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Specifications
Voltage Rating:
16V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
HGC0805R5226M160NSLJ
Package:
0805
Key Attributes
Model Number:
HGC0805R5226M160NSLJ
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Name | MULTILAYER CERAMIC CAPACITORS | |||||||||||
| Series | General Purpose Series (4V~63V) | |||||||||||
| Specification (Size) | 0201 ~ 1210 | |||||||||||
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |||||||||||
| Issue Date | 20201116 | |||||||||||
| Version | HC202002 | |||||||||||
| General Info | Suitability | High density and high efficiency SMT application | ||||||||||
| Material Options | NP0(C0G/C0H)/X7R/X5R/X7S/X6S | |||||||||||
| Key Characteristics | High reliability and excellent electrical performance | |||||||||||
| Features | Wide selection of sizes (0201 to 1210), High capacity and small size | |||||||||||
| Applications | General digital circuit | |||||||||||
| Power supply bypass capacitors | ||||||||||||
| Consumer electronics | ||||||||||||
| Telecommunication | ||||||||||||
| General purpose applications | ||||||||||||
| How to Order (Model Representation) | Series Code | HGC | ||||||||||
| Size (inch/mm) | 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225) | |||||||||||
| Dielectric | R5=X5R, R7=X7R, G0=C0G | |||||||||||
| Capacitance | e.g., 104=100nF, 105=1F, 106=10F | |||||||||||
| Tolerance | e.g., J=5%, K=10%, M=20% | |||||||||||
| Rated Voltage (Vdc) | e.g., 4R0=4V, 100=10V, 500=50V, 101=100V | |||||||||||
| Termination Type | N=Cu/Ni/Sn | |||||||||||
| Packaging | T=Paper taping, B=Bulk, S=Embossed taping | |||||||||||
| Thickness (mm)/Code | e.g., A=0.1mm, C=0.3mm, H=0.8mm, P=1.6mm | |||||||||||
| Reel Size | J=7Inch, D=13Inch | |||||||||||
| (Thickness Code for Packaging) | e.g., C for 0.3mm, E for 0.5mm, H for 0.8mm, L for 1.25mm, P for 1.6mm | |||||||||||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temp. | Temp. Coefficient | Operating Temp. Range | ||||||||
| C0G | 20C | 0 30 ppm/ | -55125 | |||||||||
| C0H | 20C | 0 60 ppm/ | -55125 | |||||||||
| X7R | 20C | 15% | -55125 | |||||||||
| X5R | 20C | 15% | -5585 | |||||||||
| X7S | 20C | 22% | -55125 | |||||||||
| X6S | 20C | 22% | -55105 | |||||||||
| External Dimensions & Structure | Product Peripheral Dimension | Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm)/Code | Soldering Method | Terminal Width MB (mm) | |||||
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 C | R | 0.150.05 | |||||||
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 E(C105) | R | 0.250.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 H | R / W | 0.400.15 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 G | R / W | 0.500.20 | |||||||
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 G | R / W | 0.600.20 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 L | R | 0.750.25 | |||||||
| Packaging Standard Quantity | Size | Thickness (mm)/Symbol | Paper Tape (7" reel) | Plastic Tape (7" reel) | ||||||||
| 0201 (0603) | 0.300.03 C | 15,000 | - | |||||||||
| 0402 (1005) | 0.500.05 E(C105) | 10,000 | - | |||||||||
| 0603 (1608) | 0.800.20 H | 4000 | - | |||||||||
| 0805 (2012) | 0.700.10 G | 4000 | - | |||||||||
| 1206 (3216) | 0.700.10 G | 4000 | - | |||||||||
| 1210 (3225) | 1.250.20 L | - | 2000 | |||||||||
| Capacitance Range and Rated Voltage | Dielectric | Size | Rated Voltage (VDC) | |||||||||
| C0G, C0H | 0201 | 16, 25, 50 | ||||||||||
| X6S | 0402 | 6.3, 10, 16, 25 | ||||||||||
| Reliability Test - Appearance and Electrical Performance Test | No. | Item | Technical Requirements | Test Method and Remarks | ||||||||
| 1 | Appearance | No remarkable defects or abnormalities. | Through microscope (10) | |||||||||
| 2 | Size | Within the specified size range | Using a vernier caliper | |||||||||
| 3 | Capacitance | Should be within the specified tolerance. | Test Temp: 253. Conditions vary by Class (I/II) and capacitance value. | |||||||||
| 4 | Dissipation Factor (DF, tan) | Specifications vary by Class (I/II), voltage, and capacitance. | Test Temp: 253. Conditions vary by Class (I/II) and capacitance value. | |||||||||
| Reliability Test - Electrical Tests | No. | Item | Technical Requirements | Test Method and Remarks | ||||||||
