Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency surface mount technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small form factors. Key applications include general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Series: General Purpose Series (4V~63V)
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |
| Series | General Purpose Series (4V~63V) | |
| Available Sizes | 0201 ~ 1210 | |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S | |
| Applications | General digital circuit, Power supply bypass, Consumer electronics, Telecommunication | |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | Refer to 'HOW TO ORDER' section for detailed codes. |
| Temperature Coefficient/Characteristics |
| |
| External Dimensions (mm) | Size 0201 (0603) | L: 0.600.03, W: 0.300.03, T: 0.300.03 |
| Size 0402 (1005) | L: 1.000.05, W: 0.500.05, T: 0.500.05 | |
| Size 0603 (1608) | L: 1.600.20, W: 0.800.20, T: 0.800.20 | |
| Size 0805 (2012) | L: 2.000.20, W: 1.250.20, T: 0.700.10 | |
| Size 1206 (3216) | L: 3.200.20, W: 1.600.20, T: 0.700.10 | |
| Size 1210 (3225) | L: 3.200.30, W: 2.500.30, T: 1.250.20 | |
| Soldering Method | R=Reflow Soldering, W=Wave Soldering | |
| Packaging Standard Quantity | Size 0201 (0.30mm T) | Paper tape: 15,000 |
| Size 0402 (0.50mm T) | Paper tape: 10,000 | |
| Size 0603 (0.80mm T) | Paper tape: 4000 | |
| Size 0805 (0.70mm T) | Paper tape: 4000 | |
| Size 1210 (1.25mm T) | Embossed tape (7" reel): 2000 | |
| Refer to sections 8-1 to 8-5 for detailed Capacitance Range and Rating Voltage for each dielectric type and size. | ||
| Refer to sections 9-1 and 9-2 for Reliability Test details. | ||
| Refer to sections 10-1 to 10-4 for Packaging details (Taping structures, Reel Dimensions). | ||
| Storage Methods | Guaranteed solderability period: 6 months (under delivered package condition). Storage Temperature: 5~40, Relative Humidity: 20%~70%. | |
| Precautions for Use | MLCCs may fail in short or open circuits. Severe conditions beyond ratings can cause fire, burning, or explosion. Follow specified precautions and consult technical department for unclear issues. Avoid sudden temperature changes during soldering to prevent cracking or explosion. Manual soldering requires careful operation, tip selection, and temperature control. Ensure optimal solder amount for reflow and wave soldering. | |
| Soldering Profile | Refer to provided temperature profile charts for Reflow Soldering (Lead-free and SnPb) and Wave Soldering. For preheating, minimize temperature differential (T) between soldering temperature and component surface (T150 for most sizes, T130 for HGC1210). Hand soldering conditions: Preheating 130, Max 350, Max 20W, recommended tip diameter 1mm, max soldering time 3s, solder paste amount 1/2 chip thickness. Avoid direct contact of soldering iron tip with ceramic component. | |
| Typical Characteristic Data | |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. (Note: These characteristics are for reference only.) | |
2410121645_Chinocera-HGC0805G01R0C500NTGJ_C5186733.pdf
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