Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General Information | Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) | |
| Specification Range | 0201 ~ 1210 Size | |
| Product Features | Size Range | 0201 to 1210 |
| Capacity | High capacity and small size achievable | |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication industry | |
| Ordering Information | Series Code | HGC |
| Size (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | |
| Dielectric Material Codes | R5 (X5R), R7 (X7R), G0 (C0G) | |
| Capacitance Code Example | 104 = 100nF, 105 = 1F, 106 = 10F | |
| Tolerance Code Example | J (5%), K (10%), M (20%) | |
| Rated Voltage Code Example | 500 (50 Vdc), 101 (100 Vdc), 631 (630 Vdc) | |
| Temperature Coefficient/Characteristics | Dielectric | C0G, C0H, X7R, X5R, X7S, X6S |
| Operating Temperature Range | -55 to 125 (varies by dielectric) | |
| Temperature Coefficient | 30 ppm/ (C0G), 15% (X7R), 15% (X5R), 22% (X7S), 22% (X6S) | |
| External Dimensions | Size (Inch/mm) | 0201 (0603) to 1210 (3225) |
| Length (L) | 0.60mm to 3.20mm (varies by size) | |
| Width (W) | 0.30mm to 2.50mm (varies by size) | |
| Thickness (T) | 0.30mm to 2.50mm (varies by size and thickness code) | |
| Terminal Width (MB) | 0.15mm to 0.75mm (varies by size) | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging Standard Quantity | Packaging Types | Paper tape, Plastic tape, 7" reel |
| Quantity per Reel | 1,000 to 15,000 pieces (varies by size and packaging) | |
| Capacitance Range and Rated Voltage | Dielectric | C0G, C0H, X7R, X5R, X7S, X6S |
| Size | 0201 to 1210 | |
| Rated Voltage (VDC) | 4V to 630V (varies by dielectric and size) | |
| Capacitance | 0.3pF to 220F (varies by dielectric, size, and voltage) | |
| Reliability Test | Appearance & Electrical Performance | No defects, within size range, capacitance, DF, IR within specified tolerances. |
| Insulation Resistance (IR) | 50000M (Class I, C10nF), RiCR500S (Class I, C>10nF), 10000M (Class II, C25nF), RiCR>100S (Class II, C>25nF) | |
| Dielectric Withstanding Voltage (DWV) | 300% of rated voltage (Class I), 250% of rated voltage (Class II) | |
| Solderability | 95% tinning rate, no visible damage. | |
| Termination Adhesion | No visible damage, tested with applied force (2N to 10N). | |
| Resistance to Soldering Heat | C/C within 0.5% (Class I) or -5%~+10% (Class II), DF and IR within initial standards. | |
| Resistance to Flexure of Substrate | C/C 10%, no visible damage. | |
| Moisture Resistance (Steady State) | C/C 2% or 1pF (Class I), 10% (Class II). DF 2x initial, IR 2500M or RiCR25S (Class I), 1000M or RiCR25S (Class II). | |
| Temperature Cycle | C/C 1% or 1pF (Class I), 10% (Class II). Tested over 5 cycles from -55 to +125 (or lower for specific dielectrics). | |
| Durability | C/C 2% or 1pF (Class I), 20% (Class II). DF 2x initial, IR 4000M or RiCR40S (Class I), 2000M or RiCR50S (Class II). Tested at 1.5x rated voltage for 1000 hours. | |
| Tape Dimensions (Paper & Embossed) | Specific dimensions for 0201 to 1210 sizes, including A, B, W, F, E, P1, P2, P0, D0, T codes. | |
| Reel Dimensions | 7" and 13" reels available with specified dimensions (A, B, C, D, E, F, G). | |
| Tape Peeling Strength | 0.1N < peeling strength < 0.7N for both paper and embossed tape. | |
| Storage Methods | Temperature: 5~40, Relative Humidity: 20%~70%. Guaranteed solderability for 6 months. | |
| Precautions For Use | Soldering Conditions | Follow recommended temperature profiles (Reflow, Wave, Hand soldering) to avoid cracking or explosion. Minimize temperature differential (T). |
| Manual Soldering | Handle with care to avoid thermal shock and damage to the ceramic body. Use appropriate soldering iron tip and temperature control. | |
| Solder Amount | Use optimum solder amount for reflow and wave soldering to ensure proper connection and prevent damage. |
2410121645_Chinocera-HGC0603R7221K500NTHJ_C482474.pdf
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