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Specifications
Voltage Rating:
100V
Capacitance:
680pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HHV0603R7681K101NTHJ
Package:
0603
Key Attributes
Model Number:
HHV0603R7681K101NTHJ
Product Description
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage in a given case size, high stability, and reliability. Applications include analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G, C0H), X7R
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specification (Size) | 0402 ~ 1812 |
| Description | High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R dielectrics with high reliability and excellent electrical performance. |
| Features | High voltage in a given case size; High stability and reliability. |
| Applications | Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters. |
| Temperature Coefficient/Characteristics (C0G) | Reference Temperature: 20C; Temperature Coefficient: 30 ppm/; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (C0H) | Reference Temperature: 20C; Temperature Coefficient: 60 ppm/; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (X7R) | Reference Temperature: 20C; Temperature Coefficient: 15%; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (X7S) | Reference Temperature: 20C; Temperature Coefficient: 22%; Operating Temperature Range: -55125 |
| External Dimensions (Example: 0402) | Length: 1.000.05mm, Width: 0.500.05mm, Thickness: 0.500.05mm |
| External Dimensions (Example: 0603) | Length: 1.600.20mm, Width: 0.800.20mm, Thickness: 0.800.20mm |
| External Dimensions (Example: 0805) | Length: 2.000.20mm, Width: 1.250.20mm, Thickness: 0.700.10mm or 0.800.20mm |
| External Dimensions (Example: 1206) | Length: 3.200.20mm, Width: 1.600.20mm, Thickness: 0.800.20mm |
| External Dimensions (Example: 1210) | Length: 3.200.30mm, Width: 2.500.20mm, Thickness: 1.250.20mm |
| External Dimensions (Example: 1808) | Length: 4.50.40mm, Width: 2.00.25mm, Thickness: 1.250.20mm |
| External Dimensions (Example: 1812) | Length: 4.50.40mm, Width: 3.20.30mm, Thickness: 1.250.20mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0402, 0.500.05mm Thickness) | Paper tape: 10,000 pcs |
| Packaging Standard Quantity (Example: 0603, 0.800.20mm Thickness) | Paper tape: 4000 pcs |
| Packaging Standard Quantity (Example: 0805, 0.700.10mm Thickness) | Paper tape: 4000 pcs |
| Packaging Standard Quantity (Example: 1206, 1.600.20mm Thickness) | Paper tape: 2000 pcs |
| Packaging Standard Quantity (Example: 1210, 2.500.30mm Thickness) | Plastic Tape: 1000 pcs |
| Packaging Standard Quantity (Example: 1812, 2.500.30mm Thickness) | Plastic Tape: 500 pcs |
| Reliability Test: Appearance | No remarkable defects or abnormalities. |
| Reliability Test: Capacitance (Class I C0G/C0H) | Within specified tolerance. Test temp: 253; Test freq: 1MHz10% (C1000pF), 1KHz10% (C>1000pF); Voltage: 1.00.2Vrms. |
| Reliability Test: Capacitance (Class II X7R) | Within specified tolerance. Test temp: 253; Test freq: 1KHz10% (C10F), 12024 Hz (C>10F); Voltage: 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F). |
| Reliability Test: Dissipation Factor (DF, tan) (Class I C0G/C0H) | 0.56% (Cr<5pF, 1MHz), 1.5[(150/Cr)+7]10-4 (5pFCr<50pF, 1MHz), 0.15% (50pFCr1000pF, 1MHz), 0.15% (>1000pF, 1KHz). |
| Reliability Test: Dissipation Factor (DF, tan) (Class II X7R) | 2.5% (Test temp: 253; Test freq: 1KHz10% or 12024 Hz; Voltage: 1.00.2Vrms or 0.50.1Vrms). |
| Reliability Test: Insulation Resistance (IR) (Class I C0G/C0H) | C10 nF: Ri50000M; C>10 nF: RiCR500S. Test voltage: Rated Voltage (Max 500V); Duration: 605s; Temp: 253; Humidity: 75%. |
| Reliability Test: Insulation Resistance (IR) (Class II X7R) | C25 nF: Ri10000M; C>25 nF: RiCR>100S. |
| Reliability Test: Dielectric Withstanding Voltage (DWV) | No breakdown or damage. Applied voltage: 200% Vr (100VVr<500V), 150% Vr (500VVr1000V), 120% Vr (1000V |
| Reliability Test: Solderability | 95% tinning rate, no visible damage. Lead-free solder temp: 2455, duration: 20.5s. |
| Reliability Test: Termination Adhesion | No visible damage. Applied Force: 5N (0402-0805), 10N (1206). Duration: 101s. |
| Reliability Test: Resistance to Soldering Heat | Electrical performance and appearance requirements met. Preheating 100-200 for 20.5min. Solder temp 2655 for 101s. Recovery 242h. |
| Reliability Test: Resistance to Flexure of Substrate (Bending Strength) | C/C 10%; Appearance: No visible damage. Test Board thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s. |
| Reliability Test: Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF (whichever is larger); Class II 10%. DF 2x initial. IR: Class I 2500M or RiCR25S (whichever is smaller); Class II 1000M or RiCR25S (whichever is smaller). Temp: 402; Humidity: 90%~95%RH; Duration: 500h. Recovery: 242h. |
| Reliability Test: Temperature Cycle | C/C: Class I 1% or 1pF (whichever is larger); Class II 10%. 5 cycles: -55 (30min), +20 (2-3min), +125 (30min), +20 (2-3min). Recovery: 242h. |
| Reliability Test: Durability | C/C: Class I 2% or 1pF (whichever is larger); Class II 20%. Applied Voltage: 2x Vr (<500V), 1.5x Vr (500VVr1000V), 1.2x Vr (>1000V). Temp: 125; Duration: 1000h. Recovery: 242h. DF 2x initial. IR: Class I 4000M or RiCR40S (whichever is smaller); Class II 2000M or RiCR50S (whichever is smaller). |
| Storage Method | Guaranteed solderability period: 6 months. Storage Temperature: 5~40; Relative Humidity: 20%~70%. |
| Soldering Profile (Reflow) | Refer to provided temperature profile graphs for SnPb and Lead-free. T 150 (0603/0805/1206), T 130 (1210/1808/1812). |
| Soldering Profile (Wave) | Refer to provided temperature profile graph. T 150 (0603/0805/1206). |
| Soldering Profile (Hand) | Preheating T130; Soldering iron temp: Max 350; Power: Max 20W; Diameter: 1mm recommended; Duration: Max 3s; Solder paste: 1/2 chip thickness. Avoid direct contact with ceramic. |
2410121646_Chinocera-HHV0603R7681K101NTHJ_C5186721.pdf
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