Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose series capacitors (4V~63V) are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions, making them ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Series: General Purpose Series (4V~63V)
- Origin: Suining Hongming Huaci Technology Co., Ltd.
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Section | Details | ||||||||||||||||||||||||||||||||||||||||||
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| Part Name | MULTILAYER CERAMIC CAPACITORS | ||||||||||||||||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | ||||||||||||||||||||||||||||||||||||||||||
| Specification (Size) | 0201 ~ 1210 | ||||||||||||||||||||||||||||||||||||||||||
| Applications | General digital circuit, Power supply bypass, Consumer electronics, Telecommunication | ||||||||||||||||||||||||||||||||||||||||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | ||||||||||||||||||||||||||||||||||||||||||
| Dielectric Characteristics |
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| External Dimensions |
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| Packaging Standard Quantity |
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| Capacitance Range and Rated Voltage | (Refer to detailed tables in original document for specific combinations of dielectric, size, and voltage) | ||||||||||||||||||||||||||||||||||||||||||
| Reliability Test - Appearance and Electrical Performance |
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| Storage Methods | Guaranteed solderability period: 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | ||||||||||||||||||||||||||||||||||||||||||
| Precautions For Use | MLCCs may fail in short or open circuits. Severe conditions can lead to burn out, flaming, or explosion. Adhere to specifications and contact technical department for unclear matters. Avoid sudden temperature changes during soldering. Manual soldering requires careful operation, tip selection, and temperature control. Ensure optimum solder amount for reflow and wave soldering to avoid chip damage or poor connection. Follow recommended soldering temperature profiles. Avoid direct contact between soldering iron tip and ceramic components. | ||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph | |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. (Note: Product characteristics are for reference only.) |
2410121645_Chinocera-HGC0805R7822K500NTHJ_C5186817.pdf
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