| 5 | Insulation Resistance (IR) | Specifications vary by Class (I/II) and capacitance. | Test Temp: 253, Humidity: 75%. Measuring Voltage: Rated Voltage. Duration: 605s. | |||||||||
| 6 | Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: 300% Rated Voltage (Class I), 250% Rated Voltage (Class II). Duration: 1~5s. | |||||||||
| 7 | Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. | Leaded Solder: 2355, 20.5s. Lead-free Solder: 2455, 20.5s. Preheating: 80-120, 10-30s. | |||||||||
| 8 | Termination Adhesion | No visible damage. | Applied Force: 2N (0201), 5N (0402-0805), 10N (1206). Time: 101s. | |||||||||
| 9 | Resistance to Soldering Heat | C/C, DF, IR within limits. No visible damage. 95% solder coverage. | Preheating (Class II): 100-200, 20.5min. Solder Temp: 2655, Duration: 101s. Recovery: 242h. (1210 and above: Reflow Soldering) | |||||||||
| 10 | Resistance to Flexure of Substrate (Bending Strength) | C/C 10%. No visible damage. | Test Board: PCB, Thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s. | |||||||||
| 11 | Moisture Resistance (Steady State) | C/C, DF, IR within limits. No visible damage. | Temp: 402, Humidity: 90%-95%RH, Duration: 500h. Recovery: 242h. | |||||||||
| 12 | Temperature Cycle | C/C within limits. | 5 cycles. Temp range: -55 to +125 (or lower for X5R/X6S). Recovery: 242h. | |||||||||
| 13 | Durability | C/C, DF, IR within limits. No visible damage. | Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 125 (or lower for X5R/X6S). Recovery: 242h. | |||||||||
| Packaging | Paper Taping Dimensions | Size | A | B | W | F* | E | P1 | P0 | D0 | T | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 | |||
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 | |||
| Embossed Taping Dimensions | Size | Tapesize | A | B | C | D* | E | F | G* | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| Reel Dimensions | Reel Size Code | A | B | C | D | E | F | G | ||||
| 8mm/7REEL | 1782.0 | 3.0 | 130.5 | 210.8 | 50 or more | 10.01.5 | 14.4max | |||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.8 | 50 or more | 10.01.5 | 14.4max | |||||
| Taping Specification | Type | Top tape peeling strength | Peeling direction | Paper dirty remains | ||||||||
| Paper Taping | 0.1N < peeling strength < 0.7N | 0~15 | None | |||||||||
| Embossed Taping | 0.1N < peeling strength < 0.7N | 0~15 | None | |||||||||
| Storage Methods | Guaranteed period for solderability is 6 months (Under deliver package condition). | |||||||||||
| Storage Conditions | Temperature | Relative Humidity | ||||||||||
| 5~40 | 20%~70% | |||||||||||
| Precautions For Use | MLCCs may fail in short circuit or open circuit. Under severe conditions beyond ratings, capacitors may burn out, flame, or explode. Follow safety precautions and application notes. Contact technical department for any unclear points. | |||||||||||
| Soldering Profile | Follow temperature profile charts to avoid chip cracking or local explosion due to sudden temperature changes. (Refer to graphs in enclosure page). | |||||||||||
| Manual Soldering | Handle soldering iron carefully to avoid thermal shock, cracks, or damage to the capacitor. Pay attention to tip selection and temperature control. Avoid direct contact of soldering iron tip with ceramic body. | |||||||||||
| Optimum Solder Amount | Ensure optimal solder amount for reflow and wave soldering to prevent chip damage or poor connection. | |||||||||||
| Recommended Soldering Temperature Profile | Refer to provided graphs for SnPb and Lead-free Reflow Soldering, and Wave Soldering profiles. Preheating temperature differential (T) should be minimized (e.g., T150 for HGC0201-HGC1206). | |||||||||||
| Hand Soldering Conditions | Preheating T 130. Iron tip temp: Max 350. Power: Max 20W. Tip diameter: Recommended 1mm. Soldering time: Max 3s. Solder paste: 1/2 chip thickness. Avoid direct contact with ceramic components. | |||||||||||
| Typical Characteristic Data Graph | Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics. (Note: Characteristics are for reference only). | |||||||||||
2410121534_Chinocera-HGC0805R5226M160NSLJ_C33546008.pdf
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