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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
550mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Mfr. Part #:
FDCW2012-2-501TF
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number:
FDCW2012-2-501TF
Product Description
Product Overview
The FDCW2012 series wire wound chip common mode choke coils offer excellent noise suppression performance with high common mode impedance at high frequencies. These coils are designed in a compact and low-profile 2.0*1.2*1.2 mm package. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant. Applications include power switches, servers, telecommunication systems, USB communication, LCD panel links, and countering common mode noise in high-speed lines.
Product Attributes
- Series Name: FDCW
- Compliance: 100% LeadPb& Halogen-Free, RoHS compliant
- Hazardous Substance Free Products (HSF Products)
Technical Specifications
| Part Number | Common Mode Impedance (@100MHz) ( 25%) | DCR (m) MAX | Rated Voltage (Vdc) | IR (mA) MIN |
|---|---|---|---|---|
| FDCW2012-2-300TF | 30 | 200 | 10 | 50 |
| FDCW2012-2-500TF | 50 | 250 | 10 | 50 |
| FDCW2012-2-750TF | 75 | 250 | 10 | 50 |
| FDCW2012-2-900TF | 90 | 300 | 10 | 50 |
| FDCW2012-2-121TF | 120 | 300 | 10 | 50 |
| FDCW2012-2-161TF | 160 | 350 | 10 | 50 |
| FDCW2012-2-181TF | 180 | 350 | 10 | 50 |
| FDCW2012-2-201TF | 200 | 350 | 10 | 50 |
| FDCW2012-2-221TF | 220 | 350 | 10 | 50 |
| FDCW2012-2-251TF | 250 | 400 | 10 | 50 |
| FDCW2012-2-261TF | 260 | 400 | 10 | 50 |
| FDCW2012-2-301TF | 300 | 400 | 10 | 50 |
| FDCW2012-2-361TF | 360 | 400 | 10 | 50 |
| FDCW2012-2-371TF | 370 | 450 | 10 | 50 |
| FDCW2012-2-481TF | 480 | 550 | 10 | 50 |
| FDCW2012-2-501TF | 500 | 550 | 10 | 50 |
| FDCW2012-2-601TF | 600 | 550 | 10 | 50 |
| FDCW2012-2-671TF | 670 | 600 | 10 | 50 |
| FDCW2012-2-681TF | 680 | 700 | 10 | 50 |
| FDCW2012-2-751TF | 750 | 800 | 10 | 50 |
| FDCW2012-2-801TF | 800 | 1000 | 10 | 50 |
| FDCW2012-2-901TF | 900 | 1000 | 10 | 50 |
| FDCW2012-2-102TF | 1000 | 1000 | 10 | 50 |
| Dimension | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) |
|---|---|---|---|---|---|
| Value | 2.000.20 | 1.200.20 | 1.200.20 | 0.5TYP | 0.5TYP |
| Structure and Components | Part Name | Material Name |
|---|---|---|
| Lid | Ni-Zn Ferrite | |
| Epoxy | Epoxy resin | |
| Wire | Enameled copper wire | |
| Core | Ni-Zn Ferrite | |
| Electrode structure | Ag+Ni+Sn plating |
| Operating Condition | Value |
|---|---|
| Operating temperature range | -40 C to +85 C |
| Maximum part temperature (ambient + temp rise) | 125 C |
| Packaging Information | Value |
|---|---|
| Tape Packaging Dimension W (mm) | 8.00 0.10 |
| Tape Packaging Dimension P1 (mm) | 4.00 0.10 |
| Tape Packaging Dimension A0 (mm) | 1.50 0.10 |
| Tape Packaging Dimension B0 (mm) | 2.30 0.10 |
| Tape Packaging Dimension K0 (mm) | 1.45 0.10 |
| Tape Packaging Dimension t (mm) | 0.20 0.05 |
| Tape Packaging Dimension E (mm) | 1.75 0.10 |
| Tape Packaging Dimension F (mm) | 3.50 0.10 |
| Tape Packaging Dimension P2 (mm) | 2.00 0.10 |
| Tape Packaging Dimension D0 (mm) | 1.55 0.05 |
| Tape Packaging Dimension D1 (mm) | 0.80 0.05 |
| Tape Packaging Dimension P0 (mm) | 4.00 0.10 |
| Reel Inner box Quantity | 5 Reel / box (10000 pcs) |
| Carton box Quantity | 10 Middle boxes (100000 pcs) |
| Peel force of top cover tape | 10 to 100gf |
| Peel speed of top cover tape | About 300mm/minute |
| Reliability Test Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating life | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Reflow 2 times 2. Temperature: 155 2 |
| Resistance to Soldering Heat | 1. No visible mechanical damage 2. Impedance change: Within20% | 1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times. 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. Storage: 1 hour at standard atmospheric conditions before measurement. |
| High Temperature | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 1252 2. Duration: 1000 hours 3. Storage: 1 hour at standard atmospheric conditions before measurement. |
| Steady damp-heat | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature:85 2. Humidity: 85% RH 3. Duration:1000 hours 4. Storage: 1 hour at standard atmospheric conditions before measurement. |
| Mechanical Vibration | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each direction (total of 6 hours) |
| Thermal Shock | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature and time: -40for 303 min125for 303min. 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles 4. Storage: 1 hour at standard atmospheric conditions before measurement. |
| Salt Spray | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Salt concentration: (5 1)% (mass percent) 2. pH value: 6.5 - 7.2 3. Temperature: 35 2 4. Humidity: 85% 5. Time: 24 hours 6. Inductance measurement after 1-2 hours in normal temperature and humidity. Inductance value change cannot be more than 10% before test. |
| Terminal strength | No visible mechanical damage | 1. Electrode soldered to PCB, apply force as per Fig-3. 2. Force: 5N. 3. Keep time: 10(1)s. 4. Test speed: 3 ~ 8mm/min. |
2206081500_cjiang-FDCW2012-2-501TF_C3029266.pdf
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