Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectrics, offering superior electrical performance and high reliability. They are suitable for a range of mid-to-high voltage applications, from 100V to 3000V, and are available in case sizes from 0402 to 1812. Key features include high voltage capability in a given case size, high stability, and reliability. Applications include analog and digital modems, LAN/WAN interface circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Termination Types: Cu/Ni/Sn
Technical Specifications
| Specification | Details | ||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Series | Mid-High Volts Series (100V~3000V) | ||||||||||||||||||||||||||||||||
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) | ||||||||||||||||||||||||||||||||
| Rated Voltages (Vdc) | 100, 200, 250, 500, 630, 1000, 1500, 2000, 2500, 3000 | ||||||||||||||||||||||||||||||||
| Capacitance Range (pF to F) | 0R5 (0.5pF) to 105 (1F) and beyond (e.g., 104 (100nF), 475 (4.7F) for X7R) | ||||||||||||||||||||||||||||||||
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% | ||||||||||||||||||||||||||||||||
| Temperature Coefficients |
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| Operating Temperature Range | -55 to 125 | ||||||||||||||||||||||||||||||||
| Packaging Options | Paper taping, Embossed taping, Bulk | ||||||||||||||||||||||||||||||||
| Reel Sizes | 7 Inch, 13 Inch | ||||||||||||||||||||||||||||||||
| Soldering Methods | Reflow Soldering, Wave Soldering | ||||||||||||||||||||||||||||||||
| External Dimensions (mm) |
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| Reliability Tests | Appearance, Dimension, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. | ||||||||||||||||||||||||||||||||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | ||||||||||||||||||||||||||||||||
| Guaranteed Solderability Period | 6 months (Under deliver package condition) |
2410121646_Chinocera-HHV1206R7223K501NSLJ_C5186841.pdf
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