes
- Series Name: FDCW
- Compliance: 100% Lead (Pb) & Halogen-Free, RoHS compliant
- HSF Products: Yes (Hazardous Substance Free Products)
Technical Specifications
| Part Number | Common Mode Impedance () @100MHz (25%) | DCR (m) MAX | Rated Voltage (Vdc) | Rated Current (mA) MIN |
|---|---|---|---|---|
| FDCW2012-2-300TF | 30 | 200 | 10 | 50 |
| FDCW2012-2-500TF | 50 | 250 | 10 | 50 |
| FDCW2012-2-750TF | 75 | 250 | 10 | 50 |
| FDCW2012-2-900TF | 90 | 300 | 10 | 50 |
| FDCW2012-2-121TF | 120 | 300 | 10 | 50 |
| FDCW2012-2-161TF | 160 | 350 | 10 | 50 |
| FDCW2012-2-181TF | 180 | 350 | 10 | 50 |
| FDCW2012-2-201TF | 200 | 350 | 10 | 50 |
| FDCW2012-2-221TF | 220 | 350 | 10 | 50 |
| FDCW2012-2-251TF | 250 | 400 | 10 | 50 |
| FDCW2012-2-261TF | 260 | 400 | 10 | 50 |
| FDCW2012-2-301TF | 300 | 400 | 10 | 50 |
| FDCW2012-2-361TF | 360 | 400 | 10 | 50 |
| FDCW2012-2-371TF | 370 | 450 | 10 | 50 |
| FDCW2012-2-481TF | 480 | 550 | 10 | 50 |
| FDCW2012-2-501TF | 500 | 550 | 10 | 50 |
| FDCW2012-2-601TF | 600 | 550 | 10 | 50 |
| FDCW2012-2-671TF | 670 | 600 | 10 | 50 |
| FDCW2012-2-681TF | 680 | 700 | 10 | 50 |
| FDCW2012-2-751TF | 750 | 800 | 10 | 50 |
| FDCW2012-2-801TF | 800 | 1000 | 10 | 50 |
| FDCW2012-2-901TF | 900 | 1000 | 10 | 50 |
| FDCW2012-2-102TF | 1000 | 1000 | 10 | 50 |
| Dimensions (mm) | A | B | C | D (TYP) | E (TYP) |
|---|---|---|---|---|---|
| FDCW2012 Series | 2.00 0.20 | 1.20 0.20 | 1.20 0.20 | 0.5 | 0.5 |
| Structure and Components | Part Name | Material Name |
|---|---|---|
| Lid | Ni-Zn Ferrite | |
| Epoxy | Epoxy resin | |
| Wire | Enameled copper wire | |
| Core | Ni-Zn Ferrite | |
| Electrode structure | Ag+Ni+Sn plating |
| Reliability Test Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating life | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Reflow 2 times 2. Temperature: 155 2 |
| Resistance to Soldering Heat | 1. No visible mechanical damage 2. Impedance change: Within20% | 1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times. 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.product showed no damage under microscope. |
| High Temperature | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 1252 2. Duration: 1000 hours 3. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Steady damp-heat | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature:85 2. Humidity: 85% RH 3. Duration:1000 hours 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Mechanical Vibration | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each directions (total of 6 hours) |
| Thermal Shock | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature and time: -40for 303 min125for 303min 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Salt Spray | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Salt concentration: (5 1)% (mass percent) 2. pH value:6.5 - 7.2 3. temperature: 35 2 4. humidity: 85% 5. time: 24 hours 6. in normal temperature and humidity for 1 2 hours, testing inductance, the inductance value change can not be more than before test 10%. |
| Terminal strength | No visible mechanical damage | 1. The electrode of the inductor is soldered to the PCB, to Fig-3 Then apply a force in the direction of the arrow. 2. 5N force. 3. Keep time: 10(1)s The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min. |
| Packaging Information (Tape Packaging Dimensions) (Unit: mm) | W | P1 | A0 | B0 | K0 | t | E | F | P2 | D0 | D1 | P0 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| FDCW 2012 | 8.00 0.10 | 4.00 0.10 | 1.50 0.10 | 2.30 0.10 | 1.45 0.10 | 0.20 0.05 | 1.75 0.10 | 3.50 0.10 | 2.00 0.10 | 1.55 0.05 | 0.80 0.05 | 4.00 0.10 |
| Packaging Quantity | Standard Quantity | Reel | Inner box | Carton box |
|---|---|---|---|---|
| FDCW2012 | 2000 pcs / reel | 5Reel / box (10000 pcs) | 10 Middle boxes, (100000 pcs) |
| Peel force of top cover tape | Range |
|---|---|
| 10 to 100gf (Peel speed: approx. 300mm/minute) |
| Inner Box Dimensions (mm) | A | B | C |
|---|---|---|---|
| Type | 188 | 195 | 67 |
| Carton Packaging Dimensions (mm) | L | W | H |
|---|---|---|---|
| Type | 390 | 350 | 215 |
2206081500_cjiang-FDCW2012-2-601TF_C3029267.pdf
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